Soldering flux matched with high-melting-point solder and preparation method thereof

A flux, high melting point technology, used in welding media, manufacturing tools, welding equipment, etc., can solve problems such as easy holes

Active Publication Date: 2012-11-28
BEIJING UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the fluxes on the market are matching fluxes developed for lead-free or lead-containing solders with a soldering temperature of 260°C or below. Such fluxes are prone to defects such as holes when used for high-temperature soldering above 260°C , can not meet the welding requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Flux preparation: In a 1-liter round bottom flask, add 100g of domestic hydrogenated rosin, 20g of isopropanol and 20g of hexanediol, heat to reflux, and cool to below 40°C after the rosin is completely dissolved. Add 40g of hexanediol diethyl ester, 5gop-10, and 0.2g of BTA in sequence to the above rosin solution, and stir properly until a transparent solution is formed.

[0028] Soldering process: Apply the above-mentioned flux evenly on the surface of the high-lead solder sheet, assemble it with silver electrodes and ceramic capacitors plated with silver on the end surface, and keep it warm in a multi-temperature infrared welding furnace at 120°C under the protection of nitrogen 1 minute, 160℃ temperature zone for 5 minutes, 190℃ temperature zone for 1 minute, 220℃ temperature zone for 1 minute, 250℃ temperature zone for 1 minute, 290℃ temperature zone for 1 minute, 350℃ temperature zone for 1 minute , Welding of silver-plated ceramic capacitors with silver electrode...

Embodiment 2

[0032] Preparation of soldering flux: Add 100g of domestic disproportionated rosin and 30g of hexanediol into a 1-liter round bottom flask, heat to reflux, and cool to below 40°C after the rosin is completely dissolved. Add 40 g of diethyl succinate, 3 g of FT900, and 0.2 g of BTA in sequence to the above rosin solution, and stir properly until a transparent viscous solution is formed.

[0033] Soldering process: Apply the above-mentioned flux evenly on the surface of the high-lead solder sheet, assemble it with the silver electrode and the ceramic capacitor plated with silver on the end surface, place it in a resistance furnace preheated to 160°C, and in the air atmosphere, at 25 The heating rate of ℃ / min is raised to 260°C, and the temperature is kept for 3 minutes, and then the temperature is raised to 350°C at a heating rate of 40°C / min, and the temperature is kept for 1 minute, and the end surface of the silver-plated ceramic capacitor and the silver electrode are welded. ...

Embodiment 3

[0037] Preparation of soldering flux: In a 1-liter round bottom flask, add 100g of rosin (50g of domestic hydrogenated rosin and 50g of domestic disproportionated rosin), 30g of hexanediol, heat to reflux, and cool to below 40°C after the rosin is completely dissolved. Add 20 g of diethyl succinate and diethyl adipate, 5 g of TX-10, and 0.2 g of BTA in sequence to the above rosin solution, and stir properly until a transparent viscous solution is formed.

[0038] Soldering process: Apply the above-mentioned flux evenly on the surface of the high-lead solder sheet, assemble it with the silver electrode and the ceramic capacitor plated with silver on the end surface, place it in a resistance furnace preheated to 160°C, and in the air atmosphere, at 25 The heating rate of ℃ / min is raised to 260°C, and the temperature is kept for 3 minutes, and then the temperature is raised to 350°C at a heating rate of 40°C / min, and the temperature is kept for 1 minute, and the end surface of the...

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PUM

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Abstract

The invention discloses a soldering flux matched with a high-melting-point solder, and is characterized in that the soldering flux comprises an organic active agent, a surfactant, rosin, a corrosion inhibitor and an alcohol solvent, wherein according to the weight percentage, the organic active agent is 5-30%, the surfactant is 1-5%, the rosin is 30-60%, the corrosion inhibitor is 0.01-0.5%, and the balance is the alcohol solvent. The soldering flux, provided by the invention, has the advantages of high activity, good surface wetting property, no corrosion, moderate viscosity, easiness in cleaning and the like, the obtained welding point is statured in appearance, compact in interior and no hole vice; when the soldering flux is used, toxic harmful substances are not released, the environmental-friendly requirements can be satisfied, and residues obtained after welding can be clearly cleaned by regular cleaning liquid.

Description

technical field [0001] The invention relates to a flux and its preparation method, in particular to a flux used with high melting point solder and its preparation method. Background technique [0002] In the field of electronic packaging technology, high-temperature solder is required for multi-step soldering of internal integrated circuit packaging and electronic products. In order to ensure the stability and reliability of long-term work, high-temperature solder must also be used for packaged chips in electronic equipment used in high-temperature environments. The solidus temperature of high-temperature solder is generally higher than 260°C to ensure that the solder joints do not melt and deform under the condition of secondary reflow soldering at 250°C. [0003] The traditional flux uses rosin as the main component. Rosin is a weak organic acid with low activity, and it is prone to oxidation and polymerization reactions at high temperatures above 260°C, which affects the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K1/00
Inventor 杨晓军雷永平夏志东郭福桂迪陈德庆
Owner BEIJING UNIV OF TECH
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