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Method for preparing ternary polymerized thermoplastic polyimide resin powder

A polyimide resin and thermoplastic technology, applied in the field of preparation of ternary copolymerization thermoplastic polyimide resin powder, can solve the problems of complex process, poor toughness, low impact strength, etc., and achieve convenient preparation process and elongation at break The effect of increasing the rate and improving the toughness

Active Publication Date: 2012-09-19
CHANGZHOU SUNCHEM HIGH FORMANCE POLYMER +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the commonly used diamine monomer linked by four meta-benzene ring structures is 4,4'-bis(3-aminophenoxy)diphenyl sulfone (m-BAPS for short), but it has the following problems: ( 1) The process is complicated, and the polyamic acid solution can only be poured into water for precipitation, and then washed to remove the solvent, and then the polyimide resin powder can be obtained through cumbersome post-processing processes such as drying, crushing, screening, and drying; (2) m-BAPS contains strong polar and rigid sulfone groups, which leads to poor toughness of the final product (about 7% elongation at break) and low unnotched impact strength (50KJ / m 2 about)

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1)

[0018] The preparation method of the ternary copolymerization thermoplastic polyimide resin powder of the present embodiment has the following steps:

[0019] ①In a reactor equipped with a stirrer, condenser, heating and cooling device, and nitrogen protection device, add 194.62g of m-BAPS (0.45mol), 19.81g of m-BABP (0.05mol) and 1293g of DMAc, Stir to dissolve evenly. Then, 109.06 g of PMDA (0.5 mol) was added, stirred at ambient temperature (0° C. to 40° C.) to carry out polymerization reaction, and a polyamic acid solution was obtained.

[0020] ② After the rotational viscosity of the polyamic acid solution reaches 5000mPa·S (25°C), add 100g of triethylamine catalyst, 10g of pyridine catalyst and 200g of acetic anhydride dehydrating agent at the same time, stir and disperse rapidly for 3 hours, and precipitate a yellow solid, centrifuge After separation, the yellow solid was vacuum-dried at 160°C for 2 hours, and then imidized at 250°C for 2 hours to finally obtain 274.5g...

Embodiment 2)

[0023] The preparation method of this example is basically the same as that of Example 1, and the differences are shown in Table 1.

[0024] Table 1 also shows the test results of the molded plastic products obtained by thermoforming the prepared resin powder.

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PUM

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Abstract

The invention discloses a method for preparing ternary polymerized thermoplastic polyimide resin powder. The method includes the steps: firstly, adding 4,4'-bis(3-aminophenoxy) benzophenone and 4,4'-bis(3-aminophenoxy) diphenyl sulfone into aprotic polar solvent under the shielding of nitrogen, enabling the 4,4'-bis(3-aminophenoxy) benzophenone and 4,4'-bis(3-aminophenoxy) diphenyl sulfone to be completely dissolved, and slowly adding pyromellitic dianhydride to obtain polyamide acidic solution by means of polymerization reaction at the ambient temperature; and secondly, adding catalysts and dehydrating agent when viscosity of the polyamide acidic solution meets the requirement, stirring to dissolve out solid, centrifugally separating, subjecting the obtained solid to vacuum drying, and performing imidization to obtain the thermoplastic polyimide resin powder. The resin powder prepared by the method not only has low cost and heat resistance but also has high unnotched impact strength and high elongation at break.

Description

technical field [0001] The invention belongs to the field of macromolecular materials, and in particular relates to a preparation method of ternary copolymerization thermoplastic polyimide resin powder. Background technique [0002] Polyimide is known as a "problem-solving expert", but the difficulty in processing and molding and high manufacturing costs have always been two key factors restricting the rapid development of polyimide, a polymer material with excellent performance. Thermoplastic polyimide is a new material with a wide range of uses. Compared with traditional thermosetting polyimide resin, it shows absolute processing advantages and is the most ideal material to replace thermosetting polyimide. Thermoplastic polyimide can be processed by extrusion, injection molding, molding and other methods. In addition to being widely used in traditional military fields such as aerospace, weapons and ships, this kind of polyimide material also has broad application prospect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J3/12C08L79/08
Inventor 胡国宜吴建华吴方成戴美竹
Owner CHANGZHOU SUNCHEM HIGH FORMANCE POLYMER