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Halogen-free flame retardant adhesive composition and flexible copper-clad plate using same

An adhesive and composition technology, applied in the field of halogen-free flame retardant adhesive composition and flexible copper clad laminate, can solve the problem of uneven dispersion of fillers, insufficient adhesion between substrate and copper foil, and poor mechanical properties of materials and other problems, to achieve good flame retardancy and reduce the effect of use

Active Publication Date: 2010-11-03
ALLSTAE TECH ZHONGSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the addition of a large amount of organophosphorus flame retardants and other inorganic fillers, on the one hand, there is a problem of uneven dispersion of fillers in the process of preparing the adhesive composition; Risk of insufficient adhesion between substrate and copper foil

Method used

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  • Halogen-free flame retardant adhesive composition and flexible copper-clad plate using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070]Halogen-free epoxy resin STRUKTOLVP 3742 (Melchers, Germany, epoxy equivalent: 370g / eq, phosphorus content: 4.5% by mass) 8 parts by weight, ULE241P-K-70 (Lianzhong Technology Co., Ltd., epoxy equivalent: 416g / eq, phosphorus content: 2.4% by mass) 16 parts by weight, XD-1000 (Nippon Kayaku Co., Ltd epoxy equivalent: 246g / eq) 8 parts by weight, GELR128E (Hongchang Electronic Materials Co., Ltd, epoxy equivalent: 185g / eq) 2 parts by weight; 40 parts by weight of synthetic rubber 1072CG (Nantex Industry Co., Ltd. acrylonitrile content 27% by mass); 2 parts by weight of diaminodiphenyl sulfone; 1-cyanoethyl-2-ethyl- 0.3 parts by weight of 4-methylimidazole (2E4MZ-CN); 43 parts by weight of nitrogen-containing flame retardant melamine polyphosphate (MPP, nitrogen content 18%); aluminum hydroxide (average particle diameter 0.8-1.2 μm, purity 99 % or more) 27 parts by weight; antioxidant 1010 (CIBA GEIGY Co., Ltd.) 1.0 parts by weight. Put the above components in a sand mill, ...

Embodiment 2

[0073] Halogen-free epoxy resin STRUKTOLVP 3742 (Germany Melchers, epoxy equivalent: 370g / eq, phosphorus content: 4.5% by mass) 10 parts by weight, ULE241P-K-70 (Lianzhong Technology Co., Ltd., epoxy equivalent: 416g / eq, phosphorus content: 2.4 mass %) 21 parts by weight, XD-1000 (Nippon Kayaku Co., Ltd epoxy equivalent: 246g / eq) 10 parts by weight, GELR128E (Hongchang Electronic Materials Co., Ltd, epoxy equivalent: 185g / eq) 2 parts by weight; 42 parts by weight of synthetic rubber 1072CG (Nantex Industry Co., Ltd. acrylonitrile content 27% by mass); 8 parts by weight of diaminodiphenyl sulfone; 1-cyanoethyl-2-ethyl- 0.3 parts by weight of 4-methylimidazole (2E4MZ-CN); 46 parts by weight of nitrogen-containing flame retardant melamine polyphosphate (MPP, nitrogen content 18%); aluminum hydroxide (average particle diameter 0.8-1.2 μm, purity 99 % or more) 27 parts by weight; antioxidant 1010 (CIBA GEIGY Co., Ltd.) 1.0 parts by weight. Put the above components in a sand mill, ...

Embodiment 3

[0076] Halogen-free epoxy resin PN-106 (Jinyi Chemical, epoxy equivalent: 340g / eq, phosphorus content: 2.6 mass %) 4 parts by weight, STRUKTOL VP3742 (German Melchers, epoxy equivalent: 370g / eq, phosphorus Content: 4.5% by mass) 10 parts by weight, ULE241P-K-70 (Hongchang Electronic Materials Co., Ltd., epoxy equivalent: 416g / eq, phosphorus content: 2.4% by mass) 21 parts by weight, KET4131A70 (KOLON, epoxy equivalent: 215.5g / eq) 5 parts by weight; synthetic rubber 1072CG (Nantex Industry Co., Ltd. acrylonitrile content 27% by mass) 18 parts by weight; thermoplastic resin phenoxy resin (PPO*MX-90, SABIC INNOVATIVE PLASTICS) 25 parts by weight 4.6 parts by weight of diaminodiphenyl sulfone; 0.4 parts by weight of 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN); nitrogen-containing flame retardant melamine polyphosphate (MPP, nitrogen-containing Amount 18%) 60 parts by weight. Put the above components in a sand mill, add butanone solvent, adjust the solid content of the compo...

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Abstract

The invention discloses a halogen-free flame retardant adhesive composition, which comprises the following components in parts by weight: 15 to 45 parts of halogen-free epoxy resin, 15 to 60 parts of thermoplastic resin and / or synthetic rubber, 0.1 to 8 parts of curing agent and 5 to 60 parts of nitrogen-containing flame retardant. The halogen-free flame retardant adhesive composition utilizes nitrogen-containing flame retardant, thus reducing the use of phosphonium flame retardant, in addition, the cured product shows good flame resistance, peel strength, electrical property and welding thermal resistance, does not contain elements of halogen, antimonide and other harmful substances and does not pollute the environment. The invention also discloses a flexible copper-clad plate, which is provided with an electrical insulating film, an adhesive coat and a copper foil, wherein the adhesive coat is prepared from the halogen-free flame retardant adhesive composition. The flame retardant rating of the flexible copper-clad plate is up to UL-94V0, thus the flexible copper-clad plate has good thermal resistance, adhesive force, soldering resistance and other performances.

Description

technical field [0001] The invention relates to an adhesive composition, in particular to a halogen-free flame-retardant adhesive composition, and also relates to a flexible copper-clad laminate using the composition. Background technique [0002] In recent years, with the light weight, miniaturization and high density of electronic products, the demand for various printed circuit boards has increased, which also puts forward stricter requirements on the performance of copper clad laminate materials. At present, flame retardant copper clad laminate materials use a large amount of brominated epoxy resin and antimony compounds as flame retardants, but when electronic products made of such copper clad laminates are burned under abnormal conditions or waste products are burned, among them The bromine-containing substances and their synergistic flame retardant antimony trioxide will produce toxic gas dioxins and hydrogen halides, which are harmful to the environment and human hea...

Claims

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Application Information

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IPC IPC(8): C09J109/02C09J163/00C09J163/02C09J167/00C09J133/00C09J171/12C09J179/08C09J11/06H05K1/02
Inventor 李国法张家骥
Owner ALLSTAE TECH ZHONGSHAN
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