Manufacture method of ceramic-based interconnection flexible circuit board

Abstract

The invention discloses a manufacture method of a ceramic-based interconnection flexible circuit board, which is characterized by comprising the following steps of: A, manufacturing an aluminum nitride ceramic circuit board; B, manufacturing a flexible circuit board; C, laminating the aluminum nitride ceramic circuit board and the flexible circuit board; D, manufacturing a through hole penetrating the upper surface and the lower surface of a multilayer board in the step C on the multilayer boardby adopting a laser punching device, penetrating the through hole by adopting a conductive material and then drying to ensure that the through hole becomes a conducting hole; E, printing welding-preventing ink on the place of the multilayer board where no electric component is welded; F, silk-screening characters on the preset place of the multilayer board; and G, cutting the circuit boards into preset specifications by adopting a laser cutting device to obtain the ceramic-based rigid flexible multilayer circuit board. The invention aims at overcoming the defects in the prior art, and provides the manufacture method of the ceramic-based interconnection flexible circuit board with excellent 3D connection characteristic and better thermal conductivity.

Description

technical field [0001] The invention relates to a method for manufacturing a ceramic-based interconnected flexible circuit board. Background technique [0002] At present, there are ordinary epoxy resin multilayer boards in the industry, there are flexible circuit boards (soft boards), rigid-flexible circuit boards with epoxy resin + flexible circuit boards, and ordinary Al 2 o 3 As the main component of ceramic circuit boards, their advantages and disadvantages are as follows: [0003] Ordinary epoxy resin multilayer board: has a series of advantages such as many layers, high wiring density, mature technology, and easy welding of components, but its thermal conductivity and heat dissipation are poor, the expansion and contraction size is difficult to control, and the reliability is also difficult to improve; [0004] Flexible circuit board (soft board): small in size, light in weight, movable, curved, twisted surface will not damage the wires, can follow different shapes ...

AI Technical Summary

Problems solved by technology

[0003] Ordinary epoxy resin multilayer board: has a series of advantages such as many layers, high wiring density, mature technology, and easy welding of components, but its thermal conductivity and heat dissipation are poor, the expansion and contraction size is difficult to control, and the reliability is also difficult to improve;

[0004] Flexible circuit board (soft board): small in size, light in weight, movable, curved, twisted surface will not damage the wire, can comply with different shapes and special package sizes, 3D assembly and a wide range of dynamic applications; the weakness lies in dimensional stability Extremely poor performance, low wiring density, not resistant to high temperature, and not easy to make multilayer boards

[0005] Ordinary alumina ceramic circuit board: it has the advantages of high heat dissipation and corrosion resistance, high insulation performance and excellent high-frequency characteristics, low expansion coefficient, stable chemical performance and high thermal conductivity, and non-toxic; but because of its It has the characteristics of high hardness, so it is brittle and difficult to machine. At the same time, because of its flat surface, it is difficult to achieve interlayer conduction through electroplating and it is difficult to effectively combine with other layers to form a multilayer circuit board;

[0006] Traditional circuit boards have single advantages and cannot have high thermal conductivity, high integration and 3D connection functions at the same time, and cannot meet the market's demand for circuit boards with high connectivity, high density, and good thermal conductivity.

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