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Insulated thermal conductive adhesive and preparation method thereof

A technology of insulation, heat conduction and adhesive, applied in the direction of adhesive types, non-polymer adhesive additives, adhesives, etc., can solve the problems of unsatisfactory and single insulation, heat conduction and adhesion, and achieve the filling effect. Good, strong agglomeration tendency, the effect of reducing thermal resistance

Inactive Publication Date: 2012-03-28
秦会斌
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Most of the adhesives used now use a single ordinary filler, and the insulation, heat conduction and bonding effects are not ideal

Method used

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  • Insulated thermal conductive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] (1) Prepare adhesive matrix glue. In terms of parts by mass, 100 parts of bisphenol A epoxy resin and 60 parts of phenolic resin were weighed and dissolved in 60 parts of acetone. Place it on a strong magnetic stirrer and stir until it is evenly mixed to obtain an adhesive matrix glue solution for use.

[0025] (2) Prepare a nano-inorganic composite filler solution. In parts by mass, 25 parts of nano-scale silicon carbide, 15 parts of nano-scale alumina, and 5 parts of nano-scale silicon dioxide were weighed and dissolved in 20 parts of acetone. Place it on a strong magnetic stirrer and stir until it is evenly mixed to obtain a nano-inorganic composite filler solution, which is ready for use.

[0026] (3) Add the nano-inorganic composite filler solution prepared above into the adhesive matrix glue, place it on a strong magnetic stirrer, and stir until it is evenly mixed, and then an insulating thermally conductive adhesive for high thermal conductivity aluminum-b...

Embodiment 2

[0028] (1) Prepare adhesive matrix glue. In terms of parts by mass, 100 parts of bisphenol A epoxy resin and 60 parts of phenolic resin were weighed and dissolved in 60 parts of acetone. Place it on a strong magnetic stirrer and stir until it is evenly mixed to obtain an adhesive matrix glue solution for use.

[0029] (2) Prepare a nano-inorganic composite filler solution. In terms of parts by mass, 20 parts of nano-scale silicon carbide, 18 parts of nano-scale alumina, and 7 parts of nano-scale silicon dioxide were weighed and dissolved in 20 parts of acetone. Place it on a strong magnetic stirrer and stir until it is evenly mixed to obtain a nano-inorganic composite filler solution, which is ready for use.

[0030] (3) Add the nano-inorganic composite filler solution prepared above into the adhesive matrix glue, place it on a strong magnetic stirrer, and stir until it is evenly mixed, and then an insulating thermally conductive adhesive for high thermal conductivity a...

Embodiment 3

[0032] (1) Prepare adhesive matrix glue. In terms of parts by mass, 100 parts of bisphenol A epoxy resin and 60 parts of phenolic resin were weighed and dissolved in 60 parts of acetone. Place it on a strong magnetic stirrer and stir until it is evenly mixed to obtain an adhesive matrix glue solution for use.

[0033] (2) Prepare a nano-inorganic composite filler solution. In terms of parts by mass, 30 parts of nano-scale silicon carbide, 10 parts of nano-scale alumina, and 5 parts of nano-scale silicon dioxide were weighed and dissolved in 20 parts of acetone. Place it on a strong magnetic stirrer and stir until it is evenly mixed to obtain a nano-inorganic composite filler solution, which is ready for use.

[0034] (3) Add the nano-inorganic composite filler solution prepared above into the adhesive matrix glue, place it on a strong magnetic stirrer, and stir until it is evenly mixed, and then an insulating thermally conductive adhesive for high thermal conductivity alum...

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Abstract

The invention discloses an insulated thermal conductive adhesive, which is prepared by a method comprising the following steps of: (1) preparing an adhesive matrix adhesive liquid; (2) preparing a nano inorganic composite filler solution; and (3) preparing the adhesive. The insulated thermal conductive adhesive consists of the following components in part by weight: 100 parts of bisphenol A epoxy resin, 35 to 100 parts of phenolic resin, 20 to 30 parts of nano silicon carbide, 10 to 20 parts of nano aluminum oxide, 2 to 8 parts of nano silicon dioxide, and 40 to 100 parts of acetone. The thermal conductive performance of the cured adhesive is improved by adding silicon carbide, aluminum oxide and silicon dioxide serving as nano inorganic composite fillers into resin matrix. Meanwhile, the nano inorganic composite fillers have better colloid gap filling effect, so that an insulated adhesive layer is more uniform, the thickness of the insulated adhesive layer can be reduced and the thermal resistance of the insulated adhesive layer is reduced.

Description

technical field [0001] The invention relates to an insulating and heat-conducting adhesive and a preparation method thereof, an insulating and heat-conducting adhesive in the application field of polymer composite materials and a preparation method thereof. Background technique [0002] With the increasingly tense energy supply and the increasingly serious environmental pollution, people are constantly looking for new energy-saving and environmentally friendly light sources. LED light source has become a new generation of green light source products due to its advantages such as high luminous efficiency, long life, energy saving and environmental protection. With the continuous expansion of the application field of LED light sources, LED light sources are gradually developing towards high light intensity and high power, which causes the problem of LED heat dissipation to become increasingly prominent. In the LED light source system, the heat dissipation substrate is the cor...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J11/04C09J9/00
Inventor 秦会斌郑鹏秦惠民
Owner 秦会斌
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