Photosensitive resin composition

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve the problems of inability to produce alkali, etc., and achieve the effect of effective photosensitivity and excellent deep curability
CN102307909AInactive Publication Date: 2012-01-04SAN APRO
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SAN APRO
Publication Date
2012-01-04
Estimated Expiration
Not applicable · inactive patent

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Abstract

Provided is a photosensitive resin composition which is efficiently activated by light having a wavelength of from 350 nm to 500 nm and has excellent thick-film curability and deep curability. The photosensitive resin composition contains: (A) a photobase generator which is a compound represented by formula (1) or (2) and generates a base by irradiation of an active light ray; (B) a thermal radical polymerization initiator; and (C) a radical polymerizable substance. In formulae (1) and (2), Ar represents an aromatic hydrocarbon group or a heterocyclic group, which has at least one benzene skeleton and may be substituted by a halogen atom or the like; R1 and R2 each independently represent an alkyl group having 1 to 20 carbon atoms or the like; m represents an integer of 2 to 4; R3 to R5 each independently represent an alkyl group having 1 to 20 carbon atoms, a phenyl group, or a naphthyl group, which may be substituted by a halogen atom or the like; and X- represents an anion. The formula (1) is shown in the description.
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Description

technical field

[0001] The present invention relates to a photosensitive resin composition. More specifically, it relates to a photosensitive resin composition excellent in thick film curability. The photosensitive resin composition can be suitably used in coatings, printing inks, coating agents, molding materials (such as materials for MEMS), resist materials, nanoimprint materials, adhesives, sealants, optical Molding materials for parts or molding materials for building materials. Background technique

[0002] In recent years, in the fields of coatings, printing inks, coating agents, molding materials (such as materials for MEMS), resist materials, nanoimprint materials, adhesives, sealants, or molding materials, the use of electron beams Photosensitive resins cured by active light rays such as , ultraviolet rays, and visible rays have been studied. This is because the photosensitive resin has the advantages of short-time curing and solvent-free, which are not availabl...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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