Cleaning solution composition for electronic material

A technology of composition and cleaning solution, applied in the direction of detergent composition, non-surface active detergent composition, inorganic non-surface active cleaning composition, etc., which can solve the problem of insufficient removal of organic or inorganic particles

Active Publication Date: 2012-12-19
DONGWOO FINE CHEM CO LTD
View PDF6 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the cleaning solution is an acidic solution, it is not sufficient to remove very small organic or inorganic particles no larger than 1 μm in the initial cleaning stage

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cleaning solution composition for electronic material
  • Cleaning solution composition for electronic material
  • Cleaning solution composition for electronic material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~20 and comparative example 1~3

[0044] Examples 1-20 and Comparative Examples 1-3: Preparation of cleaning liquid composition

[0045] A cleaning liquid composition was prepared by mixing and stirring predetermined amounts of components shown in 1 in the following table.

[0046] Table 1

[0047]

[0048] A-1: Tetramethylammonium hydroxide (TMAH)

[0049] A-2: Tetraethylammonium hydroxide (TEAH)

[0050] A-3: Monoisopropylamine (MIPA)

[0051] A-4: Monoethanolamine (MEA)

[0052] B-1: N-Methylpyrrolidone (NMP)

[0053] B-2: 1,3-Dimethyl-2-imidazolinone (DMI)

[0054] C-1: 1-Hydroxyethylidene-1,1-diphosphonic acid

[0055] C-2: Aminotris(methylenephosphonic acid)

[0056] D-1: Polyacrylic acid-maleic acid copolymer (PAMA)

[0057] D-2: Polymethyl(meth)acrylate-maleic acid copolymer (PMAMA)

[0058] E-1: EMADOX-NB (purchased from LABEMA Co.)

[0059] E-2: EMADOX-D520 (purchased from LABEMA Co.)

[0060] F-1: 2,2'-[[[ethyl-1H-benzotriazol-1-yl]methyl]imino]diethanol

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
electrical resistivityaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to view more

Abstract

The present invention relates to a cleaning solution composition comprising, in terms of the total weight of the composition, 0.05 to 20 wt % of a basic compound, 0.1 to 40 wt % of a water-soluble polar organic solvent, 0.01 to 10 wt % of an organophosphorous compound, 0.01 to 10 wt % of a polycarboxylic-acid-based copolymer, 0.001 to 10 wt % of an alkanolamine salt, 0.001 to 10 wt % of an azole-based compound, with the remainder being water.

Description

technical field [0001] The present invention relates to a cleaning liquid composition for a substrate of a flat panel display (FPD), and the flat panel display includes a liquid crystal display, a plasma display, a flexible display and the like. This application claims the benefit of Korean Patent Application No. 10-2010-0046886 filed May 19, 2010, the entire contents of which are hereby incorporated by reference into this application. Background technique [0002] Like semiconductor devices, FPDs typically typified by liquid crystal displays are manufactured by film formation, exposure, line etching, and the like. During these steps, particles, such as various organic or inorganic materials, whose size is not larger than 1 μm, may themselves attach to the substrate surface, causing contamination of the substrate. If the substrate is subjected to subsequent steps with such contaminants attached thereto, there may be pinholes or pits of the film, and cutting or bridging of l...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C11D7/60
CPCC11D7/06C11D7/3281C11D3/3765C11D7/36C11D11/0047C11D7/3218
Inventor 房淳洪尹嚆重洪宪杓金炳默
Owner DONGWOO FINE CHEM CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products