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Method for preparing nano composite plating layer

A nanocomposite and coating technology, applied in coatings, electrolytic coatings, etc., can solve the problems of easy agglomeration of nanoparticles and achieve the effect of improving wetting conditions, uniform and fine grains, and inhibiting agglomeration

Inactive Publication Date: 2011-01-26
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the defect that nanoparticles are prone to agglomeration in the composite electroplating process, the invention provides a method for preparing a nanocomposite coating

Method used

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  • Method for preparing nano composite plating layer
  • Method for preparing nano composite plating layer
  • Method for preparing nano composite plating layer

Examples

Experimental program
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Effect test

Embodiment 1

[0040] 1) Select the cathode and anode substrate for plating

[0041] In the test, the side surface of a stainless steel cylinder with a diameter of Φ20mm is used as the working surface of the plating cathode, and 4 electrolytic nickel plates with a purity greater than 99.99% are used as the anode. The volume specification of the nickel plate is 150mm×30mm×3mm, and 4 pieces of nickel The plates are uniformly distributed around the cathode, and the ratio of the area of ​​the immersion liquid cathode to the anode is 1:6. The operation process of the surface treatment of the cathode stainless steel cylinder is as follows: sanding with fine sandpaper to the mirror surface → repeated rubbing with alcohol to remove oil → about 10% sulfuric acid solution passivation of the plating surface for 1 hour → cleaning with distilled waterdrying for use. The power device for the cathode rotation is an AC speed-regulating motor, and the power supply adopts a constant current stabilized power s...

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Abstract

The invention discloses a method for preparing a nano composite plating layer, which comprises the following steps of: placing the plating solution added with nano granules in an ultrasonic field of an ultrasonic wave generator, and meanwhile performing plating in a mode of driving a plating cathode to rotate in the ultrasonic field through a cathode connecting rod. By adopting the method of the invention, the cavitation effect of ultrasonic wave and the micro jet flow generated when the ultrasonic wave is propagated in a liquid medium can shatter nano granule aggregates and promote co-deposition of the nano granules and a matrix metal; and the plating cathode rotates at a high speed in the plating solution during plating so as to increase the stirring speed of the plating solution, inhibit the conglobation of the nano granules, reduce the concentration polarization, promote the plating efficiency and enhance the comprehensive performance of the plating layer at the same time. The prepared nano composite plating layer has flat and exquisite surface, uniform and fine granules and dense arrangement; and the hardness, corrosion resistance and abrasion resistance of the nano composite plating layer are greatly improved.

Description

technical field [0001] The invention belongs to the technical field of electrochemical surface engineering, and in particular relates to a method for preparing a nanocomposite coating. Background technique [0002] As a surface modification technology with simple process, convenient operation and low cost, nanocomposite electroplating has developed rapidly in recent years. Proper amount of nanoparticles uniformly dispersed in the composite coating can improve the crystallization environment of the matrix metal and significantly improve the comprehensive performance of the composite coating. However, due to the high surface energy of the nanoparticles themselves, they are prone to agglomeration during the electroplating process, causing the nanoparticles to settle in the electroplating solution, thereby affecting the electroplating effect. In addition, the agglomeration of nanoparticles also makes it impossible to disperse uniformly in the electroplating layer, resulting in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D15/00
Inventor 薛玉君张德颖司东宏李伦余永健李济顺刘红彬马伟
Owner HENAN UNIV OF SCI & TECH
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