Tungsten-copper alloy with low skeleton connectivity and preparation method thereof

A technology of tungsten-copper alloy and alloy materials, which is applied in the direction of coating, etc., can solve the problems of uneven mixing of ingredients and difficulty in meeting special requirements of tungsten-copper alloy, and achieve good uniformity of structure, high density, and high density Effect
CN102433480AInactive Publication Date: 2012-05-02BEIJING INSTITUTE OF TECHNOLOGYGY
2 Cites 20 Cited by

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
BEIJING INSTITUTE OF TECHNOLOGYGY
Publication Date
2012-05-02
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses a tungsten-copper alloy with low skeleton connectivity and a preparation method thereof. The tungsten-copper alloy contains 60 to 80 percent of W and 20 to 40 percent of Cu. The method comprises the following steps of: 1, selecting the particle diameter of tungsten powder; 2, pre-treating the tungsten powder, namely calculating the mass of the tungsten according to the mass percentage of the prepared tungsten-copper alloy, weighing the tungsten powder according to the particle diameter selected in the step 1, and performing surface pretreatment on the tungsten powder; 3, preparing composite powder: preparing copper-coated tungsten composite powder by adopting a chemical plating method; 4, mixing powder, namely mixing the copper-coated tungsten composite powder and copper powder in a certain ratio by using a planetary ball mill; and 5, performing final sintering, namely sintering the mixed powder obtained in the step 4 by adopting a spark plasma sintering technology, and thus obtaining the tungsten-copper alloy with low skeleton connectivity. The prepared tungsten-copper alloy has the advantages of uniform components, fine tissues, good electric conductivity and thermal conductivity, low thermal expansion coefficient and good tensile property, and is applied in the fields of electric spark machining, electronic encapsulation and aerospace material preparation.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention belongs to the field of powder technology metallurgy, in particular to a preparation method of tungsten-copper alloy with low skeleton connectivity. Background technique

[0002] Tungsten-copper alloy is a pseudo-alloy composed of tungsten with high melting point and high hardness and copper with high electrical conductivity and thermal conductivity. It has good electrical conductivity, welding resistance, high strength, and high hardness. It is currently used in electronics, military, and Aerospace and other fields have a wide range of applications. With the development of science and technology, the requirements for the performance of W-Cu materials in industrial applications are getting higher and higher.

[0003] Traditional tungsten-copper alloys are generally prepared by high-temperature liquid-phase sintering and infiltration. The high-temperature liquid-phase sintering method prepares tungsten-copper alloys by densifying them th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More