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Prepreg and metal foil substrate

A semi-cured film and metal foil technology, which is applied in the field of metal foil laminates and metal foil multilayer laminates, can solve environmental pollution and other problems, and achieve reduced dielectric constant and dielectric loss, low hygroscopicity, The effect of increasing hygroscopicity

Inactive Publication Date: 2011-05-04
ELITE MATERIAL
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this manufacturing method must use flame retardants containing halogen (such as bromine; Bromine; Br) components, such as tetrabromocyclohexane, hexabromocyclodecane and 2,4,6-tri(tribromophenoxy base)-1,3,5-triazine, and these bromine-containing flame retardants are easy to cause pollution to the environment when the product is manufactured, used, or even recycled or discarded

Method used

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Embodiment Construction

[0069] The present invention discloses a prepreg, which includes a reinforcing material and a thermosetting resin composition, wherein the reinforcing material can be glass fiber cloth; the thermosetting resin composition includes epoxy resin, aromatic ester hardener and flame retardant compound.

[0070] The epoxy resin (epoxy resin) can be bisphenol A (bisphenol-A) epoxy resin, bisphenol F (bisphenol-F) epoxy resin, bisphenol S (bisphenol-S) epoxy resin, phenolic ( phenol novolac) epoxy resin, bisphenol-A novolac epoxy resin, o-cresol novolac epoxy resin, trifunctional epoxy resin, tetrafunctional epoxy resin Epoxy resin, multifunctional epoxy resin, dicyclopendiene epoxy resin (Dicyclopendieneepoxy resin; DCPD), p-xylene epoxy resin (P-xylene epoxy resin), phosphorus epoxy resin, naphthalene Epoxy resin (Naphthalene epoxy resin), benzopyran type epoxy resin.

[0071] The aromatic ester hardener has at least one of the following structural formulas:

[0072]

[0073] ...

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Abstract

The invention relates to a prepreg which is manufactured from heat-proof nonflammable thermosetting resin and glass fiber cloth, wherein the thermosetting resin comprises epoxy resin, an aromatic ester hardener and a fire-retardant compound. The invention also relates to a metal foil substrate which is formed by pressing the prepreg and a metal foil laminated plate. In addition, the prepreg and the metal foil substrate have preferred dielectric property, high heat resistance and fire resistance and lower hygroscopicity.

Description

technical field [0001] The invention discloses a semi-cured film and a metal foil substrate, which can be applied to the field of circuit boards of metal foil laminates and metal foil multilayer laminates. Background technique [0002] The new generation of electronic products tends to be thinner and smaller, and is suitable for high-frequency transmission. Therefore, the wiring of printed circuit boards is becoming more dense, and the selection of materials for circuit boards is becoming more rigorous. High-frequency electronic components are bonded to the circuit board. In order to maintain the transmission rate and maintain the integrity of the transmission signal, the substrate material of the circuit board must have a low dielectric constant (dielectric constant; D k ) and dielectric loss (dissipation factor; D f ). At the same time, in order to maintain the normal operation of electronic components in high temperature and high humidity environments, the circuit board...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/04B32B17/04B32B15/14B32B7/08B32B38/08H05K1/03C08G59/42C08G59/40C08K5/523C08K3/32C08K5/13C08K5/02C08K5/3492C08L63/00C08L63/02C08L63/04C08L67/03
Inventor 余利智林育德周立明彭义仁
Owner ELITE MATERIAL
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