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Light-emitting diode (LED) and preparation method thereof

A technology of light-emitting diodes and light-emitting layers, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of increasing the adhesion between the light-emitting layer and the chip, and the easy precipitation of phosphors, so as to improve the uniformity of glue and reduce the need for time, the effect of increasing the luminous efficiency

Inactive Publication Date: 2010-12-15
UNIV OF ELECTRONIC SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The problem to be solved by the present invention is: how to provide a light-emitting diode and its preparation method. This solution solves the problems of colloid solidification and phosphor easy to precipitate in the colloid in the process of coating phosphor, and improves the glue output during the dispensing process. The uniformity of the light-emitting layer increases the consistency of the light-emitting layer in the light-emitting diode, increases the bonding degree between the light-emitting layer and the chip, and reduces the time required for curing the light-emitting layer; the solution is simple and effective, and can greatly reduce the production cost of the device and process difficulty, greatly improving the yield of related devices

Method used

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  • Light-emitting diode (LED) and preparation method thereof
  • Light-emitting diode (LED) and preparation method thereof
  • Light-emitting diode (LED) and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0100] like figure 2In the device structure shown, the LED chip 3 is a blue LED chip, the luminescent layer 5 is a mixed system of fluorescent powder excited by blue light to produce yellow light and an adhesive that needs to be cured by ultraviolet light, and the bracket 1 is a copper bracket with a silver-plated surface.

[0101] The preparation method is as follows:

[0102] ①Choose a suitable die-bonding glue to glue the blue LED chip on the bracket;

[0103] ② Lead out the electrodes on the LED chip;

[0104] ③ drop-coat the luminescent layer material on the LED chip, the luminescent layer is a mixed system of yellow fluorescent powder and an adhesive that needs to be cured by ultraviolet light, and the adhesive raw material includes the following components in mass percentage:

[0105] Polythiol-polyene system 94%

[0106] Monofunctional or polyfunctional acrylic acid 1%

[0107] Photoinitiator 3%

[0108] Photosensitizers and additives 2%

[0109] Wherein the pho...

Embodiment 2

[0117] like figure 2 As shown in the device structure, the LED chip 3 is a blue LED chip, the light-emitting layer 5 is a mixed system of fluorescent powder excited by blue light to generate green light and an adhesive that needs to be cured by ultraviolet light, and the bracket 1 is a copper bracket with silver-plated surface.

[0118] The preparation method is as follows:

[0119] ①Choose a suitable die-bonding glue to glue the blue LED chip on the bracket;

[0120] ② Lead out the electrodes on the LED chip;

[0121] ③ Spraying the luminescent layer material on the LED chip, the luminescent layer is a mixed system of green fluorescent powder and an adhesive that needs to be cured by ultraviolet light, and the adhesive raw material includes the following components in mass percentage:

[0122] Polythiol-polyene system 94%

[0123] Monofunctional or polyfunctional acrylic acid 0.5%

[0124] Photoinitiator 5%

[0125] Photosensitizers and additives 0.5%

[0126] Wherein ...

Embodiment 3

[0131] like figure 2 As shown in the device structure, the LED chip 3 is a blue LED chip, the light-emitting layer 5 is a mixed system of fluorescent powder excited by blue light to generate red light and an adhesive that needs to be cured by ultraviolet light, and the bracket 1 is a copper bracket with a silver-plated surface.

[0132] The preparation method is as follows:

[0133] ①Choose a suitable die-bonding glue to glue the blue LED chip on the bracket;

[0134] ② Lead out the electrodes on the LED chip;

[0135] ③ Dip-coating the luminescent layer material on the LED chip, the luminescent layer is a mixed system of red fluorescent powder and an adhesive that needs to be cured by ultraviolet light, and the raw material of the adhesive includes the following components in mass percentage:

[0136] Polythiol-polyene system 95%

[0137] Monofunctional or polyfunctional acrylic acid 0.6%

[0138] Photoinitiator 0.4%

[0139] Photosensitizers and additives 4%

[0140] ...

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Abstract

The invention discloses a light-emitting diode (LED). The LED at least comprises a bracket, an LED chip and a luminous layer on the LED chip and is characterized in that: the luminous layer is a mixed system consisting of one or more kinds of fluorescent powder capable of emitting light with various colors and an adhesive needing to be cured by ultraviolet light; and the adhesive comprises the following components: a polythiol-polyene system, mono-functional or multi-functional acrylic acid, a photo initiator, a photosensitizer and an aid. The luminous layer has the advantages of solving the problems of sol solidification and fluorescent powder precipitation existing in a fluorescent powder coating process, enhancing the uniformity of the fluorescent powder on the chip and shortening the curing time of the luminous layer. The scheme is simple and effective and can greatly lower the production cost of apparatuses.

Description

technical field [0001] The invention relates to the technical field of optoelectronic devices, in particular to a light emitting diode and a preparation method thereof. Background technique [0002] Light Emitting Diode (LED for short) is a light-emitting device that emits ultraviolet, visible or infrared light when a forward voltage is applied across a semiconductor p-n junction. It is a new generation of solid-state light source. Because of its small size, long life, low driving voltage, fast response, shock resistance, heat resistance and other characteristics, since the first light-emitting diode came out in 1964, people have not stopped the pace of research and development. With the development of light-emitting materials The development and improvement of semiconductor manufacturing process, as well as the introduction of distributed Bragg reflection structure, optical microcavity and quantum well structure in the chip growth process, have continuously improved the eff...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/56
Inventor 于军胜胡玉才陈苏杰蒋亚东
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
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