Hollow cathode sputtering ion plating device

It is still quite difficult to further improve the utilization rate of the target

[0005] In addition, among the existing electroplating products, many products require the coating to be 80-100 microns. In order to meet the replacement requi...

Fig. 1 is self-made hollow cathode sputtering ion plating system, and equipment size is Φ500 * 500mm. The pumping unit pumps air into the vacuum chamber through the pumping port. It can be seen from the figure that the inner wall of the entire vacuum chamber is the target material, and the outer surface of the vacuum chamber is a rotatable magnet. When working, the plasma is tightly bound in the vacuum chamber, and the workpiece is completely immersed in the plasma. In the middle of the vacuum chamber is a cylindrical rotatable arc target, which can provide highly ionized plasma. Due to the high-speed rotation of the magnet, no etched grooves will be formed on the target surface, and the utilization rate of the target can be increased to more than 80%. This system makes full use of the closed field and the arc-enhanced ionization effect, and the coating deposition rate is greatly improved, which can meet the industrialized mass production.

In conventional coating equipment, although the quantity of target is more, each target is separation magnetic field, can't close the magnetic field of whole equipment, causes the restraint to plasma is poor, and diffusion is more serious, and density is lower, causes coating Density and hardness are poor. In order to improve the magnetic field distribution, unbalanced magnetic field, external closed magnetic field, target alignment, and auxiliary ion source are the most commonly used methods, but the structure of the coating equipment is complicated and the price is relatively expensive. In addition, since the target is only arranged in a local area of ​​the vacuum chamber, there are many areas that cannot be coated when the workpiece rotates in the vacuum chamber, resulting in a significant drop in the deposition rate of the coating, generally 2-3 μm/h, which cannot meet the requirements of 30-50 μm Thickness coating requirements. For this reason, the present invention designs the inner wall of the vacuum chamber as an integral target, and the workpiece can be coated uninterruptedly when it rotates inside, which greatly improves the efficiency of the coating (the deposition rate is increased to more than 20 μm/h). In addition, the use of a closed magnetic field outside the target can not only improve the utilization efficiency of the target, but also greatly increase the plasma density in the vacuum chamber, which greatly simplifies the equipment and is very suitable for industrialized mass production. In the present invention, the space between the arc target and the hollow cathode magnetron target is an annular ion plating deposition area. Since the arc target generates high-intensity plasma, the closed magnetic field outside the hollow cathode magnetron target tightly confines the plasma to the arc target. Between and the magnetron target, the plasma density in the deposition area is greatly increased. In addition, when coating a variety of complex workpieces, the workpiece is completely immersed in the plasma, the effect of ion bombardment is very significant, and the hardness, adhesion and uniformity of the coating are well guaranteed.

The present invention is different from the general coating equipment at home and abroad at present, has fully utilized closed field magnetic field and rotating magnetic field technology, columnar high-power rotating arc target technology, not only can prepare various single thick coatings such as TiN, CrN, ...