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Photosensitive benzocyclobutene resin compound and preparation method thereof as well as patterning method thereof

A technology of benzocyclobutene and resin composition, which is applied in the field of photosensitive benzocyclobutene resin composition and preparation, can solve the problems of non-photosensitivity, complicated photolithography process, and increased cost, and achieve cost reduction, The method is simple and convenient, and the film-forming effect is good

Active Publication Date: 2012-06-27
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ordinary BCB resin is not photosensitive, so it must be used in combination with other photosensitive materials (such as photoresist) when used as a patterned film material in the field of microelectronics, which complicates the photolithography process and increases the cost.

Method used

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  • Photosensitive benzocyclobutene resin compound and preparation method thereof as well as patterning method thereof
  • Photosensitive benzocyclobutene resin compound and preparation method thereof as well as patterning method thereof
  • Photosensitive benzocyclobutene resin compound and preparation method thereof as well as patterning method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] In a dark room, add 0.15g of benzocyclobutene resin and 2.5g of organic solvent into a 10mL brown bottle, and stir magnetically at room temperature for 30 minutes; then add 0.016g of photosensitizer to the system, continue to stir for 2 hours and then A negative photosensitive BCB resin composition with a mass fraction of about 25% was obtained, and the appearance of the composition was orange-yellow transparent liquid. Wherein, the structural formula of the benzocyclobutene resin is Among them, R is CO;

[0077] The photosensitizer is ultraviolet photosensitizer BAC-M, and the organic solvent is dichloromethane.

Embodiment 2

[0079] In a dark room, add 0.16g of benzocyclobutene resin and 2.3g of organic solvent into a 10mL brown bottle, and stir magnetically at room temperature for 60 minutes; then add 0.05g of photosensitizer to the system, and continue stirring for 5 hours. A negative photosensitive BCB resin composition with a mass fraction of about 8.7% was obtained, and the appearance of the composition was an orange-yellow transparent liquid. Wherein, the structural formula of the benzocyclobutene resin is Among them, R is CO;

[0080] The photosensitizer is ultraviolet photosensitizer BAC-M, and the organic solvent is dichloromethane.

Embodiment 3

[0082] In a dark room, add 0.06g of benzocyclobutene resin and 0.42g of organic solvent into a 5mL brown bottle, and stir magnetically at room temperature for 30 minutes; then add 0.0076g of photosensitizer to the system, continue stirring for 1 hour A negative photosensitive BCB resin composition with a mass fraction of about 13% was obtained, and the appearance of the composition was an orange-yellow transparent liquid. Wherein, the structural formula of the benzocyclobutene resin is Among them, R is C(CF 3 ) 2 ;

[0083] The photosensitizer is ultraviolet photosensitizer BAC-M, and the organic solvent is dichloromethane.

[0084] Please refer to figure 2 ,as well as Figure 3A to Figure 3E ,in figure 2 The flowchart of the patterning method of the photosensitive benzocyclobutene resin composition provided by the embodiment of the present invention, Figure 3A to Figure 3E The schematic diagram of the device structure corresponding to each step of the patterning me...

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PUM

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Abstract

The invention discloses a photosensitive benzocyclobutene resin compound, which comprises benzocyclobutene resin, photosensitizer and organic solvent, therefore, the compound is photosensitive, and has excellent film-forming capability and high heat resistance. The invention further discloses a preparation method of the photosensitive benzocyclobutene resin compound, which is realized through the following steps: benzocyclobutene resin is added into the organic solvent and stirred till complete dissolution; the photosensitizer is added into mixed solution of completely dissolved benzocyclobutene resin and the organic solvent, and is stirred under the ultraviolet shielding condition; and as a result, the negative photosensitive benzocyclobutene resin compound can be obtained. The method is simple and convenient to operate. The invention further discloses a pattering method of the resin compound, which is realized through the following steps: the photosensitive benzocyclobutene resin compound is applied to a coating base in a rotating manner, and then sequentially undertakes prebaking, exposing, developing and curing, so as to obtain a pattered photosensitive benzocyclobutene resin compound with mechanical strength. The method requires no use of photoresist, is simple and convenient to operate, and greatly reduces the cost.

Description

[0001] This application claims the priority of the Chinese patent application with the application number "201110268631.8" and the title of "benzocyclobutene-terminated soluble imide monomer and its preparation and use method", all the content in the priority text All are incorporated in this application document as the reference content of this application document. technical field [0002] The invention relates to the technical field of semiconductor technology, in particular to a photosensitive benzocyclobutene resin composition, a preparation method and a patterning method thereof. Background technique [0003] With the continuous reduction of the feature size of VLSI, the package size of the chip is also reduced correspondingly, and the package density is continuously increased. More and more multi-layer wiring technology is used in the chip packaging technology. For example, for a 256MB dynamic random access memory (DRAM), the maximum number of metal interconnection l...

Claims

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Application Information

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IPC IPC(8): G03F7/031G03F7/029G03F7/00C07D209/48
CPCG03C1/52G03F7/0085G03F7/008
Inventor 杨军肖斐奚嘉亓恬珂叶晓通
Owner FUDAN UNIV
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