Metal surface plated nickel/gold treatment method of ceramic metalized substrate and manufactured ceramic metalized substrate

A technology of ceramic metallization and nickel-gold electroplating, which is applied in the field of semiconductor manufacturing and ceramic metallization substrates, can solve the problems of decreased reliability of solder joints, very high requirements for solderability and solder joint reliability, and protruding edges of the coating layer. Solve the protruding edge of the coating, suitable for large-scale popularization and application, and the effect of unique and ingenious design
CN102045951AActive Publication Date: 2011-05-04江苏富乐华半导体科技股份有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
江苏富乐华半导体科技股份有限公司
Publication Date
2011-05-04

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Abstract

The invention relates to a metal surface plated nickel / gold treatment method of a ceramic metalized substrate. The method comprises the following steps of: making lines on the ceramic metalized substrate; depositing a metal layer on the ceramic metalized substrate by adopting ceramic metal deposition technology so as to realize the communication of the lines; covering a deposited metal layer in the space between the lines by using nickel / gold plating-resistant special ink so as to form a nickel / gold plating-resistant special ink covering layer; removing residual nickel / gold plating-resistant special ink and the deposited metal layer on the surfaces of the lines; grinding a smooth metal surface with certain roughness for plating nickel / gold; removing the nickel / gold plating-resistant special ink covering layer; and removing the deposited metal layer. The invention also provides the ceramic metalized substrate manufactured by the method. The design of the method is unique and ingenious so as to overcome the defect caused by line surface chemical nickel-gold treatment of the metal layer; the weldability of a bonding pad and the reliability of a welding point are improved greatly; the problem of the noising of a cladding material and the like caused by plating the nickel / gold is solved; and the method is suitable for large-scale popularization and application.
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Description

technical field

[0001] The invention relates to the technical field of semiconductor manufacturing, in particular to the technical field of ceramic metallized substrates, in particular to a method for electroplating nickel-gold on the metal surface of a ceramic metallized substrate and the prepared ceramic metallized substrate. Background technique

[0002] In the PCB industry, there are two types of nickel-gold treatment on the metal surface of the substrate: chemical nickel-gold and electroplating nickel-gold.

[0003] Electroless nickel gold and electroplated nickel gold have the following disadvantages:

[0004] 1. Since the chemical nickel-gold-nickel layer contains about 8% phosphorus, it is often prone to the risk of nickel corrosion and phosphorus-rich layer, which will lead to a decrease in the reliability of solder joints. Some high-end ceramic metallized substrates (such as DBC substrates) have very high requirements for their solderability and reliability of sol...

Claims

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