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Low-hardness glue-dispensing shaping shielding conductive adhesive as well as preparation method and application thereof

A conductive adhesive, low hardness technology, applied in the direction of conductive adhesives, adhesives, etc., can solve the problems of not meeting the application requirements, increasing the stress of structural parts, limiting deformation performance, etc., achieving excellent thixotropic performance and improving bonding performance , the effect of improving stability

Active Publication Date: 2012-06-27
SHANGHAI RELAND PHOTOVOLTAIC MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the dispensing molding characteristics and other properties of the shielding conductive adhesive, such as electrical conductivity, tensile strength, etc., can meet most applications, but for applications that require low sealing force, such as non-metallic structural parts, the Shore above 65 The hardness of A severely limits its deformation performance. Due to the vertical force and lateral deformation of the shielding conductive adhesive during assembly, the stress on the structural parts during assembly is also increased, which cannot meet the application requirements.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Mix the following components evenly in a dry and clean environment: 80 parts by weight of 5000mPa.S viscosity vinyl-terminated dimethylpolysiloxane, 20 parts by weight of 20000mPa.S viscosity vinyl-terminated dimethylpolysiloxane , 250 parts by weight of copper-plated silver powder with an average particle size of 50 microns are used as metal-based conductive fillers and 0.2 parts by weight of aluminum triacetylacetonate are roughly mixed, and the resulting rough mixture is vacuum dehydrated at 110 ° C for 30 minutes, and then moved into the equipment under nitrogen protection. The planetary mixer of circulating cooling jacket adds 10 parts by weight of ((CH 3 ) 3 SiO)[(CH 3 ) 2 SiO] 20 [(CH 3 )HSiO] 5 [(CH 3 )((CH 2 CH 2 O)CH 2 OCH 2 CH 2 CH 2 )SiO]Si(CH 3 ) 3 , further mixed under vacuum conditions, and finally added 0.002 parts by weight of catalyst 1,3-divinyl-1,1,3,3-tetramethyldisiloxane platinum mixed reaction, defoaming treatment, vacuum filling, ...

Embodiment 2

[0045] Mix the following components evenly in a dry and clean environment: 80 parts by weight of 10000mPa.S viscosity vinyl-terminated dimethylpolysiloxane, 15 parts by weight of 20000mPa.S viscosity vinyl-terminated dimethylpolysiloxane , 5 parts by weight of 500mPa.S viscosity side group containing vinyl dimethyl polysiloxane, 300 parts by weight of silver flake powder with an average particle size of 35 microns and rough mixing of tetra-n-propyl zirconate of 0.2 parts by weight, the obtained After the crude mixture was vacuum dehydrated at 110°C for 30min, it was moved into a planetary mixer equipped with a circulating cooling jacket under nitrogen protection, and 8 parts by weight ((CH 3 ) 3 SiO)[(CH 3 ) 2 SiO] 20 [(CH 3 )HSiO] 5 [(CH 3 )((C 2 h 5 O) 3 SiCH 2 CH 2 CH 2 )SiO]Si(CH 3 ) 3 , further mixed under vacuum, and finally added 0.005 parts by weight of catalyst H 2 PtCl 6 ·6H 2 O, mixing reaction, defoaming treatment, vacuum filling, dispensing and cu...

Embodiment 3

[0048] Mix the following components evenly in a dry and clean environment: 95 parts by weight of 15000mPa.S viscosity vinyl-terminated dimethylpolysiloxane, 5 parts by weight of dimethyl polysiloxane with a viscosity of 500mPa.S and side groups containing vinyl groups Oxane, 150 parts by weight of nickel-plated graphite with an average particle size of 120 microns are roughly mixed with 0.2 parts by weight of bis(ethyl acetoacetate) diisopropyl titanate as a metal-based conductive filler, and the resulting rough mixture is evacuated at 110° C. After dehydration treatment 30min, move into the planetary mixer equipped with circulating cooling jacket under nitrogen protection, add 6 parts by weight ((CH 3 ) 3 SiO)[(CH 3 )HSiO] 4 [(CH 3 )((CH 3 O) 3 SiCH 2 CH 2 CH 2 )SiO]Si(CH 3 ) 3 , further mixed under vacuum conditions, and finally added 0.002 parts by weight of catalyst chloroplatinic acid isopropanol solution, mixed reaction, defoaming treatment, vacuum filling, dis...

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Abstract

The invention relates to a low-hardness glue-dispensing shaping shielding conductive adhesive as well as a preparation method and application thereof. The conductive adhesive comprises the following components in parts by weight: (A) 100 parts of organic polysiloxane of which each molecule comprises at least two alkenyl; (B) 2-10 parts of the organic polysiloxane of which each molecule comprises at least two silicon-hydrogen bonds and a hydrolysable group; (C) 100-350 parts of metal base conductive fillers; (D) 0.001-0.005 parts of Pt-based catalyst; and (E) 0.1-2.0 parts of aluminum compounds or zirconium compounds or titanium compounds. Compared with the prior art, the conductive adhesive provided by the invention has the advantages of low hardness, high conductivity, high shielding performance, strong shaping ability, excellent adhesiveness and the like.

Description

technical field [0001] The invention relates to a shielding conductive adhesive containing a metal-based conductive filler, in particular to a shielding conductive adhesive composition. Background technique [0002] In the prior art, in order to effectively suppress the electromagnetic interference generated by the radio frequency components in the electronic equipment during operation, it is often used to load elastic shielding conductive rubber gaskets on the joint surfaces of the shielding structural parts of the integrated circuit board to realize electromagnetic sealing and shield. [0003] For complex shielding structures used in thinner and thinner high-precision, lightweight electronic equipment, due to the high integration of electronic unit functions and the miniaturization of the overall size, traditional shielding conductive adhesive materials cannot meet the reduced assembly space Requirements: In order to reduce weight, a large number of non-metallic material ...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/06C09J9/02
Inventor 柴莹李成刚孙凯
Owner SHANGHAI RELAND PHOTOVOLTAIC MATERIAL
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