Organosilicon lens material for power type light-emitting diode (LED) packaging

A technology of LED packaging and lens materials, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of poor adhesion of PPA substrates, change material properties, strong mechanical strength, etc., to achieve good adhesion, high hardness, Strength-enhancing effect

Active Publication Date: 2012-07-04
CHANGZHOU INST OF CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with other LED materials, silicone itself does not have strong mechanical strength, but has a high thermal expans

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0030] Example 1

[0031] Weigh out 19.8g (0.1mol) phenyltrimethoxysilane, 22.0g (0.2mol) dimethyldimethoxysilane and 34.4 (0.2mol) methylphenyldimethoxysilane and mix them evenly. Pour into a 250ml four-necked flask equipped with cooling, stirring and heating devices; then slowly add 19.8g PH=1 aqueous hydrochloric acid solution at 50℃, and continue the reaction for 2-3h after the dropwise addition; finally, the reaction product is separated, After washing with water to neutrality, 38.5 g of colorless and transparent silicone resin was obtained by distillation under reduced pressure, with a yield of 92.9%.

Example Embodiment

[0032] Example 2

[0033] Weigh 17.8g (0.1mol) methyltrichlorosilane, 42.3g (0.2mol) phenyltrichlorosilane and 38.2 (0.2mol) methylphenyldimethoxysilane, mix them evenly, pour into Cooling, stirring and heating device in a 250ml four-necked flask; then slowly add 23.4g PH=1 hydrochloric acid aqueous solution at 50℃, and continue the reaction for 2-3h after the dropwise addition; finally the reaction product is separated and washed to neutrality After distillation under reduced pressure, 54.7 g of colorless and transparent silicone resin was obtained, and the yield was 94.8%.

Example Embodiment

[0034] Example 3

[0035] Combine 50.4g (0.4mol) allyl glycidyl ether with 24gD 4 H Dissolve in 75g of toluene, add to a 250ml four-necked flask equipped with cooling, stirring and heating devices; then add 0.08g of Karstedt catalyst, react at 70℃ for 3-4h, and then keep at 90℃ for 1-2h; wait until the reaction is complete Afterwards, under reduced pressure distillation was performed to remove unreacted monomers and low boilers to obtain 70.3 g of colorless and transparent epoxy-modified silicone with a yield of 94.1%.

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PUM

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Abstract

The invention relates to composition of a high performance organosilicon lens material for power type light-emitting diode (LED) packaging. The high performance organosilicon lens material is prepared by mixing raw materials such as organosilicon resin, epoxy modified organosilicon, a curing agent, a promoting agent and the like. The prepared material has high transmissivity and high refractive index in a wide wavelength range, and high high-temperature resistance, yellowing resistance and adhesion, and is suitable for packaging LED and devices thereof, solar cell array substrates, organic electroluminescence (EL) display elements, and serving as an optical lens, a plastic substrate for a liquid crystal display element, a substrate for a color filter, a touch tablet, a transparent panel, an optical element, an optical waveguide material and the like.

Description

technical field [0001] The invention belongs to the field of new materials, and in particular relates to an organic silicon lens material for power LED packaging and its composition. Background technique [0002] Silicone has high light transmittance, strong weather resistance, good temperature resistance, insulation, low stress and low moisture absorption, etc., and is widely used in construction, automobile, machinery, electronics, aerospace and other fields. Especially with the rapid development of the semiconductor lighting industry, it has attracted the attention of researchers as a new type of optical lens material or sealing material. Traditional optical materials for semiconductor sealing mostly use polymethyl methacrylate, polycarbonate, optical nylon and thermosetting epoxy resin, etc., all of which have good light transmission, mechanical properties and molding processability. However, during the lead-free reflow soldering process, these materials will experience...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08L83/05C08L83/07C08L83/08C08L83/06C08G77/04C08G77/38H01L33/56H01L33/58
Inventor 张保坦李茹陈修宁刘白玲王公应贾树勇王红丹何国锋
Owner CHANGZHOU INST OF CHEM
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