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Modified epoxy resin, epoxy resin compositions and cured articles

A technology of epoxy resin and composition, which is applied in the direction of electric solid-state devices, semiconductor/solid-state device components, electrical components, etc., and can solve the problems of small effect, improvement, and poor workability

Active Publication Date: 2011-06-01
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these epoxy resins having a mesogenic group are highly crystalline epoxy compounds having a rigid structure such as a biphenyl structure, an azomethine structure, and a substantially single epoxy compound without a molecular weight distribution having a high melting point. , so there is a disadvantage of poor workability when forming an epoxy resin composition
Furthermore, in the cured state, in order to effectively orient the molecules, it is necessary to apply a strong magnetic field to make it solidified, and in order to be widely used in industry, there are great restrictions on equipment.
In addition, currently, in a mixed system with an inorganic filler, the thermal conductivity of the inorganic filler is overwhelmingly higher than that of the matrix resin, and even if the thermal conductivity of the matrix resin itself is increased, the The improvement of thermal conductivity as a composite material does not contribute much, and a sufficient thermal conductivity improvement effect cannot be obtained
Moreover, it is generally recognized that the improvement of thermal conductivity is the improvement of the thermal conductivity of the resin. In the case of a mixed system with a filler, when the filler is sufficiently present, the thermal conductivity of the filler is overwhelmingly high. Therefore, the thermal conductivity of the resin No matter how high or low, the effect is small
[0009] Patent Document 9 discloses an epoxy resin composition that effectively disperses and reduces the load applied to the connecting electrode portion of a semiconductor device in which a semiconductor element is flip-chip mounted, even in a sealing resin layer. Conductivity of semiconductor devices can be ensured even under harsh environmental conditions such as temperature cycles, but as epoxy resins, only hydroquinone-type epoxy resins with tert-butyl groups and biphenyl-type epoxy resins with methyl groups have been disclosed. Wait

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0069] The present invention will be described more specifically by way of examples below.

reference example 1

[0071] 150.0 g of hydroquinone was dissolved in 1260 g of epichlorohydrin and 120 g of diglyme, and 22.7 g of 48% sodium hydroxide was added at 60° C. and stirred for 1 hour. Thereafter, 204.5 g of a 48% aqueous sodium hydroxide solution was added dropwise over 3 hours under reduced pressure (about 130 Torr). During this period, the generated water is discharged out of the system through azeotropy with epichlorohydrin, and the distilled epichlorohydrin is returned to the system. After completion of the dropwise addition, the reaction was continued for 1 hour to dehydrate, then epichlorohydrin was distilled off, and 600 g of methyl isobutyl ketone was added, followed by washing with water to remove the salt. Thereafter, 20.0 g of 48% sodium hydroxide was added at 85° C., stirred for 1 hour, and washed with 200 mL of warm water. Thereafter, after water was removed by liquid separation, methyl isobutyl ketone was distilled off under reduced pressure to obtain 278 g of a white cr...

reference example 2

[0073] Dissolve 100.0 g of 4,4'-dihydroxybiphenyl in 700 g of epichlorohydrin and 105 g of diglyme, and then dropwise add 48% hydroxide at 60°C for 3 hours under reduced pressure (about 130 Torr) Sodium aqueous solution 87.8g. During this period, the generated water is discharged out of the system through azeotropy with epichlorohydrin, and the distilled epichlorohydrin is returned to the system. After completion of the dropwise addition, the reaction was continued for 1 hour for dehydration, then cooled to normal temperature, and the precipitate was recovered by filtration. Thereafter, the precipitate was washed with water to remove the salt, and dried to obtain 137 g of a crystalline powdery epoxy resin. The epoxy equivalent is 163, and the melting point measured by the capillary method is 169°C to 175°C. The ratio of each component in the general formula (1) obtained by GPC measurement of the obtained resin was 93.7% for n=0 and 5.9% for n=1.

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Abstract

The present invention discloses a modified epoxy resin which exhibits excellent handleability in a solid state at ordinary temperatures and exerts an excellently low viscosity at a molding temperature; epoxy resin compositions which each comprise the modified epoxy resin and an inorganic filler and which can give cured articles exhibiting high thermal conductivity, low thermal expansion, and excellent heat resistance and moisture resistance; and cured epoxy resin articles made by using the compositions. The modified epoxy resin can be prepared by reacting a mixture of hydroquinone and 4, 4'-dihydroxybiphenyl at a weight ratio of 0.1 to 10.0 with epichlorohydrin, and is in a crystalline state at ordinary temperatures. The epoxy resin compositions each comprises (A) an epoxy resin component, (B) a curing agent, and (C) an inorganic filler as the main components, with the epoxy resin component (A) containing the modified epoxy resin in an amount of 50wt% or above.

Description

technical field [0001] The present invention relates to the modification of crystallinity which is excellent in solid state at room temperature, has excellent handling properties, and is excellent in low viscosity at the time of molding, and is useful as insulating materials for electrical and electronic parts such as semiconductor sealing, laminated boards, and heat dissipation substrates, which are excellent in reliability. Epoxy resin, epoxy resin composition using the same, and cured product obtained therefrom. Background technique [0002] Conventionally, as methods for sealing electrical and electronic components such as diodes, transistors, and integrated circuits, and semiconductor devices, for example, sealing methods using epoxy resins, silicone resins, etc., and vacuum sealing methods using glass, metal, ceramics, etc. have been used. In recent years, resin sealing by transfer molding, which can be mass-produced while improving reliability and is cost-effective, h...

Claims

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Application Information

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IPC IPC(8): C08G59/06C08G59/62H01L23/29H01L23/31
CPCH01L23/295C08L63/00C08G59/621H01L2924/09701H01L23/293H01L2924/0002
Inventor 梶正史大神浩一郎福永智美
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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