Eutectic soldering equipment of LED wafer

Abstract

The invention discloses eutectic soldering equipment of an LED wafer. The eutectic soldering equipment comprises a heating device, a drive control system, a power configuration box body, a soldering working table, an eutectic soldering platform arranged in the middle of the front part of the soldering working table, a bracket supplying device and a wafer supplying device which are arranged in a manner of surrounding both sides and the rear part of the eutectic soldering platform respectively, a scaling powder supplying device arranged above the eutectic soldering platform, a nitrogen cooling device arranged on the eutectic soldering platform, a pulse current heating device arranged on one side of the eutectic soldering platform and a constant-temperature current heating device arranged inside the eutectic soldering platform. The eutectic soldering equipment has a high heating speed and high soldering precision, and enables the LED wafer after being soldered to have a better heat transfer effect.

Description

Technical field [0001] The invention relates to LED chip manufacturing technology, in particular to an LED chip eutectic welding equipment. Background technique [0002] Eutectic welding technology has a wide range of applications in the electronic packaging industry, such as the bonding of wafers and substrates, the bonding of substrates and packages, and package caps. Compared with traditional epoxy conductive adhesive bonding, eutectic welding has the advantages of high thermal conductivity, low thermal resistance, fast heat transfer, strong reliability, and high strength after bonding. It is suitable for high-frequency and high-power devices. The interconnection between the chip and the substrate, the substrate and the package. [0003] With the rapid development of LED technology, LED chips and packaging are becoming more and more high-power and integrated. The traditional silver glue bonding process has been difficult to meet the welding process requirements of LED chips. Th...

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Problems solved by technology

[0004] However, since the eutectic melting point of the LED chip is above 300°C, and the eutectic welding equipment of the LED chip in the prior art generally uses a hot air reflow furnace as a heating device, The heating speed of this heating device is slow, and the maximum temperature that can be reached by heating is relatively low.

In addition, there is also a scheme using infrared welding technology in the prior art. Although this scheme has the advantages of convenient control of the heat source and easy control of the heating temperature rise rate, it also has many disadvantages, such as more photosensitive points will be covered, and more Less unified heating, different components and PCB quality will affect the heating effect, large temperature difference, etc.

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