High-performance thin film resistor and preparation method thereof
A thin-film resistor, high-performance technology, applied in the direction of resistor manufacturing, resistors, resistor components, etc., can solve the problems of high price of imported products, increase product cost, and limit the scope of application, etc., to achieve easy implementation and strong adhesion , a wide range of effects
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Embodiment 1
[0025] Embodiment 1 of the present invention: the structure of high performance thin film resistor is as figure 1 As shown, an insulating substrate 4 is made of sapphire as a material, and a resistive film 3 with a thickness of 1 μm is produced on the insulating substrate 4 by using tantalum nitride. Lead-out electrodes 1 are arranged on both sides of each resistive film 3, and each The top surface of the resistance film 3 both sides edge is provided with top electrode 5, and the production material of lead-out electrode 1 and top electrode 5 is tantalum, and their thickness is 1 μm, on the top surface of resistance film 3 and the top surface of top electrode 5 An insulating protective film 2 with a thickness of 0.5 μm made of silicon dioxide is provided on it.
[0026] A method for manufacturing high-performance thin-film resistors, laying a mask for depositing a resistive film on a clean sapphire insulating substrate 4, and depositing a resistive film 3 on the insulating sub...
Embodiment 2
[0027] Embodiment 2 of the present invention: the structure of high performance thin film resistor is as figure 1 As shown, an insulating substrate 4 is made of ordinary alumina as a material, and a resistive film 3 with a thickness of 0.5 μm is fabricated on the insulating substrate 4 using a nickel-chromium alloy, and lead-out electrodes 1 are provided on both sides of each resistive film 3 , top electrodes 5 are arranged on the top surface of each resistance film 3 both sides edges, and the materials of lead-out electrodes 1 and top electrodes 5 are copper, and their thickness is 0.5 μm. The top surface of the electrode 5 is provided with an insulating protective film 2 with a thickness of 1 μm made of silicon nitride.
[0028] A method for manufacturing high-performance thin-film resistors, laying a mask for depositing a resistive film on a clean alumina insulating substrate 4, and depositing a resistive film 3 on the insulating substrate 4 using a magnetron sputtering met...
Embodiment 3
[0029] Embodiment 3 of the present invention: the structure of high performance thin film resistor is as figure 1 As shown, silicon dioxide is included as a material to make an insulating substrate 4, and a composite layer with a thickness of 1.5 μm is made on the insulating substrate 4 with a combination of iron nitride and nickel-chromium alloy as a resistive film 3, and each resistive film 3 Both sides of each resistance film 3 are provided with lead-out electrodes 1, and top electrodes 5 are arranged on the top surface of each resistance film 3. The materials for making lead-out electrodes 1 and top electrodes 5 are Nb-Ag alloys, and their thicknesses are 1.5 μm, on the top surface of the resistive thin film 3 and the top surface of the top electrode 5, an insulating protection film 2 with a thickness of 1.2 μm made of silicon nitride is provided.
[0030]A method for manufacturing high-performance thin-film resistors, laying a mask for depositing a resistive thin film on ...
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