High-defoaming epoxy resin packaging material and preparation method thereof

An epoxy resin and packaging material technology, applied in chemical instruments and methods, other chemical processes, etc., can solve the problems of unstable air bubbles, difficult to eliminate air bubbles, corrode chips and wires, etc., and achieve good electrical insulation and smooth surface. , the effect of good heat resistance

Active Publication Date: 2011-01-19
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thixotropic agents currently used in epoxy resin packaging materials include polyamide wax, fumed silica, hydrogenated castor oil, etc., but they are solid thixotropic agents, difficult to add, and very easy to form unstable bubbles, and the bubbles are difficult to Elimination, which leads to air bubbles remaining when the epoxy resin packaging material is flow-molded on the printed circuit board, and pinholes are easily formed on the surface of the cured product, so that moisture easily enters the interior, corrodes the chip and the wire, and the cured product is exposed to thermal stress. Easy to crack, reduced reliability
That is to say, at present most of the epoxy resin encapsulation materials of this kind have the problem that fluidity and defoaming property are difficult to have both, so it is necessary to develop an epoxy resin encapsulation material with moderate fluidity and high defoaming property. Material

Method used

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  • High-defoaming epoxy resin packaging material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The preparation method of this high defoaming epoxy resin encapsulation material comprises the following steps successively:

[0029] (1) Dry silicon dioxide and aluminum hydroxide respectively to remove moisture in the silicon dioxide and aluminum hydroxide; the drying temperature is 115° C., and the drying time is 90 minutes;

[0030](2) Take by weighing liquid epoxy resin 900g (both bisphenol A type epoxy resin, its viscosity is 12000cps, epoxy equivalent is 200), dicyandiamide (DICY) 90g, non-conductive carbon black 1g, alkyl Glycidyl ether 50g (all C 12 -C 14 Alkyl glycidyl ether), silicon dioxide 600g (all are fused silica), aluminum hydroxide 600g (all are hydrophobic aluminum hydroxide), and join the first reaction vessel which is clean, dry and has a cooling water jacket In; then run the cooling water jacket of the first reaction vessel, the temperature of the material in the first reaction vessel is controlled below 50 ℃, and the material in the first reacti...

Embodiment 2

[0037] The preparation method of this high defoaming epoxy resin encapsulation material comprises the following steps successively:

[0038] (1) Dry silicon dioxide and aluminum hydroxide respectively to remove moisture in the silicon dioxide and aluminum hydroxide; the drying temperature is 110° C., and the drying time is 120 minutes;

[0039] (2) take by weighing 900g liquid epoxy resin (all being bisphenol F type epoxy resin, its viscosity is 3000cps, epoxy equivalent is 170), 50g dicyandiamide, 5g non-conductive carbon black, 800g silicon dioxide, 400g aluminum hydroxide, and join clean, dry and have in the first reaction vessel of cooling water jacket; Then run the cooling water jacket of the first reaction vessel, the temperature of the material in the first reaction vessel is controlled below 50 ℃, And the material in the first reaction vessel is stirred (stirring speed is 2500rpm (rotation / minute), stirring time is 15 minutes); Obtain the first semi-finished rubber com...

Embodiment 3

[0046] The preparation method of this high defoaming epoxy resin encapsulation material comprises the following steps successively:

[0047] (1) Dry silicon dioxide and aluminum hydroxide respectively to remove moisture in silicon dioxide and aluminum hydroxide; dry to a temperature of 120° C. and a drying time of 70 minutes;

[0048] (2) Take by weighing 900g liquid epoxy resin (wherein viscosity is 15000cps, epoxy equivalent is the bisphenol A type epoxy resin 400g of 196, and viscosity is 2500cps, epoxy equivalent is the bisphenol F type epoxy resin 500g of 168) , 80g dicyandiamide, 10g non-conductive carbon black, 10g alkyl glycidyl ether (both n-butyl glycidyl ether), 400g silicon dioxide, 800g aluminum hydroxide, and add to clean, dry and have cooling water In the first reaction vessel of jacket; Then run the cooling water jacket of the first reaction vessel, the temperature of the material in the first reaction vessel is controlled below 50 ℃, and the material in the fi...

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Abstract

The invention relates to a high-defoaming epoxy resin packaging material which is characterized by comprising the following components in portions by weight:100 portions of liquid epoxy resin, 5-9 portions of dicyandiamide, 0.05-0.5 portion of N-methyl pyrrolidone solution of carbamate compounds, 1-5 portions of modified imidazole accelerant, 0.1-1 portion of non-conducting carbon black, 0-5 portions of aphyl glycidol ether, 0.05-0.5 portion of organosilane defoaming agent, 40-80 portions of silicon dioxide and 40-80 portions of aluminium hydroxide. The invention also provides a preparation method of the high-defoaming epoxy resin packaging material. The high-defoaming epoxy resin packaging material has the advantages of moderate flowability and high defoaming capacity in the application process, smooth surface and no bubble or pit after curing, and compact inside and no pore residue in the cured material; and the curing temperature is moderate, and the cured material has the advantages of high heat resistance, electric insulating property and strong binding power.

Description

technical field [0001] The invention relates to an epoxy resin encapsulation material for electronic encapsulation, in particular to an epoxy resin encapsulation material with high defoaming capability, and a preparation method of the epoxy resin encapsulation material. Background technique [0002] At this stage, the materials used for electronic packaging are mostly epoxy resin packaging materials, considering factors such as cost, mechanical properties, and electrical properties. [0003] Epoxy resin packaging materials are mainly used in surface mount technology (SMT, surface mounttechnology) and chip direct assembly (COB, chip-on-board) and other electronic packaging chip and wire sealing protection, requiring heat resistance, electrical insulation Non-toxicity, moderate fluidity and good defoaming performance ensure that no bubbles remain inside after curing. [0004] Epoxy resin packaging materials are generally composed of epoxy resin, curing agent, accelerator, thi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/10C08L63/00C08L63/02C08K13/02C08K3/04C08K3/36C08K3/22
Inventor 周振基周博轩
Owner NICHE TECH KAISER SHANTOU
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