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Low-temperature conductive silver paste and preparation method thereof

A conductive silver paste, low temperature technology, applied in cable/conductor manufacturing, conductive layer on insulating carrier, conductive material dispersed in non-conductive inorganic materials, etc., can solve the problems of high cost and high resistance of conductive silver paste, Achieve good strength, low resistance, good matching effect

Active Publication Date: 2011-08-17
CHENGDU BANKNOTE PRINTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006]The purpose of the present invention is to solve the problem of high cost and high resistance of the conductive silver paste used in the printing industry, to improve a kind of high quality and low price, stable performance, which can be widely used in Conductive silver paste on PET, PC, PI and other film substrates

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A low-temperature conductive silver paste for membrane switches, the silver paste includes the following components by weight percentage:

[0037] Silver Powder 45%

[0038] Additive bismuth oxide 6%

[0039] Polymer resin vinyl chloride 6.2%

[0040] Polymer resin polyester 6.2%

[0041] Solvent DBE 34%

[0042] Solvent isophorone 2.6%

[0043] DBE is a mixture of three dibasic esters: dimethyl succinate CH3OOC(CH2)2COOCH3 (10-15%), dimethyl glutarate CH3OOC(CH2)3COOCH3 (55-56%) and butane Dimethyl diacid CH3OOC(CH2)4COOCH (15-25%) is a combination of three solvents, DBE is a non-toxic, colorless and transparent liquid with a faint aroma of ester and has super-solubility.

[0044] The manufacturing method of the conductive silver paste for the above-mentioned membrane switch comprises the following process steps:

[0045] a. The solvent DBE, isophorone, and polymer resin are weighed and mixed by weight percentage to obtain an organic carrier;

[0046] b. mixing ...

Embodiment 2

[0052] A low-temperature conductive silver paste for membrane switches, the silver paste includes the following components by weight percentage:

[0053] Silver Powder 55%

[0054] Additive bismuth oxide 1.2%

[0055] Polymer resin Vinyl chloride 5.0%

[0056] Polymer resin polyester 5.0%

[0057] Solvent DBE 31.5%

[0058] Solvent isophorone 2.3%

[0059] Its preparation method is as embodiment 1.

Embodiment 3

[0061] A low-temperature conductive silver paste for membrane switches, the silver paste includes the following components by weight percentage:

[0062] Silver Powder 60%

[0063] Additive bismuth oxide 1.0%

[0064] Polymer resin Vinyl chloride 4.5%

[0065] Polymer resin polyester 4.5%

[0066] Solvent DBE 28%

[0067] Solvent isophorone 2%

[0068] Its preparation method is as embodiment 1.

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Abstract

The invention discloses a low-temperature conductive silver paste and a preparation method thereof, relating to conductive silver paste materials and aiming at solving the problems of high cost and large resistance of conductive silver pastes used for a printing industry. The low-temperature conductive silver paste comprises the following components in percentage by weight: 45% of silver powder, 6% of additive bismuth oxide, 6.2% of macromolecule resin vinyl chloride-acetate, 6.2% of macromolecule resin polyester, 34% of solvent DBE and 2.6% of solvent isophorone. The preparation method comprises the following steps of: a, weighing and mixing the solvent DBE, the solvent isophorone and macromolecule resins according to weight percentage to obtain an organic carrier; b, weighing the silver powder and the additives according to the weight percentage, and then mixing with the organic carrier obtained from the step a in a stirring way to obtain a uniform paste; and c, grinding and rolling the paste obtained from the step b to obtain the low-temperature conductive silver paste.

Description

technical field [0001] The invention relates to a conductive silver paste and a preparation method of the conductive silver paste. Background technique [0002] Low-temperature conductive silver paste is a high-tech field integrating powder metallurgy, electronics, chemical industry and many other fields. research on the role. [0003] The low-temperature conductive silver paste used on different substrates needs to correspond to different organic adhesives. In the printing industry, PET (polyester), PC (polycarbonate), PI (polyimide) and other film substrates , through screen printing and drying to form the inner layer of silver paste on the upper and lower substrates. When pressure is applied to the upper sheet, the upper and lower layers realize electrical contact and connect the relevant circuits at the bottom. [0004] Low temperature conductive silver paste is composed of conductive filler, organic polymer system, solvent and additives. [0005] The currently used s...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00H01B5/14
Inventor 杨玉祥詹刚王刚张小丽
Owner CHENGDU BANKNOTE PRINTING
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