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Heat-conduction binding material and preparation method thereof

A bonding material and inorganic heat conduction technology, applied in the direction of adhesives, adhesive types, fibrous fillers, etc., can solve the problems of mechanical properties of thermally conductive bonding materials that cannot meet the requirements, organic layer tearing, etc.

Inactive Publication Date: 2013-01-16
RESEARCH INSTITUTE OF TSINGHUA UNIVERSITY IN SHENZHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the inorganic heat-conducting particles increase to a certain extent, the thermally-conductive bonding material will tear the organic layer between the inorganic heat-conducting particles due to too many inorganic heat-conducting particles
However, the mechanical properties of thermally conductive adhesive materials in this state are far from meeting the requirements.

Method used

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  • Heat-conduction binding material and preparation method thereof

Examples

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preparation example Construction

[0054] like figure 1 The preparation method of the above-mentioned thermally conductive bonding material shown includes the following steps:

[0055] S10. According to the mass fraction, dissolve 0.3~1.5 parts of coupling agent in the alcohol-water mixture to prepare an alcohol aqueous solution with a concentration of 3mg / mL~15mg / mL, and mix 30~50 parts of inorganic heat-conducting particles according to the mass fraction Disperse in water to obtain a suspension with a concentration of 150mg / mL~300mg / mL, mix the alcohol aqueous solution and the suspension at 50°C~70°C for 1.5h~3h, take out and dry, and the coupling agent is adsorbed on the inorganic The surface of the heat-conducting particles is modified to obtain a modified inorganic heat-conducting material.

[0056] The alcohol-water mixture can be a mixture of alcohol and water with a volume ratio of 95:5-90:10.

[0057] Drying can be freeze drying or spray drying.

[0058] S20. According to the mass fraction, mix 100 ...

Embodiment 1

[0067] Prepare 1.5 parts of A172 into an alcohol aqueous solution (the volume of the alcohol-water mixture is 100mL, and the alcohol-water volume ratio is 90 / 10), stir and disperse at 300rpm for half an hour, and disperse 50 parts of inorganic heat-conducting particles in water to obtain a concentration of 200mg / mL of the suspension, mix the alcohol aqueous solution and the suspension at 60°C, take it out after 2 hours and spray dry, A172 is adsorbed on the surface of the inorganic heat-conducting particles to obtain a modified inorganic heat-conducting material. In this embodiment, the inorganic heat-conducting particles are 4 parts of Al 2 O 3 , 21 parts of AlN, 18 parts of Si 3 N 4 and 7 parts of thermally conductive graphite powder.

[0068] First heat 60 parts of E51 resin to 60°C, add 40 parts of CY179 resin under stirring, and mix and stir for 0.5h. Then add 25 parts of epoxy hexanediol diglycidyl ether, stir for another 0.5h, stir evenly at 1500rpm, add 50 parts o...

Embodiment 2

[0072] Prepare 0.3 parts of NDZ-401 into an alcohol aqueous solution (the volume of the alcohol-water mixture is 100mL, and the alcohol-water volume ratio is 90 / 10), stir and disperse at 300rpm for half an hour, and disperse 48 parts of inorganic heat-conducting particles in water to obtain the concentration It is a 150mg / mL suspension. Mix the alcohol aqueous solution and the suspension at 50°C, take it out after 2 hours and freeze-dry it. NDZ-401 is adsorbed on the surface of the inorganic heat-conducting particles to obtain a modified inorganic heat-conducting material. In this embodiment, the inorganic heat-conducting particles are 3 parts of Al 2 O 3 , 22 parts of AlN, 16 parts of Si 3 N 4 and 7 parts of thermally conductive graphite powder.

[0073] First heat 65 parts of E51 resin to 55°C, add 35 parts of CY179 resin under stirring, and mix and stir for 0.5h. Then add 25 parts of epoxy hexanediol diglycidyl ether, stir for another 0.5h, stir evenly at 1500rpm, then ...

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Abstract

The invention discloses a heat-conduction binding material. The heat-conduction binding material is formed by mixing components A and components B, wherein the components A include 100 parts of epoxy resin, 20-30 parts of reactive diluent, 30-50 parts of modified inorganic heat-conduction materials and 10-15 parts of organic solvent according to mass ratio and the modified inorganic heat-conduction materials are formed by coupling agents adsorbing on surfaces of inorganic heat-conduction particles. The components B include curing agents and organic solvents. The coupling agents are adsorbed on the inorganic heat-conduction particles to form the modified inorganic heat-conduction materials, so that compatibility of the inorganic particles in the organic resin can be improved, boundary defects and boundary stress between inorganic materials and organic materials after curing are reduced, organic layers among the inorganic heat-conduction particles can be reserved on the condition of adding a great quantity of modified inorganic heat-conduction materials, binding force of the heat-conduction binding material is improved, and accordingly, the heat-conduction binding material is better in mechanical performance. The invention further provides a preparation method of the heat-conduction binding material.

Description

technical field [0001] The invention relates to a thermally conductive adhesive material and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics and integrated circuits, electronic devices are constantly advancing in the direction of high frequency, high assembly density and small size. Especially in recent years, the demand for high-power electronic products is urgent, and heat dissipation has become a problem that affects the reliability and use of electronic devices. The key factor of life, the problem of heat dissipation has become an important obstacle to the miniaturization process of electronic components, and the performance of heat transfer and heat dissipation has become an important evaluation index for the level of packaging. At present, thermally conductive adhesive materials have become one of the necessary means to solve the problem of heat dissipation. Especially in the field of electronic packaging, insu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/04C09C1/46C09C3/12C09C3/08
Inventor 张维丽陈建军符冬菊檀满林李冬霜王晓伟杨建童刚
Owner RESEARCH INSTITUTE OF TSINGHUA UNIVERSITY IN SHENZHEN
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