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Manufacturing method of inorganic particle filled polyimide film

A polyimide film, inorganic particle technology, applied in grain processing and other directions, can solve the problems of low mechanical properties, poor dispersion of nanoparticles, poor transparency, etc., achieve excellent mechanical properties, overcome unclear process, transparent good effect

Inactive Publication Date: 2010-08-18
天津恒通时代电工材料科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The corona-resistant polyimide film manufactured by using this patent has poor dispersion of nanoparticles in the film, poor transparency and low mechanical properties

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A corona-resistant polyimide film filled with rutile-type titanium oxide with a particle size of 30 nanometers was prepared, and the weight of the pure polyimide material not containing nanoparticles was 25 kg. 4,4'-diaminodiphenyl ether was used as diamine, and pyromellitic dianhydride was used as dianhydride.

[0026] (1) Material preparation:

[0027] Feeding according to the ratio of nano-titanium oxide: pure polyimide material: N, N-dimethylacetamide=15kg: 100kg: 400kg, according to the condition of equimolar ratio of diamine and dianhydride, it can be seen that the required particle size is 30 nanometers 3.75kg of rutile titanium oxide, 11.76kg of 4,4'-diaminodiphenyl ether, 13.24kg of pyromellitic dianhydride, and 100kg of N,N-dimethylacetamide.

[0028] (2) Preparation of nano-titanium oxide / N, N-dimethylacetamide suspension:

[0029] A zirconia grinding ball with a diameter of 2 mm is used and a planetary mill is used.

[0030] According to the filling ratio...

Embodiment 2

[0037] A polyimide film filled with γ-phase nano-alumina with a particle size of 20 nm was prepared, and the weight of the pure polyimide material not containing nanoparticles was 25 kg.

[0038] (1) Preparation:

[0039] According to the ratio of γ-phase nano-alumina content: pure polyimide material: N, N-dimethylacetamide = 17kg: 100kg: 500kg, according to the condition of equimolar ratio of diamine and dianhydride, it can be seen that the required particle size 4.25kg of 20nm γ-phase nano-alumina, 11.76kg of 4,4'-diaminodiphenyl ether, 13.24kg of pyromellitic dianhydride, and 125kg of N,N-dimethylacetamide.

[0040] (2) Preparation of nano-alumina / N, N-dimethylacetamide suspension:

[0041] Zirconia grinding balls with a particle size of 2 mm are used, and a 5-liter horizontal stirring mill with continuous working capacity is used, and the filling rate of the grinding balls in the grinding bucket is 75%.

[0042] According to N, N-dimethylacetamide volume: nano-alumina we...

Embodiment 3

[0049] A micron-sized mica-filled corona-resistant polyimide film with a particle size of 1 micron was prepared, and the weight of the pure polyimide material not containing nanoparticles was 25 kg.

[0050] (1) Preparation:

[0051] According to the ratio of micron-sized mica: pure polyimide material: N-methylpyrrolidone=10kg: 100kg: 400kg, according to the condition of diamine and dianhydride equimolar ratio, it can be seen that 2.5kg of mica with a particle size of 1 micron is needed , 11.76kg of 4,4'-diaminodiphenyl ether, 13.24kg of pyromellitic dianhydride, and 100kg of N-methylpyrrolidone.

[0052] (2) Preparation of micron mica / N-methylpyrrolidone suspension:

[0053] Using 4mm zirconia grinding balls, using a rotary cylinder mill.

[0054] According to the filling rate of grinding ball 70%, add N-methylpyrrolidone to the 90% place of mill barrel volume again, and N-methylpyrrolidone volume: mica weight: the ratio of silane coupling agent=15ml: 1g: 100mg, Calculate ...

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Abstract

The invention discloses a manufacturing method of an inorganic particle filled polyimide film, in particular to a manufacturing method of an inorganic particle filled polyimide film which adopts a small-sized grinding ball as a grinding medium and also adopts a grinding machine to uniformly and stably disperse inorganic particles into an organic solvent, thereby improving the transparency and mechanical properties of the film. The manufacturing method comprises the following steps: adding a grinding ball with the diameter no more than 6mm into the grinding bucket of a grinding machine with a moving medium, and adding and grinding part of organic solvent, inorganic particles and surfactant until the inorganic particles are uniformly dispersed in the organic solvent, thereby obtaining inorganic particle / organic solvent suspension; adding the inorganic particle / organic solvent suspension, the remaining organic solvent and diamine and dianhydride with identical molar numbers into a reactor, and preparing inorganic particle / polyamic acid solution suspensoid in a conventional method; and preparing the inorganic particle filled polyimide film with the inorganic particle / polyamic acid solution suspensoid according to the production process of the conventional flow casting method. The film has the advantages of good transparency and excellent mechanical properties.

Description

technical field [0001] The invention relates to a method for manufacturing a polyimide film filled with inorganic particles. Background technique [0002] Polyimide film has high heat resistance, and the long-term use temperature can reach above 270 degrees; the dielectric property is excellent, and the dielectric loss factor is 10 -3 Order of magnitude, the power frequency breakdown field is stronger than 200kV / mm; and its mechanical properties are good, and the breaking strength is greater than 130Mpa. Therefore, this type of material is widely used in the fields of electrical engineering, electronics and aerospace. In recent years, it has become one of the research hotspots in the field of polyimide film manufacturing to add small-sized inorganic particles, especially nanoparticles, to the polyimide film to improve the related properties of the film. For example, semiconducting inorganic particles are added to polyimide film to improve its antistatic performance, and na...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K9/04C08K9/06C08K3/22C08K3/34C08G73/10B02C17/00
Inventor 刘斌董树恒李鸿岩陈维
Owner 天津恒通时代电工材料科技有限公司
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