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Resin Composition For Encapsulating Optical Semiconductor Element And Light Emitting Device

A technology for optical semiconductor components and resin compositions, which is applied to semiconductor devices, semiconductor/solid-state device parts, electrical components, etc., can solve the problems of resin cracking, failure to pass the reliability test, and high gas permeability, and achieves high resistance to Excellent vulcanization effect

Active Publication Date: 2012-04-11
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, a cured product of such a silicone resin composition, particularly a cured product of a silicone resin composition having a refractive index of less than 1.45, has greater gas permeability, The disadvantages of sulfur-containing gas permeation in the storage environment and the use environment
However, the cured product of a silicone resin composition with a refractive index of 1.45 or more is brittle and has lower strength than a cured product of a silicone resin composition with a refractive index of less than 1.45. In the case of the thermal stress test, resin cracks occur, which means that the reliability test cannot be passed.
However, when the shape of the silica filler is isotropic, and such a silicone resin composition containing the silica filler is used for figure 1 In the case of the encapsulant for the preformed package shown above, the failure rate in the reliability test has been improved compared to conventional ones, and thermal stress such as moisture absorption reflow soldering and thermal shock tests have complicated effects on the encapsulating resin, and only silicon dioxide The reinforcement effect of the filler cannot withstand thermal stress, resulting in the failure of the resin itself to break, and it is difficult to make the defect rate zero

Method used

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  • Resin Composition For Encapsulating Optical Semiconductor Element And Light Emitting Device
  • Resin Composition For Encapsulating Optical Semiconductor Element And Light Emitting Device
  • Resin Composition For Encapsulating Optical Semiconductor Element And Light Emitting Device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0108] In the above-mentioned basic compound, disperse Glasflex (registered trademark) (product number: REP-015, average particle diameter) manufactured by Nippon Sheet Glass Co., Ltd., which has a refractive index of 1.51 as the (D) component, at a concentration of 10% by mass. : 15 μm, aspect ratio: 3-10) The resulting substance was filled into an unsealed light-emitting diode (LED), and the main curing was performed at 150° C. for 4 hours to manufacture a light-emitting diode for evaluation.

Embodiment 2

[0110] In the above-mentioned basic compound, disperse as a concentration of 50% by mass of Galas Flue (registered trademark) (product number: REP-015, average particle size : 15 μm, aspect ratio: 3-10) The resulting substance was filled into an unsealed light-emitting diode (LED), and the main curing was performed at 150° C. for 4 hours to manufacture a light-emitting diode for evaluation.

Embodiment 3

[0112] In the above-mentioned basic compound, disperse Mildford (registered trademark) (product number: PFE-301, fine powder) manufactured by Nitto Industries Co., Ltd. with a refractive index of 1.51 as the (D) component at a concentration of 10% by mass. Shaped glass fiber, average particle size: 10 μm, aspect ratio: 1.1 to 10) The resulting material is filled into an unsealed light-emitting diode (LED), and the main curing is carried out at 150°C for 4 hours to manufacture a luminescent light-emitting diode for evaluation. diode.

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Abstract

A resin composition for encapsulating optical semiconductor element is provided to obtain the refractive index of greater than 1.45, after hardening, excellent sulfidation resistance, and long-term reliability. A resin composition(4) for the encapsulating optical semiconductor element comprises: organo polysiloxane having aliphatic unsaturated bond containing mono valent hydrocarbon group; organo hydrogen polysiloxane containing two or more hydrogen atoms combined with silicon atom per one molecule; a platinum-based catalyst; and a glass filler(7) with anisotropic shape of which aspect ratio is 1.1-50. The refractive index of the hardened material is 1.45 or greater. The glass filler of anisotropic shape is scale-like glass or chopped strands.

Description

technical field [0001] The present invention relates to a resin composition for sealing a silicone-based optical semiconductor element, and a light-emitting device sealed with a cured product of the resin composition. Background technique [0002] For resin compositions for covering and protecting optical semiconductor elements such as light-emitting diodes (LEDs), the cured product is required to have transparency, and bisphenol A-containing epoxy resins or alicyclic epoxy resins are generally used as such compositions. An epoxy resin composition such as an epoxy resin and an acid anhydride curing agent (refer to Patent Document 1: Japanese Patent No. 3241338, Patent Document 2: Japanese Patent Laid-Open No. 7-25987) [0003] However, the cured product of the above-mentioned epoxy resin composition has low light transmittance to short-wavelength light, and thus has a disadvantage of low light durability or coloring due to photodegradation. Therefore, an optical semiconduct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K7/00C08K3/40C08K7/14H01L33/56
CPCH01L2224/32245H01L2224/48247H01L2224/73265H01L2924/00012H01L23/295C08G77/12C08K3/40C08L83/04C08L2201/02C08L2205/02
Inventor 今泽克之柏木努
Owner SHIN ETSU CHEM IND CO LTD
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