Photosensitive resin composition

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve the problem of not being able to generate alkali, etc., and achieve the effect of effective photosensitivity and excellent deep curability

Inactive Publication Date: 2014-05-07
SAN APRO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

), so the previous photobase generators could not produce base

Method used

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  • Photosensitive resin composition
  • Photosensitive resin composition
  • Photosensitive resin composition

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Embodiment

[0072] Hereinafter, the present invention will be specifically described by way of examples and production examples, but the present invention is not limited thereto. Hereinafter, parts represent parts by weight.

[0073] [Manufacture of photobase generator (A)]

manufacture example 1

[0075] Synthesis of 8-(9-anthracenemethyl)-1,8-diazabicyclo[5.4.0]-7-undecenium tetraphenylborate (A1-1)

[0076] In a 50 ml eggplant-shaped flask, 2.0 g of 9-chloromethylanthracene (Aldrich Co.) was dissolved in chloroform, and 1.3 g of 1,8-diazabicyclo[5.4.0]-7-deca One ene (it was found to have a certain degree of heat generation after the addition), directly stirred at room temperature (about 25°C) for 1 hour to obtain a reaction solution. Into the aqueous solution consisting of 4.0 g of sodium tetraphenylborate and 40 g of water added to a 100 ml eggplant-shaped flask, the obtained reaction liquid was added drop by bit, and then stirred at room temperature (about 25 ° C) for 1 hour, Then, the aqueous layer was removed by liquid separation, and the organic layer was washed with water three times. The organic layer was concentrated by an evaporator to obtain 5.4 g of a white solid. This white solid was recrystallized with acetonitrile, and 4.7 g of photobase generators (A...

manufacture example 2

[0078] Synthesis of 1-(9-anthracenemethyl)-1-azabicyclo[2.2.2]octanium tetraphenylborate (A1-2)

[0079] Except changing "1.3 g of 1,8-diazabicyclo[5.4.0]-7-undecene" to "1.0 g of 1-azabicyclo[2.2.2]octane", by making In the same way as Example 1, 4.4g of photobase generator (A1-2) (white solid) was obtained. pass 1 The result of H-NMR analysis is {300MHz, DMSO-d6, δ (ppm): 8.9 (s, 1H), 8.7 (d, 2H), 8.2 (d, 2H), 7.7 (t, 2H), 7.6 (t , 2H), 7.3-7.1(m, 8H), 7.0-6.9(m, 8H), 6.9-6.8(m, 4H), 5.6(s, 2H), 3.6-3.4(m, 6H), 1.9(m , 1H), 1.8-1.6(m, 6H)}. This white solid was confirmed to be 1-9-anthracenemethyl-1-azabicyclo[2.2.2]octanium tetraphenylborate (A1-2).

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Abstract

Provided is a photosensitive resin composition which is efficiently activated by light having a wavelength of from 350 nm to 500 nm and has excellent thick-film curability and deep curability.  The photosensitive resin composition contains: (A) a photobase generator which is a compound represented by formula (1) or (2) and generates a base by irradiation of an active light ray; (B) a thermal radical polymerization initiator; and (C) a radical polymerizable substance.  In formulae (1) and (2), Ar represents an aromatic hydrocarbon group or a heterocyclic group, which has at least one benzene skeleton and may be substituted by a halogen atom or the like; R1 and R2 each independently represent an alkyl group having 1 to 20 carbon atoms or the like; m represents an integer of 2 to 4; R3 to R5 each independently represent an alkyl group having 1 to 20 carbon atoms, a phenyl group, or a naphthyl group, which may be substituted by a halogen atom or the like; and X- represents an anion.

Description

technical field [0001] The present invention relates to a photosensitive resin composition. More specifically, it relates to a photosensitive resin composition excellent in thick film curability. The photosensitive resin composition can be suitably used in coatings, printing inks, coating agents, molding materials (such as materials for MEMS), resist materials, nanoimprint materials, adhesives, sealants, optical Molding materials for parts or molding materials for building materials. Background technique [0002] In recent years, in the fields of coatings, printing inks, coating agents, molding materials (such as materials for MEMS), resist materials, nanoimprint materials, adhesives, sealants, or molding materials, the use of electron beams Photosensitive resins cured by active light rays such as , ultraviolet rays, and visible rays have been studied. This is because the photosensitive resin has the advantages of short-time curing and solvent-free, which are not availabl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F4/40C07C211/63C07D335/16C08F2/46G03F7/031C07D487/04C07F5/02
CPCC08F4/34C08F2/50C07D487/04G03F7/031C07C5/02C07C211/63C07D335/16C08F4/40G03F7/028G03F7/032G03H1/02
Inventor 向井孝夫榊原德
Owner SAN APRO
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