High-conductivity graphene conducting resin and preparation method thereof
A high conductivity, graphene technology, applied in the field of materials, can solve problems such as easy agglomeration and affecting performance, and achieve the effects of simple preparation process, industrialization, good ductility and elasticity
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 The present invention also provides a method for preparing the high-conductivity graphene conductive adhesive described in any of the above-mentioned embodiments, comprising the steps of:
 Conductive agent premixing: mixing polymer monomers with graphene, or mixing polymer monomers, polymers and graphene, to obtain conductive adhesive prepolymers;
 Preparation of conductive adhesive: add an initiator to the prepolymer of the conductive adhesive, or use photoinitiation or thermal initiation to polymerize the polymer monomers to prepare the conductive adhesive.
 Alternatively, include the following steps:
 Conductive agent pre-mixing: add appropriate solvent to graphene and mix to make graphene infiltrated;
 Polymer premixing: add appropriate solvent to the polymer and mix to make the polymer swell;
 Preparation of conductive adhesive: mix the above conductive agent premix and polymer premix, add solvent and stir to prepar...
 Step 1, conductive agent premixing: take 140 g carboxyl mass content as 2% and epoxy group mass content as 5% graphene, 20 g conductive carbon black, in 600 g of N-methylpyrrolidone (N-methyl-2 -pyrrolidone, the abbreviation is NMP) solvent premixed, using ultrasonic mixing for 1 hour, the ultrasonic power is 200 W, so that graphene and conductive carbon black are infiltrated;
 Step 2, adhesive premixing: add 600g of NMP solvent to 40g of polyvinylidene fluoride (PVDF) and mix, and use ultrasonic mixing for 2 hours, the power of ultrasonic is 300 W, so that PVDF is swollen;
 Step 3, preparation of the conductive adhesive: the conductive agent premix was mixed with the adhesive premix, and 600 g of NMP solvent was added and stirred by mechanical stirring at 200 rpm for 8 hours to prepare the conductive adhesive.
 The present embodiment adopts the same raw material parameters and methods as in Example 1, except that the amount of graphene whose carboxyl content is 2% and epoxy group content is 5% is changed to 1980 g, and the amount of PVDF is changed to 160 g.
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