Method for applying diamond wire to mortar square cutting device

Abstract

The invention relates to a method for crystalline silicon square cutting, in particular to a method for applying a diamond wire to a mortar square cutting device, which adopts a photoelectric sensor to monitor the diameter of a diamond wire wheel in real time and feed back to a computer control system. During square cutting, the correction time is regarded as a control point of the shutdown detection time, namely, at every interval of the correction time, a machine is shut down and the diameter of the wire wheel recorded by the photoelectric sensor is manually input to a system display value, then a program is recovered, cutting continues, and the operation is repeated until the cutting process is finished. The control system of the device makes corresponding adjustments on rotation speed of the wire wheel and enables the wire speed to approach to regulated speed so that real-time deviation rectification during the diamond wire square cutting process is achieved. Due to the fact that the operational steps of monitoring the diameter of the wire wheel in real time, shutting down the machine to input the monitored actual diameter to the system of the device and the like are added, breakage of steel wires during the diamond wire square cutting process is effectively avoided, processing quality of single crystal and polycrystal square rods is improved, and meanwhile the problem of environmental pollution caused by mortar cutting is resolved.

Description

Technical field [0001] The invention relates to a method for cutting crystalline silicon, in particular to a method for applying a diamond wire to a mortar cutting device. Background technique [0002] At present, most of the cutting operations of crystalline silicon use sand wire cutting. The principle is that in the process of cutting silicon square rods, the walking of a certain wire diameter steel wire drives the SIC grit to grind the silicon rods and cut them into silicon square rods that meet the requirements. . When using this method to cut squares, because the cutting force is greatly affected by the mortar supply factors, the cutting speed is always difficult to reach a high level, and the processing efficiency is low. Especially in the operation of polycrystalline square cutting, due to the uneven surface of the polycrystalline ingot, the mortar cannot be left evenly and smoothly, resulting in the deposition of SIC particles and insufficient mortar supply; and during t...

AI Technical Summary

Problems solved by technology

[0006] If the 0.25mm steel wire used in the mortar cutting equipment is replaced with a 0.35mm diamond wire, within a short period of time when the cutting starts, the actual wire wheel diameter at the pay-off end is smaller than the theoretical calculation value of the equipment due to the larger wire diameter. Therefore, the wire wheel speed controlled based on the theoretically calculated wire wheel diameter of the equipment is lower than the actual rotation speed of the wire wheel, which will cause the line speed of the pay-off end to be lower than the specified line speed; and for the take-up end, the actual wire wheel diameter is greater than the theoretical calculation value. , the wire wheel speed controlled based on the theoretically calculated wire wheel diameter is greater

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