Tungsten-copper alloy with low skeleton connectivity and preparation method thereof

A technology of tungsten-copper alloy and alloy materials, which is applied in the direction of coating, etc., can solve the problems of uneven mixing of ingredients and difficulty in meeting special requirements of tungsten-copper alloy, and achieve good uniformity of structure, high density, and high density Effect

Inactive Publication Date: 2012-05-02
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Tungsten-copper alloys prepared by traditional methods have been difficult to meet these special requirements
[0005] Using tungsten-copper composite powder to prepare tungsten-copper

Method used

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  • Tungsten-copper alloy with low skeleton connectivity and preparation method thereof
  • Tungsten-copper alloy with low skeleton connectivity and preparation method thereof
  • Tungsten-copper alloy with low skeleton connectivity and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0023] 1. Select tungsten powder with a diameter of 4 μm, use HCl, SnCl 2 , PdCl 2 Activation and sensitization of raw tungsten powder, the activators are HCl and SnCl 2 , the concentration is 10%, the activation time is 30min; the sensitizer is PdCl 2 , the sensitization time is 30min;

[0024] 2. The copper-coated tungsten composite powder is prepared by electroless plating, the pH value of the plating solution is 13, and the temperature is 50°C, and then the copper-coated tungsten composite powder is mixed with a certain proportion of copper powder by a planetary ball mill to form a mixed Powder, the mass fraction percentage in the final mixed powder is that the Cu content is 20%, the W content is 80%, and the ball milling time is 4h;

[0025] 3. The mixed powder is sintered by spark plasma sintering technology. The sintering temperature is 800°C, the heating rate is 50°C / min, and the holding time is 5min. Finally, a tungsten-copper alloy with high density and low skelet...

Embodiment 2

[0027] 1. Select tungsten powder with a diameter of 4 μm, use HCl, SnCl 2 , PdCl 2 Activation and sensitization of raw tungsten powder, the activators are HCl and SnCl 2 , the concentration is 10%, the activation time is 35min; the sensitizer is PdCl 2 , the sensitization time is 35min;

[0028] 2. The copper-coated tungsten composite powder is prepared by electroless plating, the pH value of the plating solution is 13, and the temperature is 55°C, and then the copper-coated tungsten composite powder is mixed with a certain proportion of copper powder by a planetary ball mill to form a mixed Powder, the mass fraction percentage in the final mixed powder is that the Cu content is 25%, the W content is 75%, and the ball milling time is 4h;

[0029] 3. The mixed powder is sintered by spark plasma sintering technology. The sintering temperature is 850°C, the heating rate is 100°C / min, and the holding time is 5min. Finally, a tungsten-copper alloy with high density and low skele...

Embodiment 3

[0031] 1. Select tungsten powder with a diameter of 3 μm, use HCl, SnCl 2 , PdCl 2 Activation and sensitization of raw tungsten powder, the activators are HCl and SnCl 2 , the concentration is 10%, the activation time is 40min; the sensitizer is PdCl 2 , the sensitization time is 40min;

[0032] 2. Prepare copper-coated tungsten composite powder by electroless plating. The pH value of the plating solution is 13 and the temperature is 60°C. Then use a planetary ball mill to mix the copper-coated tungsten composite powder with a certain proportion of copper powder to make a mixed Powder, the mass fraction percentage in the final mixed powder is that the Cu content is 30%, the W content is 70%, and the ball milling time is 4h;

[0033] 3. The mixed powder is sintered by spark plasma sintering technology. The sintering temperature is 900°C, the heating rate is 150°C / min, and the holding time is 5min. Finally, a tungsten-copper alloy with high density and low skeleton connectivi...

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Abstract

The invention discloses a tungsten-copper alloy with low skeleton connectivity and a preparation method thereof. The tungsten-copper alloy contains 60 to 80 percent of W and 20 to 40 percent of Cu. The method comprises the following steps of: 1, selecting the particle diameter of tungsten powder; 2, pre-treating the tungsten powder, namely calculating the mass of the tungsten according to the mass percentage of the prepared tungsten-copper alloy, weighing the tungsten powder according to the particle diameter selected in the step 1, and performing surface pretreatment on the tungsten powder; 3, preparing composite powder: preparing copper-coated tungsten composite powder by adopting a chemical plating method; 4, mixing powder, namely mixing the copper-coated tungsten composite powder and copper powder in a certain ratio by using a planetary ball mill; and 5, performing final sintering, namely sintering the mixed powder obtained in the step 4 by adopting a spark plasma sintering technology, and thus obtaining the tungsten-copper alloy with low skeleton connectivity. The prepared tungsten-copper alloy has the advantages of uniform components, fine tissues, good electric conductivity and thermal conductivity, low thermal expansion coefficient and good tensile property, and is applied in the fields of electric spark machining, electronic encapsulation and aerospace material preparation.

Description

technical field [0001] The invention belongs to the field of powder technology metallurgy, in particular to a preparation method of tungsten-copper alloy with low skeleton connectivity. Background technique [0002] Tungsten-copper alloy is a pseudo-alloy composed of tungsten with high melting point and high hardness and copper with high electrical conductivity and thermal conductivity. It has good electrical conductivity, welding resistance, high strength, and high hardness. It is currently used in electronics, military, and Aerospace and other fields have a wide range of applications. With the development of science and technology, the requirements for the performance of W-Cu materials in industrial applications are getting higher and higher. [0003] Traditional tungsten-copper alloys are generally prepared by high-temperature liquid-phase sintering and infiltration. The high-temperature liquid-phase sintering method prepares tungsten-copper alloys by densifying them th...

Claims

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Application Information

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IPC IPC(8): C22C27/04C22C1/04B22F1/02C23C18/40
Inventor 刘金旭李树奎郭文启呼陟宇王迎春
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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