Preparation method of epoxy resin hollow microsphere

Abstract

A preparation method of epoxy resin hollow microspheres belongs to the field of polymer material. The preparation method provided by the invention comprises the following steps: (a) preparation of water / epoxy emulsion: mixing epoxy resin monomers, triethylene tetramine, an emulsifier OP10 at 30-50 DEG C, and stirring while adding deionized water, so as to obtain a water / epoxy emulsion, wherein a mass ratio of epoxy resin monomer to triethylene tetramine to OP10 to deionized water equals to A: B: C: D, and A equals to 100, and B equals to 12.9, and C equals to 1-9, and D equals to 25-40; (b) dropwise adding the water / epoxy emulsion prepared in the step (a) at a stirring speed of 0.68-1.70 m / s into ethylene glycol of 30-70 DEG C; (c) heating the water / epoxy / ethylene glycol emulsion prepared in the step ( b ) to 100 DEG C for reaction for 1h; and (d) drying the water-containing epoxy resin microspheres prepared in the step (c) in vacuum. The epoxy resin microsphere prepared by the invention has high heat resistance, solvent resistance and mechanical strength.

Description

technical field [0001] The invention relates to a preparation method of epoxy resin hollow microspheres, belonging to the field of polymer compound materials. technical background [0002] Hollow microspheres are core-shell particles with a special structure whose core is air or other gases. Compared with other bulk materials, hollow microspheres have lower density and special mechanical, optical, electrical and other physical properties and applications. value. At present, the methods for preparing hollow microspheres mainly include template method, emulsion method, and self-assembly method. Organic polymer materials, inorganic materials, and polymer / inorganic composite materials can all be used to prepare hollow microspheres. [0003] Hollow structure polymer microspheres are referred to as hollow microspheres, which refer to the special structure microspheres with single-hole or porous structure inside the latex particles. Because of its special hollow structure, it ha...

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Problems solved by technology

The cured epoxy resin has good physical and chemical properties, good solvent resistance, low linear expansion rate, high mechanical strength, good thermal stability, good dielectric properties, surface leakage resistance, arc resistance, etc., and bulk epoxy Compared with resins, epoxy resin hollow microspheres have the advantages of low density and low dielectric constant, but there are no reports about epoxy resin hollow microspheres

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