Method for making high-frequency aluminium-based circuit board

A production method and circuit board technology, applied in the direction of circuit substrate materials, printed circuit manufacturing, printed circuits, etc., can solve the problem of affecting the signal transmission performance of client products, not suitable for high-frequency aluminum-based Teflon materials, board edges and apertures Deformation and other problems, to improve product quality and work efficiency, smooth milling edge, stable performance

Active Publication Date: 2011-08-17
TAIZHOU JINDING ELECTRONICS
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Problems solved by technology

However, the current production method of high-frequency aluminum-based circuit boards still uses the production method and process of ordinary epoxy resin aluminum-based circuit boards, but it is not suitable for the characteristics of high-frequency aluminum-based Teflon materials, and its board edges and apertures are easy to cause Deformation and blackening affect the signal transmission performance of client products

Method used

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  • Method for making high-frequency aluminium-based circuit board
  • Method for making high-frequency aluminium-based circuit board

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Embodiment Construction

[0008] in figure 1 Among them, the present invention is a method for manufacturing a high-frequency aluminum-based circuit board, which includes the following steps: Step 1, light-painting template production: first, the template is graphically designed and the engineering file is processed in accordance with the production process parameters. The document is imposition, the black film is produced by a high-precision laser light plotter with a resolution of 20240dpi, the light-drawn film is washed, developed, fixed, washed, and air-dried, and then the drawn film is processed with a 200x magnifying glass Check, and finally use the 3KW exposure machine to copy the diazo film with the checked negative as the mother, and check the copied diazo film. Step two, the production of cutting and drilling: first use an electric shearing machine to open the high-frequency aluminum-based copper clad laminate required for production according to the size requirements, and then clad the board ...

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Abstract

The invention discloses a method for making a high-frequency aluminium-based circuit board. The method comprises the following steps of: 1, making a photo-plotted template; 2, cutting and drilling holes; 3, making surface patterns; 4, electroplating and etching; 5, carrying out welding preventing and character and surface weldable processing; and 6, molding to make the high-frequency aluminium-based circuit board. The making accuracy of the method is high, the product quality and the work efficiency are effectively improved, and the performance of the made high-frequency aluminium-based circuit board is stable.

Description

Technical field [0001] The invention relates to a manufacturing method of a high-frequency aluminum substrate. Background technique [0002] With the development of electronic products in the direction of miniaturization, digitalization, high frequency, and high reliability, high-frequency metal-based circuit boards have excellent high heat resistance, high heat dissipation, and excellent dimensional stability in addition to ordinary metal-based circuit boards. In addition to performance, it has high frequency, and the insulating dielectric layer has good strength, flexibility and high breakdown voltage resistance. However, the current production methods of high-frequency aluminum-based circuit boards still follow the production methods and processes of ordinary epoxy resin aluminum-based circuit boards, but they are not suitable for the characteristics of high-frequency aluminum-based Teflon materials, and the board edges and apertures are easy to cause Deformation and blackeni...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K1/05
Inventor 蔡新民
Owner TAIZHOU JINDING ELECTRONICS
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