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Method for preparing aluminum nitride ceramic substrate by clinker slicing

A technology of aluminum nitride ceramics and slicing method, which is applied in the field of ceramic substrates, can solve problems such as complex process routes, low production efficiency, and low qualified rate of finished products, and achieve reduced investment and operating costs, improved slicing efficiency, and uniform sintering. transparent effect

Active Publication Date: 2011-03-16
刘述江
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, aluminum nitride ceramic substrates are prepared by casting method (thin sheet) and molding method (thick sheet) (see literature: [1] Wu Yin, Zhou Heping, Miao Weiguo. Casting AlN ceramic substrate technology [J]. Electronic Components and Materials, 1996, 15(1): 20-23; [2] Chinese Patent 98125129.3; [3] Chinese Patent 200410016144.2; [4] Chinese Patent 200810142697.0), but there are generally problems such as low production efficiency, especially common The tape-casting method used has complex process routes, large equipment investment, high energy consumption, and low qualified rate of finished products, resulting in the inability to meet the requirements of high-quality, low-cost, and mass-produced aluminum nitride ceramic substrates for the rapid development of electronics, electrical, and new energy industries. huge demand for tablets

Method used

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  • Method for preparing aluminum nitride ceramic substrate by clinker slicing

Examples

Experimental program
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Effect test

Embodiment 1

[0025] 1) Select high-purity (oxygen content2 o 3 Powder, proportioned according to the following mass percentage: AlN powder 95%, Y 2 o 3 The powder is 5%, and mixed evenly by dry ball milling to obtain a mixed powder.

[0026] 2) Using a molding machine to mold the mixed powder to obtain a mixed powder base; the shape of the mixed powder base may be a cubic mixed powder base with a cross-section of 50mm×50mm or more.

[0027] 3) Sintering the mixed powder body; said sintering the mixed powder body, the mixed powder body can be put into a graphite sintering mold and sintered by hot pressing in a graphite sintering furnace. 2 Protection, the pressure is 25MPa, the temperature is raised to 1550-1650°C, kept for 4-5 hours, and cooled with the furnace.

[0028] 4) Slicing the sintered mixed powder billet, and then grinding and polishing to obtain an aluminum nitride ceramic substrate. For the slicing, a multi-wire slicing machine can be used to cut the sintered mixed powder b...

Embodiment 2

[0030] Similar to Example 1, the difference is that AlN powder and Y 2 o 3 The powder is proportioned according to the following mass percentages: AlN powder 96%, Y 2 o 3 Powder 4%. The temperature of hot-press sintering is 1700-1750°C, and the time of hot-press sintering is 5-6 hours.

Embodiment 3

[0032] Similar to Example 1, the difference is that AlN powder and Y 2 o 3 The powder is proportioned according to the following mass percentage: AlN powder 93%, Y 2 o 3 Powder 7%. The shape of the mixed powder blank may be a cylindrical mixed powder blank with a diameter of 50 mm or more. When the mixed powder blank is sintered, put the mixed powder blank into a sintering mold made of AIN material and sinter under pressure; the sintering can be sintered by microwave in a microwave sintering furnace, and the temperature of the microwave sintering can be 1500-1550°C. The time is 10 ~ 15min. When slicing, a circular cutting machine can be used to cut the sintered mixed powder billet into thick slices with smooth surface.

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Abstract

The invention discloses a method for preparing an aluminum nitride ceramic substrate by clinker slicing, which relates to a ceramic substrate. The invention provides a method for preparing an aluminum nitride ceramic substrate by clinker slicing. The aluminum nitride ceramic substrate comprises the following raw materials by mass percent: 93%-98% of aluminum nitride and 2%-7% of yttrium oxide. The method comprises the following steps: adding nano or submicron Y2O3 into nano or submicron AIN powder, carrying out ball milling treatment by a dry method, and uniformly mixing to obtain the mixed powder; molding the mixed powder by using a molding press to obtain a mixed powder blank; sintering the mixed powder blank; and slicing the sintered mixed powder blank, and then, grinding and polishingto obtain the aluminum nitride ceramic substrate. According to the method, the technical production steps are greatly simplified, the static pressure processes such as binder removal and the like arereduced, the influence on the quality by residues such as adhesives and the like is eliminated, and the advantages of stable quality, good compactness and high rate of finished products are obtained.

Description

technical field [0001] The invention relates to a ceramic substrate, in particular to a method for preparing an aluminum nitride ceramic substrate by a sintered block slicing method. Background technique [0002] At present, aluminum nitride ceramic substrates are prepared by casting method (thin sheet) and molding method (thick sheet) (see literature: [1] Wu Yin, Zhou Heping, Miao Weiguo. Casting AlN ceramic substrate technology [J]. Electronic Components and Materials, 1996, 15(1): 20-23; [2] Chinese Patent 98125129.3; [3] Chinese Patent 200410016144.2; [4] Chinese Patent 200810142697.0), but there are generally problems such as low production efficiency, especially common The tape-casting method used has complex process routes, large equipment investment, high energy consumption, and low qualified rate of finished products, resulting in the inability to meet the requirements of high-quality, low-cost, and mass-produced aluminum nitride ceramic substrates for the rapid dev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/582C04B35/622
Inventor 刘述江
Owner 刘述江
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