Structure of surface mount device micro electromechanical oscillator and manufacturing method thereof

Abstract

The invention relates to a manufacturing method of a surface mount device micro electromechanical oscillator and a structure thereof. According to the invention, there are following advantages: 1, batch manufacture of the surface mount device micro electromechanical oscillator is realized in a micro electromechanical mode; 2, the oscillator can be completely integrated with an integrated circuit element; 3, the oscillator integrated with other electronic crystal grains can be packaged into a same integrated circuit, so that a usage quantity of a single electronic element can be effectively reduced and manufacturing costs can be substantially reduced; 4, a production precision of a design on a special gluing area is improved, thereby reducing occurrences of glue-spilling or empty glue situations and reducing an unqualified rate.

Description

technical field [0001] The invention relates to a structure and a manufacturing method of a surface mount (Surface Mount Device, SMD) microelectromechanical (Micro ElectroMechanical Systems, MEMS) oscillator, especially suitable for improving manufacturing efficiency, and can be combined with a microprocessor controller (Microprocessor control unit , MCU) grain (Die) integrated packaging to reduce the use of external components in product design, and simplify the technical field of electronic product manufacturing processes. Background technique [0002] With the advancement of science and technology, as long as timing signals are required, or products used to stabilize the frequency of radio transmitters, oscillators are required as their signal sources, such as televisions (TVs), radios (Radios), personal computers (PCs), printers ( Printer), Network Interface Card, Bluetooth Products, Mobile Phone, etc. [0003] The types of oscillators mainly include RC oscillators, RLC...

AI Technical Summary

Problems solved by technology

[0005] The current manufacturing method of SMD quartz oscillator is to use a single ceramic base with a metal upper cover, or both the base and the upper cover are made of ceramic materials to complete the quartz oscillator sub-package operation, which consumes a lot of power when packaging. Soldering is carried out, and because the coefficient of thermal expansion (Coefficient of thermal expansion, CTE) of the material of the base and the upper cover is different, it is easy to cause poor airtightness of the negative pressure chamber after the packaging is completed, and the oscillator works unstable or stops oscillating; and the oscillator is integrated with the When the circuit is integrated, because the material of the oscillator base and the upper cover is not the same as that of the integrated circuit, it increases the difficulty of integration. In addition, if it needs to be directly inserted into the integrated circuit, an additional machine needs to be added, so an additional manufacturing cost

[0006] It can be seen that the above-mentioned existing manufacturing technology still has many deficiencies, is not a good designer, and needs to be improved urgently.

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