Preparation method of flake silver-plated copper powder

A technology of silver-plated copper powder and flakes, which is applied in the direction of liquid chemical plating, coating, metal material coating technology, etc., can solve the problems of unenvironmental protection of raw materials, uneven coating, poor adhesion of silver layer, etc., and achieve good Conductivity and oxidation resistance, uniform and dense coating, easy to control effect

Inactive Publication Date: 2010-12-08
NO 53 RES INST OF CHINA NORTH IND GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This invention only uses silver mirror reaction in the process of silver plating, resulting in uneven plating and poor adhesion of the silver layer on the surface of the copper powder. This method is complicated in process, high in production cost, and the raw materials are not environmentally friendly, so it is not suitable for large-scale production
[0008] In the above-mentioned domestic and foreign patents and documents, there are disadvantages such as high production cost, low silver plating efficiency, uneven coating, and non-compliance with environmental protection requirements.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Add 2kg of copper powder, 2kg of absolute ethanol, and 8kg of stainless steel balls with a diameter of Φ6mm into the ball mill, and conduct ball milling under the protection of argon at a speed of 100r / min; use a circulating refrigerator to control the temperature at 10°C, and ball mill for 20 hours. Then use absolute ethanol and acetone to suction filter and sieve in sequence to obtain bright red copper powder. Quickly add copper powder to 4000ml of 5g / L concentration of EDTA and 400ml of 5g / L concentration of Pingpingjia O-20 mixed aqueous solution, mix 200ml of 10g / L concentration of aluminum nitrate and 1000ml of 100g / L concentration of silver nitrate solution After uniformity, slowly add it dropwise into the above solution, and at the same time, use a high-speed disperser to stir at a speed of 50r / min. After adding the above solution, continue stirring for 10 minutes to ensure that the replacement reaction is complete. Then slowly add 2000ml of 10g / L aqueous glucos...

Embodiment 2

[0035] Put 2kg of copper powder, 8kg of absolute ethanol, and 15kg of stainless steel balls with a diameter of Φ6mm into the ball mill, and conduct ball milling under the condition of nitrogen protection at a speed of 400r / min; use a circulating refrigerator to control the temperature at 2°C, ball mill for 8 hours, and then Absolute ethanol and acetone were used for suction filtration to obtain bright red copper powder. Quickly add copper powder to 4000ml 10g / L concentration of TRIEN, 200ml 40g / L concentration of Pingpingjia O-20 and 200ml 40g / L concentration of polyoxyethylene nonylphenol ether NP-10 mixed aqueous solution, and 250ml 1g Aluminum nitrate at a concentration of / L and 200ml of an aqueous solution of silver nitrate at a concentration of 800g / L are mixed evenly and then slowly added dropwise to the above solution, while stirring with a high-speed disperser at a speed of 200r / min. After adding the above solution, continue to stir for 20min. Make sure the displaceme...

Embodiment 3

[0038] Put 1kg of copper powder, 5kg of absolute ethanol, and 10kg of stainless steel balls with a diameter of Φ6mm into the ball mill, and conduct ball milling under the protection of argon at a speed of 800r / min; use a temperature of 30-50°C, ball mill for 2 hours, and then Suction filtration with absolute ethanol and acetone to obtain bright red copper powder. Quickly add copper powder to 1000ml of 100g / L concentration of EGTA and 100ml of 50g / L concentration of Pingpingjia O-20 mixed aqueous solution, mix 100ml of 5g / L concentration of aluminum nitrate and 126ml of 1000g / L concentration of silver nitrate aqueous solution to mix evenly Then slowly add it dropwise into the above solution, and at the same time use a high-speed disperser to stir at a speed of 1000r / min. After adding the above solution, continue stirring for 30 minutes to ensure that the replacement reaction is complete. Then slowly add 2500ml of 40g / L tartaric acid aqueous solution dropwise into the solution, ...

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Abstract

The invention relates to a preparation method of flake silver-plated copper powder, which comprises four steps of pre-treating, silver plating, desorbing and post-treating, and concretely comprises the following steps: performing ball milling on copper powder to obtain flake copper powder under inert-gas shielding; in a chelating agent / dispersing agent compound system, performing chemical replacement for silver plating by an aluminum nitrate and silver nitrate compound system; reducing the residual silver ions in the solution by a reducing agent; washing by an acid water solution; and performing ball milling at low speed under the inert atmosphere shielding for spreading the silver particles on the surface of the silver-plated copper powder, thereby densifying and homogenizing the silver layer, simultaneously increasing the bonding strength of the silver and the copper, and improving the conductivity and oxidation resistance of the silver-plated copper powder. The method of the invention has the characteristics of environmental protection, simple process, low cost and the like, and can obtain flake silver-plated copper powder with low silver plating content, good conductivity, even plating and strong oxidation resistance. The flake silver-plated copper powder prepared by the method can be used as conductive filler for manufacturing and processing products such as paint, rubber, adhesive and the like with high conductivity, and has wide application prospect.

Description

1. Technical field [0001] The invention belongs to the technical field of surface treatment, and relates to metal powder silver plating technology, more specifically, to a preparation method of silver-plated copper powder. 2. Background technology [0002] As a filler, conductive metal powder is widely used in the preparation of conductive rubber, coatings, adhesives and other materials. Silver powder has good conductivity, and its oxide still has good conductivity, but it has the disadvantages of being expensive and easy to migrate; copper powder is cheap, and its conductivity is second only to silver, but its oxidation resistance is poor, and its oxide is not conductive. However, the copper powder after silver plating, while greatly reducing the cost, overcomes the shortcomings of easy oxidation of copper powder and easy migration of silver powder, and becomes an ideal substitute for silver powder, which can meet the application of conductive composite materials and has a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02C23C18/42
Inventor 徐勤涛孙建生杨丰帆赵秀芬刘景于万增李吉宏
Owner NO 53 RES INST OF CHINA NORTH IND GRP
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