Machining method of target surface

A processing method and target material technology, which is applied in metal processing equipment, manufacturing tools, grinding machines, etc., can solve the problems of partial viscosity, inability to process the ratio of length and thickness, etc., and achieve thin stress layer, low target surface requirements, and high requirements low effect

Active Publication Date: 2012-08-15
GRIKIN ADVANCED MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] Therefore, according to the above situation, it is necessary to develop a kind of equipment and method suitable for preparing a kind of target material whose grinding and polishing force should not be too large, and which is suitable for processing a target with a large ratio of length to thickness and a thin thickness, so as to solve the problem that traditional processing methods cannot The problem of processing such targets with a large ratio of length to thickness, thinner thickness, and sticky properties, and the surface should not produce chemical reactions

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Two pieces of pure nickel target blanks with a diameter of 400 mm and a thickness of 3.3 mm were processed by a common lathe, and then continued to use the common lathe for surface processing and the equipment of the present invention for surface processing respectively.

[0035] When using an ordinary lathe for processing, the ordinary lathe uses a diamond knife with a speed of 250r / min and a feed rate of 0.1mm. Turning is performed from the outer circle to the center.

[0036] After processing, the nickel target is removed from the jaws of the lathe. It was found that due to the processing stress, the core and the outer diameter of the target protruded and deformed.

[0037] Using the method of the present invention to grind and polish the nickel target blank comprises the following steps:

[0038] 1) The surface of the processed target blank is rough machined by a lathe, and the surface roughness Ra after rough machining is 1.7 μm.

[0039] 2) The use of mechanica...

Embodiment 2

[0046] Two pure titanium target blanks with a length of 800 mm, a width of 100 mm, and a thickness of 8.4 mm rough-processed by a planer were respectively processed by a planer and the grinding and polishing equipment adopted in the present invention.

[0047] The pure titanium target blank processed by a planer has a roughness Ra of 5.5 μm.

[0048] A target with a large length-to-thickness ratio for surface processing using mechanical grinding and polishing equipment, including the following steps:

[0049] 1) The surface of the target material to be processed is rough machined by a planer, and the surface roughness Ra after rough machining is 5.5 μm.

[0050] 2) Use mechanical grinding and polishing equipment to adjust the opening width of the parallel rollers to 8mm;

[0051] 3) The parallel rollers of the mechanical grinding and polishing equipment are wrapped with water sandpaper abrasive belts, and the rotation of the rollers drives the abrasive belts and cloth to rota...

Embodiment 3

[0057] Two pure copper target blanks with a length of 100mm, a width of 100mm, and a thickness of 5.5mm. Use the planer and the grinding and polishing equipment adopted in the present invention to process respectively.

[0058] The pure copper target blank processed by a planer has a roughness Ra of 6.3 μm.

[0059] The target material for surface processing using mechanical grinding and polishing equipment includes the following steps:

[0060] 1) The surface roughness Ra of the copper target blank processed by the planer is 6.3 μm;

[0061] 2) Adjust the two parallel rollers of the mechanical grinding and polishing equipment, and the opening width is 5mm;

[0062] 3) The water sandpaper abrasive belt is wrapped on the parallel roller shaft, and the abrasive belt and cloth are driven to rotate through the rotation of the roller shaft, and the surface of the target is ground and polished. At the same time, deionized water is used for rinsing and lubrication. The rotational s...

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Abstract

The invention discloses a machining method of a target surface, which belongs to the technical field of the machining process of the target surface. The method utilizes mechanical grinding and polishing equipment to machine. The invention provides equipment conditions for machining a target. A parallel roller shaft with an adjustable opening width is used, and water sand paper or cloth with the granularity of 20-2000 meshes covers the roller shaft; the water sand paper which is from the rough to the fine is firstly utilized and then the cloth is used; and meanwhile, de-ionized water is used for lubricating to grind and polish a metal material. After the grinding and the polishing, the high-pressure de-ionized water is used for washing the surface. In the specific application, the metal material comprises one or more of nickel, copper, silver, titanium, aluminum and vanadium. The machining method has advantages of no requirements on the target surface, fast grinding and polishing speed, no need of using cutting liquid and lubricating liquid for mechanically machining, no chemical reaction on the surface, thin stress layer, high whole uniformity, and no deformation of the whole body. The machining method of the target surface is a simple, reliable, economical and efficient machining method which is adapted to the target with a large area, a great length and a large thickness ratio.

Description

technical field [0001] The invention belongs to the technical field of target surface processing methods, and relates to a target surface processing method. The method uses mechanical grinding and polishing equipment for surface processing, and the method can be used, for example, to prepare sputtering target materials (that is, physical vapor deposition targets materials, "physical vapor deposition" and "sputtering" are used interchangeably herein). In specific applications, the sputtering target material may include one or more of nickel, copper, silver, titanium, aluminum, and vanadium. The sputtering target material may hereinafter be referred to as "target material". Background technique [0002] Sputtered thin film materials are widely used in related industries such as electronic information, storage records, and displays. At the same time, with the development of these industries, the demand for sputtering targets is also increasing year by year. The quality of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B21/04
Inventor 朱晓光郭力山杨永刚何金江丁照崇王欣平吕保国江轩
Owner GRIKIN ADVANCED MATERIALS
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