Substrate-free pressure-sensitive acrylic thermal conductive adhesive, preparation method and application thereof

Abstract

The invention provides a substrate-free pressure-sensitive acrylic thermal conductive adhesive. A thermal conductive agent is dispersed in a monomer solution, and the thermal conductive adhesive is formed by curing and cross-linking after in situ polymerization; the consumption ratio of the thermal conductive agent to the monomer is (1-4): (6-9); the thermal conductive agent consists of 75 to 90 percent of carbon fibers and 10 to 25 percent of carbon nano tubes; and the monomer is acrylic acid and/or acrylate. Because the thermal conductive agent of specific components is uniformly dispersed in the acrylic polymerization monomer to form a stable three-dimensional netlike thermal conductive structure, so that the thermal conductive adhesive is good in thermal conductive performance and good in environment friendliness. The thermal conductive adhesive can be applied between a light emitting diode (LED) light bar and an aluminum alloy profile, between the aluminum alloy profile and a back plate, between the LED light bar and the back plate or between a chip and a radiator, is used as a double-sided adhesive tape, and is used under the condition of a big gap between two contact faces of liquid crystal modules.

Description

technical field [0001] The invention relates to a heat-conductive pressure-sensitive adhesive, in particular to a substrate-free pressure-sensitive acrylic heat-conductive adhesive, a preparation method and application thereof. Background technique [0002] At present, with the development of microelectronics technology and assembly technology, modern electronic equipment is increasingly becoming a highly integrated system formed by high-density assembly and micro-assembly. relationship, the contact interface between the heating device and the heat sink in electronic products often cannot reach the theoretical "zero gap" contact, and the contact surface is as follows: figure 1 As shown, part of the interface between the heat generating device 12 (such as LED lights, chips, etc.) and the heat sink 13 (such as aluminum alloy profiles, back plates, etc.) is not in contact, and heat exchange can only be performed through the air layer A. [0003] The heat cannot be transmitted ...

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Problems solved by technology

[0005] For example, the thermally conductive adhesives disclosed in patent applications CN97181574.7, CN201010163571.9, CN91103592.3, CN200480010246.1, CN200780028241.5, and a high thermally conductive composite material disclosed in CN201110008919.1, which adopt the method of adding thermally conductive particles to In the polymer (solution) that has been polymerized, due to the small diameter of the heat-conducting particles and the high viscosity of the polymer, it is difficult to disperse evenly during the mixing process. When used, it will cause uneven heat distribution on the bonding surface and deteriorate the thermal conductivity. Thermal stress is likely to be generated during the thermal cycle shock, which will cause the performance of the film to deteriorate or even fail.

[0006] Patent application CN200510034477.2 discloses a thermal interface material, and CN200680045876.1 discloses a carbon nanotube composite, which is prepared by mixing a carbon nanotube-metal composite with silica gel. Nanomaterials with a high ratio are prone to the "cluster" phenomenon that often occurs in nanomaterials, and it is difficult to disperse into a uniform thermally conductive continuous phase in polymers

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