Method for preparing dry adhesive

A production method and adhesive technology, applied in the direction of nanostructure manufacturing, manufacturing microstructure devices, and techniques for producing decorative surface effects, etc., can solve the problems of wet adhesives that are easy to degrade, easy to pollute, and difficult to use again , to achieve the effect of clear outline and deepening groove depth

Active Publication Date: 2010-09-22
HUAZHONG UNIV OF SCI & TECH
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The invention provides a method for making dry adhesives, which overcomes the shortcomings of current wet adhesives such as easy degradation, easy pollution, self-adhesion, and difficulty in reuse after being torn apart. Full van der Waals dry adhesive that can be easily desorbed

Method used

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  • Method for preparing dry adhesive
  • Method for preparing dry adhesive

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example 1

[0039] In the present invention, the diameter of the micron-scale fiber is 6 μm, the length is 40 μm, and the spacing is 6 μm; the diameter of the nano-scale fiber is 0.4 μm, the length is 3 μm, and the spacing is 0.4 μm. The specific implementation steps are as follows:

[0040] (1). Fabrication of micron-scale silicon master: first process the silicon wafer with RCA cleaning method, then evenly coat the surface with a negative photoresist with a thickness of 1.5 μm, model SU-8, and bake it at 95 ° C with a hot plate process 1 minute; place the prepared photolithography mask on the surface of the mold for ultraviolet light exposure, the exposure energy is 110mJ / cm2, then use SU-8 developer to wash away the photoresist on the part to be etched, and use pure water Clean and dry with nitrogen gas, and age the photoresist on the surface of the silicon wafer at 150°C for 10 minutes to form an etching-resistant protective layer; use ICP dry etching, and introduce a passivation cycl...

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[0047]

[0048]

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Abstract

The invention provides a method for preparing a dry adhesive in order that the existing wet adhesive has the disadvantages that the wet adhesive is prone to deterioration, pollution, self-adhesion and non-reusability after being torn open. Based on the research into the structural characteristics of micron-level and nano-level foot hair of a gecko in the nature, micron-level and nano-level fiber arrays can be molded and drawn in a way that the fiber arrays are molded successively for twice, thus obtaining the micron-level and nano-level structure of the bio-mimetic gecko hair, which is characterized by powerful adhesion. The method of the invention comprises the following steps: preparing a micron-level silicon mother stamp; preparing a micron-level mold; preparing micron-level fiber arrays; preparing a nano-level silicon mother stamp; preparing a nano-level mold; and preparing nano-level fiber arrays. The method of the invention is capable of preparing the micron-level and nano-level structure with the parameters thereof being close to those of the foot hair of the gecko in the nature; and the prepared powerful dry adhesive is capable of being fitted with various surfaces and easily detached in an active manner.

Description

technical field [0001] The invention belongs to a manufacturing method of a micro-electromechanical system, and specifically relates to a manufacturing method of a high-aspect-ratio micro-nano hierarchical structure, which can be used to manufacture a high-aspect-ratio micro-nano hierarchical structure. Release strong dry adhesive. Background technique [0002] In recent years, MEMS devices have been widely used in various fields such as aerospace, biomedicine, energy transportation, scientific instruments, etc. Many potential applications such as installation and fixing of MEMS devices (such as wall-climbing robots, micro-manipulation, micro-assembly, etc.) urgently require Develop a dry adhesive that allows MEMS devices to be firmly attached and easily detached from different types of surfaces. The adhesives widely used at present are almost all wet adhesives (such as adhesive tapes and glues), which have the disadvantages of easy degradation, easy pollution, self-adhesio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00B82B3/00
Inventor 刘世元张鹏吕皞
Owner HUAZHONG UNIV OF SCI & TECH
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