Heat conduction insulating material, heat conduction insulating strip and preparation method thereof

A heat-conducting insulating material and heat-conducting insulating technology are applied in the fields of heat-conducting insulating materials, heat-conducting insulating sheets and preparing the heat-conducting insulating materials and heat-conducting insulating sheets, and can solve the problem of damage to material properties and insulating properties, increase in cost, and low surface energy of heat-conducting insulating materials, etc. problems, to achieve the effect of simplifying the preparation process and cost, good thermal conductivity and insulation performance, and ensuring insulation

Active Publication Date: 2012-03-14
TIANJIN LAIRD TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method brings many disadvantages. On the one hand, the surface energy of the thermally conductive insulating material is very low, and the tape cannot be directly pasted on the surface. Expensive silicone tape or additional corona treatment is required to improve the surface energy of the thermally conductive insulating material. Then stick it to the surface with tape
The use of silicone tape will undoubtedly increase the cost, and the corona process will easily damage the material properties, especially the insulation properties.
On the other hand, the thermal conductivity of the double-sided tape is very low, so that the overall thermal conductivity of the thermally conductive insulating material is reduced.
At the same time, the current technology is difficult to use adhesive tape on both sides of the thermal insulation material to make both sides of the material sticky, thus limiting the application range of the thermal insulation material

Method used

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  • Heat conduction insulating material, heat conduction insulating strip and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] In the thermally conductive insulating material provided in this embodiment, the polymer matrix material is vinyl silicone resin, and the tackifying additive is vinyl MQ silicone resin.

[0021] In a specific example, the thermally conductive insulating material includes: 4 parts by weight of vinyl silicone resin, 1 part by weight of vinyl MQ silicone resin and 40 parts by weight of alumina particles with different particle sizes.

[0022] In another specific example, the thermally conductive insulating material includes: 20 parts by weight of vinyl silicone resin, 10 parts by weight of vinyl MQ silicone resin and 70 parts by weight of alumina particles with different particle sizes.

[0023] In another specific example, the thermally conductive insulating material includes: 40 parts by weight of vinyl silicone resin, 20 parts by weight of vinyl MQ silicone resin and 85 parts by weight of alumina particles with different particle sizes.

[0024] But the parts by weight ...

Embodiment 2

[0059] In this embodiment, the polymer matrix material is 4-40 parts by weight of polyisobutylene polymer. The low-molecular viscosity-increasing additive is 1-20 parts by weight of petroleum rosin resin. Here, 4-40 parts by weight and 1-20 parts by weight are just preferred cases, and the content can also be reasonably changed according to actual needs.

[0060] The thermally conductive insulating particles may be one or more selected from aluminum oxide, boron nitride, aluminum nitride, magnesium oxide and zinc oxide, and the amount used is, for example, 40-85 parts by weight. Here, 40-85 parts by weight is only a preferred example, and the content can also be reasonably changed according to actual needs.

[0061] For example, in a specific example, the thermally conductive insulating material includes: 4 parts by weight of polyisobutylene polymer, 1 part by weight of petroleum rosin resin, and 60 parts by weight of boron nitride and zinc oxide particles.

[0062] In anoth...

Embodiment 3

[0077] In this embodiment, the polymer matrix material is 4-40 parts by weight of silicone rubber. The low-molecular thickening additive is 1-20 parts by weight of silicone resin. Here, 4-40 parts by weight and 1-20 parts by weight are just preferred examples, and the content can also be reasonably changed according to actual needs.

[0078] The thermally conductive insulating particles may be one or more selected from aluminum oxide, boron nitride, aluminum nitride, magnesium oxide and zinc oxide, and the amount used is, for example, 40-85 parts by weight. Here, 40-85 parts by weight is only a preferred example, and the content can also be reasonably changed according to actual needs.

[0079] For example, in a specific example, the thermally conductive insulating material includes: 4 parts by weight of silicone rubber, 1 part by weight of silicone resin and 40 parts by weight of boron nitride particles.

[0080] In another specific example, the thermally conductive insulat...

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Abstract

The invention provides a heat conduction insulating material, a heat conduction insulating strip and a method for preparing the heat conduction insulating material and the heat conduction insulating strip. The heat conduction insulating material comprises the following components by weight part: 4-40 parts of high-molecular base material; 1-20 parts of tackifying additive, wherein the tackifying additive contains a reaction group which is identical or analogous with at least one solidified active group in the high-molecular base material; and 40-85 parts of heat conduction insulating particles. The heat conduction insulating material of the present invention has good heat conduction insulating property and viscosity, and can adhere between a radiator and an electronic component without using a double faced adhesive tape or corona treatment.

Description

technical field [0001] The invention relates to a thermally conductive insulating material, a thermally conductive insulating sheet and a method for preparing the thermally conductive insulating material and the thermally conductive insulating sheet. Background technique [0002] In recent years, with the rapid development of the integration process of semiconductor devices, the degree of integration of semiconductor devices is getting higher and higher. Design engineers are striving to install more semiconductor devices in a smaller area in order to realize the miniaturization of instruments and equipment. In order to ensure the stable operation of these highly integrated semiconductor devices, the heat generated by each electronic component must be effectively and timely transferred to the surrounding environment. The usual method is to install metal radiators with high thermal conductivity such as copper and aluminum on the surface of electronic components integrated wit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L23/20C08L83/04C08L75/04C08L33/12C08L33/04C08L77/00C08K3/22C08K3/38C08K3/28H01B3/00H01B17/56H01B19/00
CPCC08L83/00C08L83/04C09K5/08C09K5/14C08K3/013H05K7/2039
Inventor 汪友森赵敬棋
Owner TIANJIN LAIRD TECH LTD
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