Organic silicon modified epoxy resin for packaging LED (Light Emitting Diode), and preparation method and application thereof

A technology of LED packaging and epoxy resin, applied in the direction of epoxy resin glue, organic chemistry, adhesive type, etc., can solve the problems of epoxy resin performance improvement, lack of silicone chain segments, etc., to improve flexibility, improve Anti-yellowing performance, anti-yellowing effect

Inactive Publication Date: 2012-06-27
ZHEJIANG Z LIGHT OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The above-mentioned invention adopts the method of blending and compounding to prepare organosilicon-modified epoxy resin. Such materials are only crosslinking agents that are organosilicon compounds. On the one hand, there are compatibility problems between crosslinking agents, fillers and epoxy resins. On the one hand, Lack of silicone segments in the material backbone, resulting in limited performance improvement for epoxies

Method used

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  • Organic silicon modified epoxy resin for packaging LED (Light Emitting Diode), and preparation method and application thereof
  • Organic silicon modified epoxy resin for packaging LED (Light Emitting Diode), and preparation method and application thereof
  • Organic silicon modified epoxy resin for packaging LED (Light Emitting Diode), and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] (1) Add 22.8g (0.075mol) of D4 (0.075mol), 68.5g (0.3mol) of bisphenol A, 46.4g (0.5mol) of epichlorohydrin into a 250ml clean three-neck flask, mix well at 60°C, and then add 20g Sodium hydroxide, polymerize at 60°C for 3 hours, then add 150g of toluene, let the product dissolve completely under stirring, then let it stand for stratification, and reflux the upper layer product to remove water under stirring, and continue to reflux for 1 hour after no bubbles appear, and let it stand , cooled, filtered, and desolventized under reduced pressure to obtain 115.8 g of colorless and transparent organosilicon-modified epoxy resin with a viscosity of 12500 mPa·S, and its chemical formula was identified as CH 2 CHOCH 2 [OC 6 h 4 C(CH 3 ) 2 C 6 h 4 O] 3 [CH 2 CHOHCH 2 ] 3 [(CH 3 ) 2 SiO] 3 CHCH 2 O, its infrared spectrum is shown in figure 1 .

[0035] (2) Take 20g of the product obtained in (1), add 5g of epoxy diluent 2-cresyl glycidyl ether, 5.0g of nano silicon...

Embodiment 2

[0038] (1) Add 22.8g (0.075mol) of D3 (0.075mol), 45.7g (0.2mol) of bisphenol A, 37.2g (0.4mol) of epichlorohydrin into a 250ml clean three-neck flask, mix well at 60°C, and then add 20g Potassium hydroxide, polymerize at 80°C for 2 hours, then add 150g of xylene, let the product dissolve completely under stirring, and then let it stand for stratification, and reflux the upper layer product to remove water under stirring, and continue to reflux for 2 hours after no bubbles appear, and let it stand place, cool, filter, and remove the solvent under reduced pressure to obtain 88.8 g of colorless and transparent organosilicon-modified epoxy resin with a viscosity of 8500 mPa·S, and its chemical formula is identified as CH 2 CHOCH 2 [OC 6 h 4 C(CH 3 ) 2 C 6 h 4 O] 2 [CH 2 CHOHCH 2 ] 2 [(CH 3 ) 2 SiO] 3 CHCH 2 O.

[0039] (2) Take 25g of the product obtained in (1), add 5g of epoxy diluent 4-tert-butylphenyl glycidyl ether, 6.0g of nano-silica, mix well in a planetary...

Embodiment 3

[0042] (1) Add 22.8g D5 (0.075mol), 68.5g (0.3mol) bisphenol A, 46.4g (0.5mol) epichlorohydrin to a 250ml clean three-neck flask, mix well at 60°C, and then add 20g Sodium hydroxide, polymerize at 60°C for 3 hours, then add a mixture of 75g toluene and 75g xylene, let the product dissolve completely under stirring, then let it stand for stratification, and reflux the upper layer product under stirring to remove water, until no bubbles appear Continue to reflux for 1h, let stand, cool, filter, and remove the solvent under reduced pressure to obtain 110g of colorless and transparent silicone modified epoxy resin, whose viscosity is 11000mPa·S, and its chemical formula is identified as CH 2 CHOCH 2 [OC 6 h 4 C(CH 3 ) 2 C 6 h 4 O] 3 [CH 2 CHOHCH 2 ] 3 [(CH 3 ) 2 SiO] 3 CHCH 2 O.

[0043] (2) Get 20g of the product gained in (1), add epoxy diluent neodecanoic acid oxirane alkyl methyl ester 5g, nano silicon dioxide 5.0g, mix uniformly in planetary mixer, make A glue;...

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Abstract

The invention provides an organic silicon modified epoxy resin for packaging an LED (Light Emitting Diode), and a preparation method and an application thereof. According to the preparation method, an organic silicon monomer is directly polymerized with bisphenol A and epoxy chloropropane, for preparing the organic silicon modified epoxy resin with epoxy groups at the tail end and dimethyl silica chain links contained in a main chain. The organic silicon modified epoxy resin for packaging the LED is prepared; the flexibility, the weather resistance and the ultraviolet radiation resistance of the packaging materials are improved; and the organic silicon modified epoxy resin is difficult to yellow.

Description

(1) Technical field [0001] The invention relates to a silicone-modified epoxy resin, a preparation method thereof, and an application of the resin in preparing an adhesive film for LED packaging. (2) Background technology [0002] The power consumption of light-emitting diode (LED) lighting is only 1 / 10 of that of traditional light sources. It has the characteristics of not using mercury that seriously pollutes the environment, small size, and long life. It first enters industrial equipment, instruments, traffic lights, automobiles, and backlights. and other special lighting fields. With the improvement of LED performance, LED is expected to replace traditional light sources such as incandescent lamps and fluorescent lamps and become the fourth generation of lighting sources. [0003] Epoxy resin refers to a polymer chain structure containing two or more epoxy groups, with organic compounds such as aliphatic, alicyclic or aromatic as the skeleton and forming a useful thermo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/30C08G59/06C07F7/18C09J163/00C09J7/00H01L33/56
Inventor 朱晓飚胡建红郑群亮杨雄发
Owner ZHEJIANG Z LIGHT OPTOELECTRONICS
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