Tin consolidating material and diamond abrasive biomimetic polishing disk and manufacturing method

Abstract

The invention provides a biomimetic tin consolidating material and diamond abrasive polishing disk and a manufacturing method. The polishing disk is formed by a baseplate and hemispheric tin bumps prepared by mixing the biomimetic tin consolidating materials and diamond abrasives, wherein the hemispheric tin bumps are welded on the baseplate; distribution of the hemispheric tin bumps on the baseplate meets the F.R.Yeatts phyllotaxis model, namely meeting theta equal to 137.508<o>n; the radial positions of the kernel blocks meet the following formula; and the segmentation space formed by the hemispheric tin bumps has the Winkler foundation segmentation characteristic. The manufacturing method is characterized by adopting laser rapid prototyping, firstly coating the tin paste with the diamond abrasives on the surface of the baseplate, carrying out programming and scanning with laser beams according to the phyllotaxis model, welding the tin on the baseplate through fusion and forming thehemispheric tin bumps due to surface tension effect of the tin paste with the diamond abrasives in the fusion process. The polishing disk has the effects of homogenizing pressure distribution, balancing temperature fields and homogenizing polishing solution flow, can timely exhaust the wastes generated by polishing and can reasonably configure and balance the chemical and mechanical action proportion in chemical mechanical polishing, thereby greatly improving the polishing efficiency and the polishing quality.

Description

technical field [0001] The invention relates to the technical field of polishing and planarization of ceramic parts, optical crystal parts and semiconductor wafers, in particular to a tin-consolidated diamond abrasive bionic polishing disc whose surface is theoretically arranged according to plant phyllotaxy and a manufacturing method thereof. Background technique [0002] Polishing, especially chemical mechanical polishing (CMP) is an important technical method to solve the problem of ultra-smooth and ultra-flat surfaces of planar ceramic parts, optical crystal parts and semiconductor wafers. Usually chemical mechanical polishing is to use the combined action of chemical corrosion and mechanical friction to remove material. How to effectively solve the balance of contact pressure field and temperature field, the uniform flow of polishing liquid and the effective removal of polishing waste in the process of plane polishing has always been a difficult problem in this technica...

AI Technical Summary

Problems solved by technology

For existing polishing pads, whether it is a continuous medium or a polishing pad with a certain microporous shape, due to the implicated or shearing effect of the material, and the continuity of the surface macroscopically, the polishing contact pressure will be uneven and produce Uneven temperature distribution, difficulty in uniform introduction of polishing liquid and smooth removal of polishing waste, let alone the effective distribution of the proportion of chemical and mechanical effects, resulting in a decrease in the accuracy of the macro and micro contours of the polished surface, and it is even more difficult to achieve global planarization

[0004] In order to solve the above problems, people calculated the contact pressure field based on the classical elastic contact theory, obtained the reason for the uneven contact pressure field, and used the retaining ring method, back pad method and fluid load method to solve the problem; The polishing pad slotting method has also been adopted to solve the flow problem of the polishing fluid, but it still does not solve all the problems more effectively and comprehensively

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