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Anomalous plane hollow microneedle based on surface micro processing process and preparation method thereof

A microfabrication and hollow microtechnology, which is applied in the direction of microneedles, needles, medical devices, etc., can solve the problems of complex and cumbersome steps, unfavorable mass production, and height restrictions of microneedles, and achieve simple and easy process and rapid replication And the effect of high-speed mass production, wet etching and simple operation of casting

Inactive Publication Date: 2012-07-04
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] These two preparation methods have several disadvantages: 1. The steps are complicated and cumbersome; 2. The manufacturing process involves DRIE and electroplating technology, and the cost is high; 3. The microneedle structure is only made on silicon, and the height of the microneedle is greatly limited; 4. Not good for mass production

Method used

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  • Anomalous plane hollow microneedle based on surface micro processing process and preparation method thereof
  • Anomalous plane hollow microneedle based on surface micro processing process and preparation method thereof
  • Anomalous plane hollow microneedle based on surface micro processing process and preparation method thereof

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Embodiment 1

[0025] Such as figure 2 As shown, this embodiment includes the following steps:

[0026] Step 1: Prepare a p-type boron-doped polished wafer 4 with crystal orientation as a substrate. A layer of positive resist 2 with a thickness of 5 μm is thrown on it, and developed by photolithography, and the mask plate has a square pattern.

[0027] The second step: using HF wet etching process to remove the silicon oxide 3 at the part not covered by the positive resist.

[0028] Step 3: Etching the silicon wafer treated in the second step with KOH with a mass fraction of 30% to obtain an inverted quadrangular pyramid structure.

[0029] Step 4: Throw a layer of SU-8 glue 6 with a thickness of 300 μm, and develop it by photolithography. The mask plate has a circular structure.

[0030] Step 5: Load the molybdenum wire array plate 5 into the obtained concave mold. The molybdenum wire array is obtained by performing photolithography, development and electroplating on the photoresist, a...

Embodiment 2

[0034] Such as figure 2 As shown, this embodiment includes the following steps:

[0035] Step 1: Prepare a p-type boron-doped polished wafer 4 with crystal orientation as a substrate. A layer of positive resist 2 with a thickness of 5 μm is thrown on it, and developed by photolithography, and the mask plate has a square pattern.

[0036] The second step: using HF wet etching process to remove the silicon oxide 3 at the part not covered by the positive resist.

[0037] Step 3: Etching the silicon wafer treated in the second step with KOH with a mass fraction of 30% to obtain an inverted quadrangular pyramid structure.

[0038] Step 4: Throw a layer of SU-8 glue 6 with a thickness of 200 μm, and develop it by photolithography. The mask plate has a circular structure.

[0039] Step 5: Load the molybdenum wire array plate 5 into the obtained concave mold. The molybdenum wire array is obtained by performing photolithography, development and electroplating on the photoresist, a...

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Abstract

The invention discloses an anomalous plane hollow microneedle based on a surface micro processing process and a preparation method of the anomalous plane hollow microneedle. The method adopts a wet method etching process, an ultraviolet-lithographie -galanoformungand abformung (UV-LIGA) process and a casting process, the wet method etching is used for forming a needle point structure of the microneedle, the UV-LIGA is used for realizing the needle body part of the microneedle, and then, the microneedle structure with the hollow interior is formed by casting, so the anomalous plane hollow microneedle is realized. The anomalous plane hollow microneedle is formed through casting by a purpose-made mold, the expensive processing technology is not needed, the fast reproduction and the high-speed mass production can be realized, in addition, the wet method etching and the casting operation are relatively simple, and the whole set of technical process is simple and is easy to implement.

Description

technical field [0001] The invention relates to a hollow microneedle, in particular to a different-plane hollow microneedle based on a surface microfabrication process and a preparation method thereof. Background technique [0002] In 1999, Chun et al. made silica microneedles that can precisely control the injection of biological substances into cells. In 2000, Steber et al. made a microneedle array that can be used with a microneedle injector. In 2003, Achim Trautmann et al. made a microneedle array containing a liquid reservoir and a micropipe. According to different manufacturing processes, microneedles are divided into heteroplanar and coplanar microneedles. The axis of coplanar microneedles is parallel to the substrate, while the axis of heteroplanar microneedles is perpendicular to the bottom surface. In the case of the same area, the number of different-plane microneedles is much greater than that of the same-plane microneedles, so most microneedles are made of dif...

Claims

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Application Information

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IPC IPC(8): A61M37/00
CPCA61M2037/003A61M37/0015A61M2037/0053
Inventor 李以贵廖哲勋朱军
Owner SHANGHAI JIAO TONG UNIV
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