Diffractive micro-optical element-based intense laser die-free forming method and device

Abstract

The invention relates to the technical field of micro device manufacture and micro plastic formation, in particular to a diffractive micro-optical element-based micro plastic forming method and a diffractive micro-optical element-based micro plastic forming device for a micro device. The method is characterized in that: a diffractive micro-optical element (DOE) is designed and manufactured according to the shape of a part to be formed, and the DOE is taken as a laser beam modulation and reshaping element; one beam of laser emitted by a laser device is split into two beams of laser through a beam splitter, and the two beams of laser pass through a beam expanding system, the modulation and reshaping element and a focusing system respectively so that the two beams of laser are irradiated to a workpiece to be processed; the shapes of laser beam light spots on the upper and lower surfaces are similar to those of upper and lower dies and are adapted with the shape of the prescient formed part; an area to be processed is processed under the impact and heat effect of the laser; and because a die is not needed during processing, die-free formation is finally realized. The method and the device are applicable to micro plastic formation of micro metal devices, are particularly suitable for formation of micro devices with complex shapes, and can realize die-free formation and batch production of the micro devices.

Description

technical field [0001] The invention relates to the technical field of micro-device manufacturing and micro-plastic forming, in particular to a method and device for micro-plastic forming of micro-device based on diffractive micro-optical elements, which is suitable for micro-plastic forming of micro-metal devices, especially for complex shapes Micro-device forming can realize moldless forming and mass production of micro-device. Background of the invention [0002] With the rapid development of science and technology today, the degree of miniaturization of industrial products has become one of the standards to measure the level of a country's manufacturing industry. At present, most MEMS-oriented micromachining technologies and processes are borrowed from microelectronic integrated circuit processes, mainly relying on deep reactive ion etching, photolithography, LIGA and other micro-processing technologies, which limit the diversity of processing materials. In addition, du...

AI Technical Summary

Problems solved by technology

However, when the LCD screen is used as a mask, the laser energy is damaged by the LCD screen damage threshold (2W / cm 2 , continuous light wave), and when the laser beam passes through the LCD screen, the light energy loss is very large, and the efficiency is about 25%.

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