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Substrate-free pressure-sensitive acrylic thermal conductive adhesive, preparation method and application thereof

A technology of acrylic and heat-conducting adhesives, applied in the direction of adhesives, adhesive types, film/sheet-like adhesives, etc., can solve the problems of easy generation of thermal stress, deterioration of adhesive film performance, small diameter of heat-conducting particles, etc., and achieve high The effect of thermal conductivity

Inactive Publication Date: 2012-03-28
HISENSE VISUAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For example, the thermally conductive adhesives disclosed in patent applications CN97181574.7, CN201010163571.9, CN91103592.3, CN200480010246.1, CN200780028241.5, and a high thermally conductive composite material disclosed in CN201110008919.1, which adopt the method of adding thermally conductive particles to In the polymer (solution) that has been polymerized, due to the small diameter of the heat-conducting particles and the high viscosity of the polymer, it is difficult to disperse evenly during the mixing process. When used, it will cause uneven heat distribution on the bonding surface and deteriorate the thermal conductivity. Thermal stress is likely to be generated during the thermal cycle shock, which will cause the performance of the film to deteriorate or even fail.
[0006] Patent application CN200510034477.2 discloses a thermal interface material, and CN200680045876.1 discloses a carbon nanotube composite, which is prepared by mixing a carbon nanotube-metal composite with silica gel. Nanomaterials with a high ratio are prone to the "cluster" phenomenon that often occurs in nanomaterials, and it is difficult to disperse into a uniform thermally conductive continuous phase in polymers

Method used

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  • Substrate-free pressure-sensitive acrylic thermal conductive adhesive, preparation method and application thereof
  • Substrate-free pressure-sensitive acrylic thermal conductive adhesive, preparation method and application thereof
  • Substrate-free pressure-sensitive acrylic thermal conductive adhesive, preparation method and application thereof

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Effect test

Embodiment 1

[0066] The non-substrate pressure-sensitive acrylic thermally conductive adhesive of this embodiment is made according to the following steps:

[0067] 0.4g azobisisobutyronitrile and 40g ethyl acetate are formulated into initiator solution, and 4g carboxyl content is the multi-walled carbon nanotube (diameter 100nm, length 500nm) of 1.1% and 16g carbon fiber (carboxyl content is 0.05%) Pitch-based carbon fiber, diameter 5000nm, length 6000nm), 3g acrylic acid, 80g n-butyl acrylate, 20g 2-ethylhexyl acrylate and 140g ethyl acetate are formulated into a monomer solution, 3.5g magnesium acetate and 80g ethyl acetate Prepared as curing agent solution;

[0068] In the reactor with material mixing function and temperature control function, the temperature of the monomer solution is raised to 76 ° C, and the initiator solution is added dropwise to the monomer solution for 5 times to carry out the polymerization reaction, and the time of each drop is 10 minutes. After the addition, ...

Embodiment 2

[0073] The non-substrate pressure-sensitive acrylic thermally conductive adhesive of this embodiment is made according to the following steps:

[0074] 0.35g azobisisobutyronitrile and 30g ethyl acetate are formulated into initiator solution, and 2g carboxyl content is the multi-walled carbon nanotube (diameter 80nm, length 1000nm) of 1.5% and 15g carbon fiber (carboxyl content is 0.09% carboxyl The pitch-based carbon fibers that have been melted have a diameter of 6000nm and a length of 7000nm), 4.5g acrylic acid, 50g isobutyl acrylate, 10g lauryl acrylate, 15g 2-ethylhexyl acrylate, and 100g ethyl acetate to prepare a monomer solution. 3g magnesium acetate and 50g ethyl acetate are mixed with curing agent solution;

[0075] In the reactor with material mixing function and temperature control function, the temperature of the monomer solution is raised to 76 ° C, and the initiator solution is added dropwise to the monomer solution for polymerization reaction in 6 times, and th...

Embodiment 3

[0079] The non-substrate pressure-sensitive acrylic thermally conductive adhesive of this embodiment is made according to the following steps:

[0080] 0.5g azobisisobutyronitrile and 45g ethyl acetate are mixed with initiator solution, and 2.5g carboxyl content is the multi-walled carbon nanotube (diameter 30nm, length 500nm) of 2.3% and 17.5g carbon fiber (carboxyl content is 0.05 % carboxylated pitch-based carbon fiber, diameter 5000nm, length 8000nm), 4g acrylic acid, 1g methacrylic acid, 55g n-butyl acrylate, 28g acrylate-2-ethylhexyl, 165g ethyl acetate are mixed with monomer solution, will 2.5g magnesium acetate tetrahydrate and 50g ethyl acetate are mixed with curing agent solution;

[0081] In the reactor with material mixing function and temperature control function, the temperature of the monomer solution is raised to 76 ° C, and the initiator solution is added dropwise to the monomer solution for 5 times to carry out the polymerization reaction. The time for each d...

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Abstract

The invention provides a substrate-free pressure-sensitive acrylic thermal conductive adhesive. A thermal conductive agent is dispersed in a monomer solution, and the thermal conductive adhesive is formed by curing and cross-linking after in situ polymerization; the consumption ratio of the thermal conductive agent to the monomer is (1-4): (6-9); the thermal conductive agent consists of 75 to 90 percent of carbon fibers and 10 to 25 percent of carbon nano tubes; and the monomer is acrylic acid and / or acrylate. Because the thermal conductive agent of specific components is uniformly dispersed in the acrylic polymerization monomer to form a stable three-dimensional netlike thermal conductive structure, so that the thermal conductive adhesive is good in thermal conductive performance and good in environment friendliness. The thermal conductive adhesive can be applied between a light emitting diode (LED) light bar and an aluminum alloy profile, between the aluminum alloy profile and a back plate, between the LED light bar and the back plate or between a chip and a radiator, is used as a double-sided adhesive tape, and is used under the condition of a big gap between two contact faces of liquid crystal modules.

Description

technical field [0001] The invention relates to a heat-conductive pressure-sensitive adhesive, in particular to a substrate-free pressure-sensitive acrylic heat-conductive adhesive, a preparation method and application thereof. Background technique [0002] At present, with the development of microelectronics technology and assembly technology, modern electronic equipment is increasingly becoming a highly integrated system formed by high-density assembly and micro-assembly. relationship, the contact interface between the heating device and the heat sink in electronic products often cannot reach the theoretical "zero gap" contact, and the contact surface is as follows: figure 1 As shown, part of the interface between the heat generating device 12 (such as LED lights, chips, etc.) and the heat sink 13 (such as aluminum alloy profiles, back plates, etc.) is not in contact, and heat exchange can only be performed through the air layer A. [0003] The heat cannot be transmitted ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/08C09J11/04C09J7/00C08F220/18C08F220/06G02F1/13357
Inventor 邢哲乔明胜李文涛
Owner HISENSE VISUAL TECH CO LTD
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