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Cleaning-free and residue-free scaling powder and preparation method thereof

A soldering flux, no residue technology, applied in the direction of welding equipment, welding medium, manufacturing tools, etc., can solve the problems that the surface of electronic components cannot be completely eliminated, residues left, low solid content, etc., to achieve good solderability, No cleaning process, strong activity effect

Active Publication Date: 2012-09-26
广东剑鑫科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, no-cleaning fluxes are mainly developed in the direction of low-residue no-cleaning. However, although the common no-cleaning fluxes on the market have low solid content, they cannot completely eliminate the residue left on the surface of electronic components after soldering.

Method used

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  • Cleaning-free and residue-free scaling powder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0085] The no-cleaning and residue-free soldering flux of the present invention consists of the following raw materials in percentage by weight:

[0086] Hydrogenated abietyl alcohol 0.2~2%

[0087] Adipic acid 0.1~1%

[0088] Malonic acid 0.1~1%

[0089] Glycolic acid 0.3~3%

[0090] Succinic acid 12~25%

[0091] Cyclohexylamine hydrobromide 0.05~2.5%

[0092] Nonylphenol polyoxyethylene ether 0.3~2.5%

[0093] Surfactant 0.1~1.5%

[0094] Triethylene glycol butyl ether 0.5~4%

[0095] Tetrahydrofurfuryl alcohol 0.2~3%

[0096] Anhydrous ethanol 60-80%.

[0097] Wherein, the surfactant is a nonionic or cationic fluorocarbon surfactant.

[0098] Specifically, the surfactant adopts a model of FT900 high-efficiency surfactant.

[0099] FT900 high-efficiency surfactant is produced by German OATEN (Ao Teng) company. The boiling point of this surfactant is 260 ° C. It is a colorless liquid and has no residue after welding. It can effectively increase the brightness of sol...

Embodiment 2

[0107] The no-cleaning residue-free soldering flux of this embodiment is composed of the following raw materials in weight percentage:

[0108] Hydrogenated abietyl alcohol 0.2~1.1%

[0109] Adipic acid 0.1~0.5%

[0110] Malonic acid 0.1~0.5%

[0111] Glycolic acid 0.3~1.5%

[0112] Succinic acid 15~22%

[0113] Cyclohexylamine hydrobromide 0.05~0.15%

[0114] Nonylphenol polyoxyethylene ether 0.5~2.5%

[0115] Surfactant 0.1~0.8%

[0116] Triethylene glycol butyl ether 1~3%

[0117] Tetrahydrofurfuryl alcohol 0.2~1.5%

[0118] Anhydrous ethanol 65-78%.

[0119] The preparation method is the same as in Example 1.

Embodiment 3

[0121] The no-cleaning and no-residue flux of this embodiment is based on Embodiment 2. The features not explained in this embodiment are explained in Embodiment 2. The difference between this embodiment and Embodiment 2 is:

[0122] No-clean flux, consisting of the following raw materials in weight percent:

[0123] Hydroabietyl Alcohol 0.5%

[0124] Adipic acid 0.3%

[0125] Malonic acid 0.3%

[0126] Glycolic Acid 1%

[0127] Succinic Acid 18%

[0128] Cyclohexylamine hydrobromide 0.15%

[0129] Nonylphenol ethoxylate 1%

[0130] FT900 high-efficiency surfactant 0.2%

[0131] Triisoglycol butyl ether 2%

[0132] Tetrahydroconol 1%

[0133] Absolute Ethanol 75.55%.

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Abstract

The invention relates to the technical field of scaling powder, and in particular relates to cleaning-free and residue-free scaling powder and a preparation method thereof. After the welding by virtue of the scaling powder provided by the invention, residual solids do not exist, and the surface of a welded object is more transparent and more clean and has no trace, and the problem in the prior art that the solid residue is difficult to clean is solved, and thus the cleaning procedure is omitted, the production cost is lowered obviously, and moreover, the cleaning-free and residue-free scaling powder has the advantage of good welding performance.

Description

technical field [0001] The invention relates to the technical field of flux, in particular to a no-cleaning and residue-free flux and a preparation method thereof. Background technique [0002] In the production process of electronic products, in order to ensure the smooth progress of the welding process during the assembly of electronic components, fluxes are usually used to remove the oxides on the surface of the solder and the product to be welded, so that the metal surface can achieve the necessary cleanliness, thereby improving the soldering process. performance. Therefore, the performance of the flux directly affects the quality of electronic products. [0003] In the prior art, flux is usually a mixture of rosin, resin, halide-containing active agent, additive and organic solvent. Although this type of flux has good solderability and low cost, it has high solid residue after welding. Its residues contain halogen ions, which will gradually cause problems such as elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
Inventor 邓剑明
Owner 广东剑鑫科技股份有限公司
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