Semiconductor component packaging structure and manufacturing method thereof

Abstract

The present invention relates to a semiconductor component packaging structure and a manufacturing method thereof. The semiconductor component packaging structure comprises a first substrate which is provided with a grain metal pad, a first conducting wire circuit and a second conducting wire circuit; grains which are arranged on the upper surface of the grain metal pad; a second substrate which is provided with a grain accommodating opening for accommodating the grains, a third conducting wire circuit and a forth conducting wire circuit, wherein the depth of the grains is equal to that of the second substrate; glue layers which are arranged on the upper surface of the first substrate and bottom surfaces of the second substrate and the grains; and first dielectric layers which are arranged on upper surfaces of the grains and the second substrate, and between sides walls of the grains and side walls of the grain accommodating openings, and each first dielectric layer comprises a plurality of hole areas. The semiconductor component packaging structure has excellent thermal expansion coefficient matching performance and downsizing size, the substrate is provided with the grain accommodating opening, thus the mechanical reliability can be improved and the size of components can be reduced.

Description

technical field [0001] The invention relates to a crystal grain embedded substrate structure formed into a panel form package, in particular to a semiconductor element package structure and a manufacturing method thereof. Background technique [0002] Overcast casting, commonly known as lost wax casting, is a casting process that enables metal or metal alloys to be fabricated into near-net-shape metal parts. Overcasting is commonly used in the process of forming intricate and complex shapes with high precision. Refractory crucibles are used in the overmold casting process to melt metal alloys. In this view, the alloy is melted in a crucible and then poured from the crucible into a mold to form a cast. Conventional refractory crucibles, such as zirconia crucibles, usually have a porous structure in part to increase resistance to thermal shock and further minimize the possibility of cracking. [0003] In the field of semiconductor components, as the size of components conti...

AI Technical Summary

Problems solved by technology

Since the encapsulation compound or epoxy will warp after thermal curing, it is difficult to control the surface of the die and the above compound at the same level, so a chemical mechanical polishing process is required to polish the uneven surface, so the cost is also high. and improve

Images