Temporary fixing sheet

A temporary fixation, specific temperature technology, applied in the direction of electrical solid devices, thermally activated films/sheets, film/sheet adhesives, etc., can solve the problem of chip re-attachment and other problems, achieve good handling and reduce re-attachment , the effect of excellent productivity

Inactive Publication Date: 2012-04-04
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in some ceramic chips, chip reattachment by the guillotine method becomes a problem

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0097] 50 parts by weight of isobornyl acrylate (IBXA) as a (meth)acrylic monomer and 72.8 parts by weight of polyol with a number average molecular weight of 650 (Tetramethylene) diol (manufactured by PTMG, Mitsubishi Chemical Corporation), dropwise added 27.2 parts by weight of hydrogenated xylylene diisocyanate (manufactured by HXDI, manufactured by Mitsui Chemicals Polyurethane Co., Ltd.) while stirring, and made it After reacting for 10 hours, a polyurethane polymer-acrylic monomer mixture was obtained. Thereafter, 6.5 parts by weight of 2-hydroxyethyl acrylate (HEA) was added dropwise and allowed to react for 3 hours, and then, 50 parts by weight of acrylic acid (AA) and 0.3 parts by weight of 2,2-dimethyl Oxy-1,2-diphenylethan-1-one (IRGACURE 651, manufactured by Ciba Japan K.K.). In addition, the usage-amount of a polyisocyanate component and a polyol component is NCO / OH (equivalent ratio)=1.25.

[0098] A mixture of polyurethane polymer and acrylic monomer was coate...

Embodiment 2

[0100] 80 parts by weight of isobornyl acrylate (IBXA) as a (meth)acrylic monomer, 20 parts by weight of butyl acrylate (BA), and 72.8 parts by weight of poly(tetramethylene) glycol (manufactured by PTMG and Mitsubishi Chemical Corporation) with a number average molecular weight of 650, 27.2 parts by weight of HXDI was added dropwise while stirring, and it was reacted for 10 hours at 65° C. to obtain polyurethane polymer compound - a mixture of acrylic monomers. Then, 6.5 parts by weight of 2-hydroxyethyl acrylate (HEA) was added dropwise and reacted for 3 hours, and then, 30 parts by weight of acrylic acid (AA) and 0.3 parts by weight of IRGACURE 651 as a photopolymerization initiator were added. In addition, the usage-amount of a polyisocyanate component and a polyol component is NCO / OH (equivalent ratio)=1.25.

[0101] A mixture of polyurethane polymer and acrylic monomer was coated onto release-treated PET with a thickness of 38 μm so that the thickness after curing was 1...

Embodiment 3

[0103] 100 parts by weight of isobornyl acrylate (IBXA) as a (meth)acrylic monomer, 72.8 parts by weight of poly( Tetramethylene) diol (PTMG, manufactured by Mitsubishi Chemical Corporation) was added dropwise with stirring, and 27.2 parts by weight of HXDI was reacted at 65° C. for 10 hours to obtain a polyurethane polymer-acrylic monomer mixture. Then, 6.5 parts by weight of 2-hydroxyethyl acrylate (HEA) was added dropwise and reacted for 3 hours, and then, 0.3 parts by weight of IRGACURE 651 was added as a photopolymerization initiator. In addition, the usage-amount of a polyisocyanate component and a polyol component is NCO / OH (equivalent ratio)=1.25.

[0104] A mixture of polyurethane polymer and acrylic monomer was coated onto release-treated PET with a thickness of 38 μm so that the thickness after curing was 100 μm. Overlap the peeled PET film on it, and then use a black light lamp to irradiate ultraviolet rays (illuminance 5mW / cm2) to the coated PET film surface. 2 ...

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Abstract

The present invention provides a temporary fixing sheet which firmly holds a ceramic sheet in a cutting step for the ceramic sheet and the like, can provide high cutting accuracy, then can efficiently and easily peel a chip from itself by being cooled to a predetermined temperature or lower, gives a high degree of freedom to designing and has adequate handleability. The temporary fixing sheet has a resin layer which contains a urethane polymer component and a vinyl polymer, develops the tack strength at a particular temperature equal to or higher than 40 DEG C, and loses the tack strength at the particular temperature or lower.

Description

technical field [0001] The present invention relates to a temporary fixing sheet for an electronic component manufacturing process which can process electronic components with high precision and which can be peeled off efficiently and easily. Background technique [0002] As an adhesive tape used in the processing of electronic components, base materials such as polyester, polyolefin, vinyl chloride, acrylic, polyurethane, rubber, fluorine and acrylic, urethane, rubber Any adhesive tape may be selected and used from adhesive tapes obtained by laminating adhesives such as silicon-based and silicon-based adhesives. At this time, sufficient adhesiveness is obtained at a certain stage, and a treatment such as heat treatment, cooling treatment, and light irradiation is performed to prevent adhesiveness at another stage. [0003] In the field of electronic components in recent years, the miniaturization and precision of the components themselves are gradually required. For exampl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J151/08B28D7/04C09J7/35
CPCC08G18/4854H01L21/6836C08G18/672H01G4/30H01G13/00C09J175/16C09J7/0203C09J2205/31C09J5/06C08G2170/40C08G18/757C08F283/008C09J2203/326C09J2467/006C09J2205/302C09J2201/61H01L2221/68336C09J2433/00C09J2475/00C09J7/35C09J2301/304C09J2301/502C09J2301/416C08G18/48
Inventor 岛崎雄太井本荣一下川大辅长崎国夫
Owner NITTO DENKO CORP
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