Metal surface plated nickel/gold treatment method of ceramic metalized substrate and manufactured ceramic metalized substrate

Abstract

The invention relates to a metal surface plated nickel/gold treatment method of a ceramic metalized substrate. The method comprises the following steps of: making lines on the ceramic metalized substrate; depositing a metal layer on the ceramic metalized substrate by adopting ceramic metal deposition technology so as to realize the communication of the lines; covering a deposited metal layer in the space between the lines by using nickel/gold plating-resistant special ink so as to form a nickel/gold plating-resistant special ink covering layer; removing residual nickel/gold plating-resistant special ink and the deposited metal layer on the surfaces of the lines; grinding a smooth metal surface with certain roughness for plating nickel/gold; removing the nickel/gold plating-resistant special ink covering layer; and removing the deposited metal layer. The invention also provides the ceramic metalized substrate manufactured by the method. The design of the method is unique and ingenious so as to overcome the defect caused by line surface chemical nickel-gold treatment of the metal layer; the weldability of a bonding pad and the reliability of a welding point are improved greatly; the problem of the noising of a cladding material and the like caused by plating the nickel/gold is solved; and the method is suitable for large-scale popularization and application.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to the technical field of ceramic metallized substrates, in particular to a method for electroplating nickel-gold on the metal surface of a ceramic metallized substrate and the prepared ceramic metallized substrate. Background technique [0002] In the PCB industry, there are two types of nickel-gold treatment on the metal surface of the substrate: chemical nickel-gold and electroplating nickel-gold. [0003] Electroless nickel gold and electroplated nickel gold have the following disadvantages: [0004] 1. Since the chemical nickel-gold-nickel layer contains about 8% phosphorus, it is often prone to the risk of nickel corrosion and phosphorus-rich layer, which will lead to a decrease in the reliability of solder joints. Some high-end ceramic metallized substrates (such as DBC substrates) have very high requirements for their solderability and reliability of sol...

AI Technical Summary

Problems solved by technology

[0004] 1. Since the chemical nickel-gold-nickel layer contains about 8% phosphorus, it is often prone to nickel corrosion and phosphorus-rich layers, which lead to the risk of decreased reliability of solder joints

Some high-end ceramic metallized substrates (such as DBC substrates) have very high requirements for their solderability and reliability of solder joints, and usually chemical nickel and gold cannot meet their needs

[0005] 2. For ceramic metallized substrates, when the distance between the metal lines is less than 0.20mm, when chemical nickel-gold treatment is performed on the surface of the lines, nickel-gold may be deposited on the ceramics within the line spacing, resulting in a short circuit

The reason is that in the chemical nickel-gold process, because the line gap is too small, it is difficult to clean thoroughly, resulting in the residual metal ions in the gap being deposited on n

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