Semiconductor material with Cu2O nano bamboo shoot structure and preparation method thereof
A semiconductor and nanotechnology, applied in the field of Cu2O nanometer bamboo shoot-structured semiconductor materials and their preparation, can solve the problems of difficulty in preparing one-dimensional nanostructures, low success rate, few raw materials, etc., and achieves good adhesion, low cost, and raw materials. less effect
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[0028] The present invention Cu 2 The preparation method of the semiconductor material of O nano shoot structure is to deposit Cu on the silicon chip 2 The preparation method of O nano shoot structure semiconductor material, comprises the steps:
[0029] a, absolute ethanol and deionized water are mixed in a certain volume ratio as a reaction solvent for use; a certain amount of Cu(CH 3 COO) 2 ·H 2 O and a small amount of pyrrole are added in the above solvent and stirred evenly to obtain the reaction solution;
[0030] b. Take a small piece of cleaned silicon wafer and put it into the bottom of the inner tank of the reaction kettle, and slowly add the above prepared reaction solution;
[0031] c. Put the sealed reaction kettle in a heating furnace heated to 180°C in advance to react for a period of time. The reaction temperature range of the preparation method of the present invention is 160-190°C.
[0032] d, after the reaction is over, take out the silicon chip covere...
Embodiment 1
[0036] 1. Clean the silicon wafer, and then cut it into small pieces of about 5mm×5mm;
[0037] 2. Set the temperature of the heating furnace to 180°C;
[0038] 3. Mix anhydrous ethanol and deionized water according to the volume ratio of 1:3 and stir evenly as a solvent for later use;
[0039] 4. Add Cu(CH 3 COO) 2 ·H 2 O powder was added to 100mL of the above-mentioned mixed solvent of absolute ethanol and deionized water to prepare Cu(CH 3 COO) 2 ·H 2 O content is the mixed solution of 25mM; Cu(CH 3 COO) 2 ·H 2 The O content allows an error of up and down 2.5mM, which has no effect on the reaction result;
[0040] 5. After stirring for about 5 minutes, add pyrrole dropwise to the above solution while stirring, Cu(CH 3 COO) 2 ·H 2 The molar ratio of O powder to pyrrole is 2:7, and the prepared reaction solution is light blue;
[0041] 6. Clean the Teflon reactor with a capacity of 100mL, place the cleaned silicon wafer horizontally on the bottom of the inner tan...
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