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Cu-W-Ni copper matrix composite used for liner, electroforming method and electroforming solution thereof

A copper-based composite material and composite material technology, applied in the field of Cu-W-Ni copper-based composite material and its electroforming method and electroforming solution, can solve the problem of patent application and Authorization, no public literature reports, etc.

Inactive Publication Date: 2010-07-28
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are reports on relevant patents and their applications at home and abroad for the preparation of pure copper and pure nickel drug-molds by electroforming technology; public literature reports

Method used

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  • Cu-W-Ni copper matrix composite used for liner, electroforming method and electroforming solution thereof
  • Cu-W-Ni copper matrix composite used for liner, electroforming method and electroforming solution thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0023] Electroforming solution preparation: according to the volume of the electroforming tank, multiply the volume by NiSO 4 ·7H 2 O; Na 2 WO 4 2H 2 O; CuSO 4 ·5H 2 O; CuCl 2 2H 2 O; Na 3 C 6 h 5 o 7 ·H 2 O; C 12 h 25 SO 4 Na; saccharin; 1,4-butynediol concentrations to obtain the required drug weight and volume respectively, and then add the required deionized water to the electroforming tank and heat to 50-70°C. Na first 2 WO 4 2H 2 O was dissolved in deionized water, followed by the addition of Na 3 C 6 h 5 o 7 ·H 2 O; C 12 h 25 SO 4 Na, and stirred for a while, and then added NiSO 4 ·7H 2 O, CuSO 4 ·5H 2 O and CuCl 2 2H 2 O. Finally, saccharin and 1,4-butynediol were respectively added into the electroforming tank, and the temperature was kept constant and fully stirred.

[0024] Pretreatment of cathode and anode materials: the cathode mandrel used is aluminum mandrel, polished with sandpaper before use, rinsed with deionized water, put in...

Embodiment 2

[0028] Prepare the electroforming liquid for preparing Cu-W-Ni copper-based composite material in the electroforming tank, and its composition is:

[0029] NiSO 4 ·7H 2 O: 210g / L; Na 2 WO 4 2H 2 O: 80g / L; CuSO 4 ·5H 2 O: 6g / L; CuCl 2 2H 2 O: 1.5g / L; Na 3 C 6 h 5 o 7 ·H 2 O: 290g / L; C 12 h 25 SO 4 Na: 0.4g / L; Saccharin: 1.0-1.5g / L; 1,4-Butynediol: 0.25-1mL / L.

[0030]The anode material is domestic phosphor copper plate (Cu is 99.9%, P is 0.02-0.06%), and a metal copper plate with a thickness of 1mm is used as the cathode;

[0031] The process conditions are: pH=6.0; temperature 55°C; current density=15A / dm 2 ; Stirring method: mechanical stirring; electroforming time: 2-4h.

[0032] In the obtained Cu-W-Ni copper-based composite material, the copper content is 85.6% (percentage by weight), the nickel content is 8.4%, and the tungsten content is 6%, and the material structure is evenly distributed, and the crystal grains are ultrafine. See figure 1 and figur...

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PUM

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Abstract

The invention discloses a Cu-W-Ni copper matrix composite used for a liner, an electroforming method and an electroforming solution thereof, belonging to the electroforming field. The electroforming solution comprises the following components by proportion: 200-250g / L of NiSO4.7H2O, 60-90g / L of Na2WO4.2H2O, 6-10g / L of CuSO4.5H2O, 1-3g / L of CuCl2.2H2O, 270-320g / L of Na3C6H5O7.H2O, 0.3-0.5g / L of C12H25SO4Na, 1.0-1.5g / L of saccharin and 0.25-1mL / L of 1,4-butynediol. The electroforming condition comprises: the pH value of 10% of dilute sulphuric acid is regulated at 5.5-7.0, the temperature is 50-70 DEG C, the current density is 5-15A / dm2, the mechanical stirring is adopted, and a phosphorus-copper plate with 99.9% of Cu and 0.02-0.06% of P is used as an anode. The Cu-W-Ni copper matrix composite prepared in the invention has fine grains and homogeneous structure, and the Cu-W-Ni copper matrix composite liner is easily thickened through electroforming and has no defect on the surface and stable process.

Description

technical field [0001] The invention belongs to the field of electroforming preparation, and in particular relates to a Cu-W-Ni copper-based composite material for a drug-type cover, an electroforming method and an electroforming liquid. Background technique [0002] There is a great defect in the single-metal liner, that is, to increase the length of the jet, the velocity gradient of the jet must be increased, and it is difficult to solve the huge increase of the jet velocity gradient with a single-metal liner. If heavy metal tungsten is used as the drug-type cover material, although the density is increased, it also greatly increases the manufacturing difficulty and cost. [0003] So far, there are three main methods for processing composite drug-type covers in various countries: powder metallurgy, spinning forming technology and electroforming. Compared with the traditional powder metallurgy and spinning forming process, the grains of the electroforming cover are much sm...

Claims

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Application Information

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IPC IPC(8): C25D1/00C25D3/16C22C9/06F42B12/74
Inventor 何捍卫贾守亚
Owner CENT SOUTH UNIV
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