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Sn-Ag-Cu-Bi-Er low-silver and lead-free welding flux and preparation method for same

A sn-ag-cu-bi-er, lead-free solder technology, used in welding equipment, welding/cutting media/materials, welding media, etc., can solve the adverse effects of post-weld mechanical properties, low alloy fatigue resistance, melting process increase, etc.

Inactive Publication Date: 2012-06-20
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These solders have improved the SnAgCu ternary solder to a certain extent, but there are still deficiencies in some aspects, such as the melting range of the former alloy (193°C~218°C) is too large, and the fatigue resistance of the latter alloy is relatively low
Shenzhen Yichengda research found that adding Bi can improve the wettability of SAC0307 and reduce the melting point of solder, but the melting range will increase, which will adversely affect the mechanical properties after soldering

Method used

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  • Sn-Ag-Cu-Bi-Er low-silver and lead-free welding flux and preparation method for same
  • Sn-Ag-Cu-Bi-Er low-silver and lead-free welding flux and preparation method for same
  • Sn-Ag-Cu-Bi-Er low-silver and lead-free welding flux and preparation method for same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Example 1 Preparation of Sn-1.5Ag-0.3Cu-3.0Bi-0.05Er

[0018] According to the proportion by weight of each component, Ag is 1.5%, Cu is 0.3%, Bi is 3.0%, Er is 0.05%, and the balance is Sn.

[0019] The preparation process is as follows: prepare 50g of Sn-10Er master alloy according to the weight ratio in a vacuum electric arc melting furnace; mix the weighed pure Sn and Er, heat to 1600°C in a vacuum electric arc furnace, stir and melt, keep warm for 30min and then cool , repeated smelting 3 times to make button ingots. Weigh 0.5g of Sn-10Er master alloy, 1.5g of Ag, 0.3g of Cu, 3.0g of Bi and 94.7g of Sn; after fully mixing, place it in a vacuum induction melting furnace for high-temperature melting at 900°C and keep it warm for 30 minutes to ensure that the obtained alloy The uniformity of the composition; the resulting solder alloy was vacuum remelted at a temperature of 300 °C,

[0020] Keep it warm for 1 hour, and then cool it in air to prepare a solder ingot f...

Embodiment 2

[0021] Example 2 Preparation of Sn-1.0Ag-0.3Cu-3.0Bi-0.05Er

[0022] According to the proportion by weight of each component, Ag is 1.0%, Cu is 0.3%, Bi is 3.0%, Er is 0.05%, and the balance is Sn.

[0023] Its preparation method is the same as embodiment 1.

[0024]

Embodiment 3

[0025] Example 3 Preparation of Sn-2.0Ag-0.3Cu-3.0Bi-0.05Er

[0026] According to the proportion by weight of each component, Ag is 2.0%, Cu is 0.3%, Bi is 3.0%, Er is 0.05%, and the balance is Sn.

[0027] Its preparation method is the same as embodiment 1.

[0028]

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Abstract

The invention relates to a Sn-based low-silver and lead-free welding flux containing a rare earth element Er as well as a preparation method for the same. The Sn-based low-silver and lead-free welding flux comprises the following components in percentage by mass: 0.3-2.0% of Ag, 0.3-0.7% of Cu, 2.0-3.0% of Bi, 0.01-0.15% of Er and the remaining of Sn, wherein Bi can reduce a melting point of a welding flux alloy but increase a melting range of the same; and Er can reduce the melting range. During the preparation of the welding flux, an intermediate alloy Sn-10Er is smelted under a vacuum state or in an atmosphere of protective gases, and the intermediate alloy is prepared into a lead-free welding flux alloy ingot according to the proportion of the alloy. The ingot can be directly regarded as the welding flux, and can also be prepared into a bar, a wire, a plate or powder for use; the welding flux has the advantages of low melting point (201-220 DEG C), small range of melting range, good wetting property, excellent mechanical property and technical performances as well as low cost.

Description

technical field [0001] The invention relates to a low-silver lead-free solder containing rare earth erbium and a preparation method thereof, belonging to the technical field of tin-based lead-free solder manufacture. Background technique [0002] With the development of green manufacturing in the electronics industry and the advancement of electronic assembly technology, traditional Sn-Pb solders are gradually being replaced by non-toxic lead-free solders. A new type of lead-free electronic packaging solder should have good process performance (low melting point, small melting temperature range, good wettability, good corrosion and oxidation resistance, good conductivity), good solder joint reliability (high bonding strength , good creep resistance), low cost and so on. So far, there are many types of lead-free solders that have been developed. The commonly used lead-free solders are Sn-3.5wt%Ag, Sn-0.7wt%Cu and SnAgCu alloys, but there are also some problems. SnAgCu s...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/40C22C13/02C22C1/03
Inventor 韦习成林飞毕文珍谢仕芳
Owner SHANGHAI UNIV
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