Copper electrode alumina ceramic substrate used in large power LED

Abstract

A copper electrode alumina ceramic substrate used in a large power LED is disclosed. The copper electrode alumina ceramic substrate is characterized in that: the substrate is formed by an alumina layer (1), a first copper electrode (2), a second copper electrode (3) and a copper aluminum oxide modification layer (4); the copper aluminum oxide modification layer (4) is on the alumina layer (1), the first copper electrode (2) and the second copper electrode (3) are on the copper aluminum oxide modification layer (4); a range of a separation distance between the first copper electrode (2) and the second copper electrode (3) is 0.1-1mm; bauxite in which a gibbsite (Al2O3. 3H2O) accounts for 60% and sodium hydroxide ( a purity is 99.99%) are grinded evenly, high temperature sintering, grinding, sieving and washing are performed to the mixture, and then the mixture passes through a die and molds so as to obtain an alumina ceramic substrate; a vacuum coating way is used to sputter copper metal composite layer; an alumina ceramic substrate layer, the copper aluminum oxide modification layer and a copper layer are formed from bottom to top; yellow light lithography etching is used so as to etch the first copper electrode and the second copper electrode used by an LED chip; thickness of the electrode can be increased through an electroplating deposition mode so that the copper electrode alumina ceramic substrate can be obtained. The ceramic substrate possesses a good heat dissipation characteristic and has a good application prospect in heat dissipation and packaging aspects of the large power LED.

Description

technical field [0001] The invention belongs to the technical field of ceramic heat dissipation materials. Specifically, the invention relates to a copper electrode alumina ceramic substrate for high-power LEDs and a preparation method thereof. Background technique [0002] LED products have the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle, and environmental protection benefits, and are one of the most eye-catching industries in recent years. Usually about 15% of the input power of high-power LED products can be converted into light, and the remaining 85% of the electrical energy is converted into heat energy. Excessively high LED p-n junction temperature will lead to LED luminous efficiency attenuation. Therefore, if the heat generated when the LED emits light cannot be dissipated in time, the junction temperature of the LED will be too high, which will affect the product life cycle, luminous efficiency, and stability, and ...

AI Technical Summary

Problems solved by technology

[0003] The LED chip substrate is mainly used as a medium for heat export between the LED chip and the system circuit board. The traditional aluminum substrate is mostly used, but the heat dissipation effect is not ideal.

At present, the LED chip substrates on the market are mainly ceramic substrates, including silicon substrates, silicon carbide substrates, anodized aluminum substrates or aluminum nitride substrates. The semiconductor characteristics of silicon and silicon carbide substrate materials make them unavailable at this stage. The anodized aluminum substrate is easily broken due to the insufficient strength of the anodized oxide layer to cause conduction; at this stage, the more mature and generally accepted one is aluminum nitride as the heat dissipation substrate; however, currently limited by nitrogen The aluminum nitride substrate is not suitable for the traditional thick film process (the material must be subjected to an atmospheric heat treatment at 850°C after printing with silver glue, which causes material reliability problems), so there are still many problems with the aluminum nitride substrate

The present invention intends to provide a copper electrode alumina ceramic substrate for high-power LED and its preparation method to solve the heat dissipation and stability problems of high-power LED

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