A kind of silicone potting glue and its preparation method and application

A silicone potting compound and silicone rubber technology, applied in chemical instruments and methods, adhesives, other chemical processes, etc., can solve the problems of heavy metal poisoning, local curing failure, poor adhesion, etc., to avoid metal poisoning, The effect of good operation performance and good applicability

Active Publication Date: 2011-12-28
马鞍山海鹰新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The general condensation type has poor adhesion to components and potting chambers, and volatile low molecular substances will be produced during the curing process, and there will be obvious shrinkage after curing, and the existing products in the domestic market are all two-component high-quality products. Ratio (that is, the amount of curing agent component is very small), for application manufacturers, it is difficult to grasp the weighing when using a small amount of high ratio, the error is too large, and it is difficult to judge whether the mixing is uniform, and it is also difficult to cooperate with automatic sizing equipment due to the high ratio
In many applications, there is also metal corrosion, which is characterized by, for example, contact with copper metal, which will cause patina in the later stage, causing unsafe factors to the stability of the line
[0006] Addition type (also known as silicone gel) has extremely small shrinkage rate, no low molecules are produced during the curing process, and can be heated and cured quickly, but the production cost is high, and the production control process is relatively high. In the process of use, heavy metal poisoning is prone to occur. , leading to local curing failure, as an electronic potting glue, it is inevitable to come into contact with heavy metals in soldering pins, electronic components and other parts, so it is not suitable for some products with high technical requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] A method for preparing a silicone potting compound suitable for insulating and heat-conducting circuit boards, the method comprising the following process steps:

[0054] a, preparation component A

[0055] (1) Prepare raw materials according to the following content: 15kg hydroxy silicone oil, wherein the molar fraction of methyl group is 1000g / mol, 20kg viscosity is 3000mpa s room temperature vulcanized silicone rubber, 20kg surface treatment aluminum hydroxide, 40kg aluminum oxide, 0.086 kg catalyst dibutyltin dilaurate;

[0056] (2) Put hydroxyl silicone oil and room temperature vulcanized silicone rubber into the reaction kettle, heat to 30°C and stir;

[0057] (3) Keep stirring and put the functional filler into the reaction kettle, the functional filler is a mixture of surface-treated aluminum hydroxide and aluminum oxide, seal the reaction kettle, heat and stir in vacuum for 5h;

[0058] (4) After mixing evenly, strictly calculate the required amount of cataly...

Embodiment 2

[0067] A method for preparing a silicone potting compound suitable for insulating and heat-conducting circuit boards, the method comprising the following process steps:

[0068] a, preparation component A

[0069] (1) Prepare raw materials according to the following content: 20kg hydroxysilicone oil, wherein the molar fraction of methyl group is 2000g / mol, 25kg viscosity is room temperature vulcanized silicone rubber of 3000mpa s, 60kg surface treatment aluminum hydroxide, 0.5kg chloroplatinic acid , 0.073kg catalyst n-butyl titanate;

[0070] (2) put hydroxy silicone oil and room temperature vulcanized silicone rubber into the reaction kettle, heat to 60°C and stir;

[0071] (3) Keep stirring and put the functional filler into the reactor, the functional filler is a mixture of surface-treated aluminum hydroxide and chloroplatinic acid, seal the reactor, and heat and stir in vacuum for 10 hours;

[0072] (4) After mixing evenly, strictly calculate the required amount of cata...

Embodiment 3

[0081] A method for preparing a silicone potting compound suitable for insulating and heat-conducting circuit boards, the method comprising the following process steps:

[0082] a, preparation component A

[0083] (1) Prepare raw materials according to the following content: 15kg hydroxy silicone oil, wherein the molar fraction of methyl group is 1500g / mol, 15kg room temperature vulcanized silicone rubber with a viscosity of 3000mpa s, 40kg surface treatment aluminum hydroxide, 0.01kg catalyst diisocyanate Titanium propoxide bis(ethyl acetoacetate) chelate;

[0084] (2) Put hydroxyl silicone oil and room temperature vulcanized silicone rubber into the reaction kettle, heat to 40°C and stir;

[0085] (3) keep stirring and put the functional filler into the reactor, the functional filler is surface-treated with aluminum hydroxide, seal the reactor, heat and stir in vacuum for 8 hours;

[0086] (4) After mixing evenly, strictly calculate the required amount of catalyst, put 0.0...

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PUM

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Abstract

The invention relates to an organic silicon pouring sealant, a preparation method and application thereof. The organic silicon pouring sealant comprises a component A and a component B. The preparation method comprises the steps of: respectively preparing the component A and the component B according to the requirement of a formula, cooling to room temperature, during the application, and statically mixing the component A and the component B according to the weight ratio of 1: (1-1.2) for 20-30min to ensure that the component A is uniformly mixed with the component B to obtain the organic silicon pouring sealant. Compared with the prior art, the organic silicon pouring sealant has excellent applicability to various materials without metal corrosion, can achieve insulation, heat conductionand inflaming retarding requirements according to the requirements without damaging electronic components, has better operating performance, is easy to blend, and is suitable for encapsulation production application of a manual or general sealant injection device.

Description

technical field [0001] The invention relates to a potting glue and its preparation method and application, in particular to a silicone potting glue and its preparation method and application. Background technique [0002] Silicone potting products refer to a type of electronic potting compound made of silicone rubber, which are generally soft and elastic. [0003] There are many types of silicone potting adhesives, and different types of silicone potting adhesives have great differences in temperature resistance, waterproof performance, insulation performance, optical properties, adhesion to different materials, and hardness. Some functional fillers can be added to the silicone potting compound to endow it with properties such as electrical conductivity, thermal conductivity, and magnetic conductivity. The mechanical strength of silicone potting glue is generally relatively poor, and it is precisely because of this property that it can be "breakable" for easy maintenance. I...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C09J183/06C09K3/10
Inventor 李厚堂张俊灏樊利东曹钢
Owner 马鞍山海鹰新材料有限公司
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