Method for manufacturing high-frequency circuit board

Abstract

The invention discloses a method for manufacturing a high-frequency circuit board. After the high-frequency circuit board is manufactured, the following steps are carried out: cleaning the circuit board with 2-3% of H2SO4 solution, cleaning a polish plate section with 8-12% of silicate solution, removing chemical residue from the surface of the circuit board, and carrying out polishing-brushing nu using a soft polish brush; placing the polish-brushed circuit board in a braking room to bake and baking water in the circuit board to dry; manufacturing a silk printing screen plate by a screen mesh according to a client SMT file; mixing fine quartz sand powder with insulating epoxy resin adhesive and carrying out silk screen printing with the manufactured screen mesh and a manufactured screen plate; and after silk screen printing, baking the circuit board for a period in the baking room to form a solid isolation layer on the surface of the circuit board, thereby obtaining a finished product. The high-frequency circuit board is simple in structure, reasonable in design and low in manufacturing cost; so that the excellent moisture-proof performance of the circuit board is ensured; high temperature resistance and electric insulation are enhanced; and a micro short circuit phenomenon of the circuit board caused by metal ion migration faults is effectively avoided.

Description

technical field [0001] The invention relates to a manufacturing method of a high-frequency circuit board. Background technique [0002] Due to the development of high integrated circuit technology and microelectronics technology, the volume of electronic products is getting smaller and smaller, which makes the requirements for substrates carrying various circuits higher and higher. Traditional FR4 dielectric circuit boards are gradually being replaced by high-speed, high-reliability No matter the number of layers of high-frequency multi-layer boards and the aperture of through holes, or the wiring width and line spacing tend to be miniaturized, higher requirements are put forward for its manufacturing process. At this stage, the circuit The wire spacing of the board has been as small as 30um, and the interlayer thickness of the circuit board is only 40um, and there is a trend of further development towards finer and thinner layers, which puts forward higher requirements for ...

AI Technical Summary

Problems solved by technology

[0002] Due to the development of high integrated circuit technology and microelectronics technology, the volume of electronic products is getting smaller and smaller, which makes the requirements for substrates carrying various circuits higher and higher. Traditional FR4 dielectric circuit boards are gradually being replaced by high-speed, high-reliability No matter the number of layers of high-frequency multi-layer boards and the aperture of through holes, or the wiring width and line spacing tend to be miniaturized, higher requirements are put forward for its manufacturing process. At this stage, the circuit The wire spacing of the board has been as small as 30um, and the interlayer thickness of the circuit board is only 40um, and there is a trend of further development towards finer and thinner layers, which puts forward higher requirements for the reliability of the circuit board. Especially some potential factors, when the external conditions change, all indicators will deteriorate under long-term use and high humidit