Hollow cathode sputtering ion plating device
A cathode sputtering and ion plating technology, applied in the direction of sputtering plating, ion implantation plating, vacuum evaporation plating, etc., can solve problems such as difficulties, inability to meet thick coating requirements, low deposition rate, etc., and achieve uniform distribution , Improve the effect of ion plating, improve the effect of coating uniformity
Inactive Publication Date: 2010-11-03
WUHAN UNIV
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Abstract
The invention relates to a hollow cathode magnetron sputtering ion plating coating device, which comprises a vacuum chamber, wherein the vacuum chamber is provided with a vacuuming opening; cathode arc targets and a work piece frame are arranged in the vacuum chamber; the vacuum chamber is hollow cylindrical and is insulated from the ground; a target material is arranged on the inner wall of the vacuum chamber and is connected with the cathode of a sputtering power supply to form a hollow cathode sputtering target; a columnar arc target is arranged in the center of the vacuum chamber; and the work piece frame is positioned in an area enclosed by the cylindrical hollow cathode arc target and the columnar arc target. Due to the adoption of the structure, the hollow cathode magnetron target on the furnace wall and the high-power rotating arc target in the center are stably run when at work, and plasmas are uniformly distributed, which improves coating efficiency and ion plating effect, reduces coating cost, improves the uniformity of a coating and makes a coating process easier to control.
Application Domain
Vacuum evaporation coatingSputtering coating +1
Technology Topic
Electric arcMaterials science +5
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PUM
Property | Measurement | Unit |
Deposition thickness | 100.0 ~ 200.0 | nm |
Deposition thickness | 200.0 ~ 300.0 | nm |
Deposition thickness | 5.0 ~ 300.0 | nm |
Description & Claims & Application Information
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