Substrate-free pressure-sensitive acrylic thermal conductive adhesive, preparation method and application thereof
A technology of acrylic and heat-conducting adhesives, applied in the direction of adhesives, adhesive types, film/sheet-like adhesives, etc., can solve the problems of easy generation of thermal stress, deterioration of adhesive film performance, small diameter of heat-conducting particles, etc., and achieve high The effect of thermal conductivity
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Embodiment 1
[0066] The non-substrate pressure-sensitive acrylic thermally conductive adhesive of this embodiment is made according to the following steps:
[0067] 0.4g azobisisobutyronitrile and 40g ethyl acetate are formulated into initiator solution, and 4g carboxyl content is the multi-walled carbon nanotube (diameter 100nm, length 500nm) of 1.1% and 16g carbon fiber (carboxyl content is 0.05%) Pitch-based carbon fiber, diameter 5000nm, length 6000nm), 3g acrylic acid, 80g n-butyl acrylate, 20g 2-ethylhexyl acrylate and 140g ethyl acetate are formulated into a monomer solution, 3.5g magnesium acetate and 80g ethyl acetate Prepared as curing agent solution;
[0068] In the reactor with material mixing function and temperature control function, the temperature of the monomer solution is raised to 76 ° C, and the initiator solution is added dropwise to the monomer solution for 5 times to carry out the polymerization reaction, and the time of each drop is 10 minutes. After the addition, ...
Embodiment 2
[0073] The non-substrate pressure-sensitive acrylic thermally conductive adhesive of this embodiment is made according to the following steps:
[0074] 0.35g azobisisobutyronitrile and 30g ethyl acetate are formulated into initiator solution, and 2g carboxyl content is the multi-walled carbon nanotube (diameter 80nm, length 1000nm) of 1.5% and 15g carbon fiber (carboxyl content is 0.09% carboxyl The pitch-based carbon fibers that have been melted have a diameter of 6000nm and a length of 7000nm), 4.5g acrylic acid, 50g isobutyl acrylate, 10g lauryl acrylate, 15g 2-ethylhexyl acrylate, and 100g ethyl acetate to prepare a monomer solution. 3g magnesium acetate and 50g ethyl acetate are mixed with curing agent solution;
[0075] In the reactor with material mixing function and temperature control function, the temperature of the monomer solution is raised to 76 ° C, and the initiator solution is added dropwise to the monomer solution for polymerization reaction in 6 times, and th...
Embodiment 3
[0079] The non-substrate pressure-sensitive acrylic thermally conductive adhesive of this embodiment is made according to the following steps:
[0080] 0.5g azobisisobutyronitrile and 45g ethyl acetate are mixed with initiator solution, and 2.5g carboxyl content is the multi-walled carbon nanotube (diameter 30nm, length 500nm) of 2.3% and 17.5g carbon fiber (carboxyl content is 0.05 % carboxylated pitch-based carbon fiber, diameter 5000nm, length 8000nm), 4g acrylic acid, 1g methacrylic acid, 55g n-butyl acrylate, 28g acrylate-2-ethylhexyl, 165g ethyl acetate are mixed with monomer solution, will 2.5g magnesium acetate tetrahydrate and 50g ethyl acetate are mixed with curing agent solution;
[0081] In the reactor with material mixing function and temperature control function, the temperature of the monomer solution is raised to 76 ° C, and the initiator solution is added dropwise to the monomer solution for 5 times to carry out the polymerization reaction. The time for each d...
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