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SiC ring electrode PIN-type nuclear battery

A nuclear battery and miniature technology, applied in the field of microelectronics, can solve problems such as energy loss and lower energy conversion efficiency, and achieve the effects of reducing blocking effect, improving energy conversion efficiency, and avoiding recombination

Active Publication Date: 2013-09-25
陕西半导体先导技术中心有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this p-i-n junction structure, in order to prevent the ohmic contact electrode from blocking incident particles, the ohmic electrode must be overloaded in one corner of the device, but this will cause the irradiated carriers far away from the ohmic electrode to be recombined during the transport process, Moreover, the incident particles must pass through the surface SiO 2 Passivation layer, causing energy loss and reducing energy conversion efficiency

Method used

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  • SiC ring electrode PIN-type nuclear battery

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] In the first step, a low-doped n-type epitaxial layer is epitaxially grown on a SiC highly doped n-type substrate sample, such as image 3 a.

[0036] The selected doping concentration is 1×10 18 cm -3 After cleaning, the highly doped n-type SiC substrate sample 7 is epitaxially grown on the highly doped n-type SiC substrate sample with a thickness of 3 μm, and the n-type low-doped epitaxial layer 6 doped with nitrogen ions has a doping concentration of 1×10 15 cm -3 , the epitaxy temperature is 1570°C, the pressure is 100mbar, the reaction gas is silane and propane, the carrier gas is pure hydrogen, and the impurity source is liquid nitrogen.

[0037] Step 2: Epitaxial growth of highly doped p-type epitaxial layer, such as image 3 b.

[0038] The p-type epitaxial layer 5 doped with aluminum ions is epitaxially grown on the low-doped epitaxial wafer with a thickness of 0.5 μm, and its doping concentration is 2×10 19 cm -3 , the epitaxy temperature is 1570°C, th...

Embodiment 2

[0056] Step 1: Epitaxial low-doped n-type epitaxial layer on the SiC highly doped n-type substrate sample, such as image 3 a.

[0057] A highly doped n-type SiC substrate sample 7 is selected, and its doping concentration is 5×10 18 cm -3 , after cleaning, the epitaxial growth thickness of the highly doped n-type SiC substrate sample is 4 μm when the epitaxial temperature is 1570 ° C, the pressure is 100 mbar, the reaction gas is silane and propane, the carrier gas is pure hydrogen, and the impurity source is liquid nitrogen. , n-type low-doped epitaxial layer 6 doped with nitrogen ions, and its doping concentration is 3×10 15 cm -3 .

[0058] Step 2: Epitaxial growth of highly doped p-type epitaxial layer, such as image 3 b.

[0059] The epitaxial growth doping concentration on the low-doped epitaxial layer is 2×10 19 cm -3 , with a thickness of 0.3 μm, aluminum ion-doped p-type epitaxial layer 5, the epitaxial temperature is 1570° C., the pressure is 100 mbar, the ...

Embodiment 3

[0077]In step A, a low-doped n-type epitaxial layer is epitaxially grown on a SiC highly-doped n-type substrate sample, such as image 3 a.

[0078] The doping concentration will be selected as 7×10 18 cm -3 After cleaning the n-type highly doped SiC substrate sample 7, the epitaxial growth thickness is 5 μm, and the doping concentration is 5×10 15 cm -3 The n-type low nitrogen-doped ion epitaxial layer 6, the epitaxial growth process conditions are: the epitaxial temperature is 1570°C, the pressure is 100mbar, the reaction gas is silane and propane, the carrier gas is pure hydrogen, and the impurity source is liquid nitrogen.

[0079] Step B: Epitaxial growth of highly doped p-type epitaxial layer, such as image 3 b.

[0080] A p-type epitaxial layer 5 with a thickness of 0.2 μm doped with aluminum ions is epitaxially grown on the low-doped epitaxial layer, and its doping concentration is 5×10 19 cm -3 , the epitaxy temperature is 1570°C, the pressure is 100mbar, the ...

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Abstract

The invention discloses a SiC ring electrode PIN-type nuclear battery and a manufacturing method thereof, which are mainly used for solving the problem that the conversion efficiency of the SiC PIN-junction battery in the prior art is lower. The SiC ring electrode PIN-type nuclear battery comprises a radioactive isotope source layer (1), a SiO2 passivation layer (3), a SiO2 compact insulation layer (2), a p-type ohmic contact electrode (4), a p-type SiC epitaxial layer (5) with the doping concentration of 1*1019-5*1019cm<-3>, an n-type SiC epitaxial layer (6) with the doping concentration of 1*1015-5*1015cm<-3>, an n-type SiC substrate (7) with the doping concentration of 1*1018-7*1018cm<-3> and an n-type ohmic contact electrode (8). A plurality of ring structures the centers of which arerings and the peripheries of which take the centers as circle centers are adopted in the p-type ohmic contact electrode, the rings are connected through a plurality of rectangular strips, a pluralityof pins are reserved on the peripheries of the rings, and the isotope source layer (1) covers the surface of the p-type ohmic contact electrode (4). The SiC ring electrode PIN-type nuclear battery has the advantage of high energy conversion efficiency and can be used as an MEMS (Micro-electromechanical System) on-chip power supply, a cardiac pacemaker power supply and a mobilephone standby power supply.

Description

technical field [0001] The invention belongs to the field of microelectronics, and in particular relates to a PIN nuclear battery based on a silicon carbide ring electrode, which can be used to directly convert nuclear energy emitted by isotopes into electric energy. technical background [0002] In 1953, Rappaport discovered that the beta (β-Particle) particles produced by the decay of isotopes can generate electron-hole pairs in semiconductors. This phenomenon is called β-Voltaic Effect. Shortly thereafter, Elgin-Kidde first used the β-Voltaic Effect in power supply in 1957, and successfully manufactured the first isotope micro-battery β-Voltaic Battery. Since 1989, GaN, GaP, AlGaAs, polysilicon and other materials have been used as materials for β-Voltaic batteries. With the advancement of the preparation and process technology of SiC, a wide bandgap semiconductor material, since 2006, there have been reports on SiC-based isotope batteries in the world. [0003] The doc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G21H1/06
Inventor 郭辉张玉娟张玉明石彦强
Owner 陕西半导体先导技术中心有限公司
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